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Class Information
Number: 257/747
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > With thermal expansion matching of contact or lead material to semiconductor active device
Description: Subject matter in which the electrical contact or lead material is chosen to have a coefficient of thermal expansion which closely matches that of the semiconductor active device material.

Sub-classes under this class:

Class Number Class Name Patents
257/748 Plural layers of specified contact or lead material 222

Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8704347 Packaged semiconductor chips Apr. 22, 2014
8492203 Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers Jul. 23, 2013
8373275 Fine pitch solder bump structure with built-in stress buffer Feb. 12, 2013
8283756 Electronic component with buffer layer Oct. 9, 2012
8222737 BGA semiconductor device having a dummy bump Jul. 17, 2012
8183681 Semiconductor device May. 22, 2012
8164186 BGA semiconductor device having a dummy bump Apr. 24, 2012
8154122 Semiconductor package and methods of manufacturing the semiconductor package Apr. 10, 2012
8089150 Structurally robust power switching assembly Jan. 3, 2012
8072084 Integrated circuit, circuit system, and method of manufacturing Dec. 6, 2011
8063393 Memory devices, stylus-shaped structures, electronic apparatuses, and methods for fabricating the same Nov. 22, 2011
8044504 Semiconductor device including an inner conductive layer which is cut out in the vicinity of a corner Oct. 25, 2011
8035127 Packaging substrate structure with a semiconductor chip embedded therein Oct. 11, 2011
8035202 Electronic device having a wiring substrate Oct. 11, 2011
8004001 Fabrication of semiconductor devices for light emission Aug. 23, 2011
7986214 Electrical assembly with PTC resistor elements Jul. 26, 2011
7888800 Dummy metal fill shapes for improved reliability of hybrid oxide/low-k dielectrics Feb. 15, 2011
7791199 Packaged semiconductor chips Sep. 7, 2010
7696617 Package for semiconductor devices Apr. 13, 2010
7692299 Semiconductor apparatus having improved thermal fatigue life Apr. 6, 2010
7585693 Method of forming a microelectronic package using control of die and substrate differential expansions and microelectronic package formed according to the method Sep. 8, 2009
7550845 Ball grid array package with separated stiffener layer Jun. 23, 2009
7538432 Temporary structure to reduce stress and warpage in a flip chip organic package May. 26, 2009
7518249 Electric component with a flip-chip construction Apr. 14, 2009
7432596 Apparatus and method for bonding silicon wafer to conductive substrate Oct. 7, 2008
7417315 Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging Aug. 26, 2008
7400040 Thermal interface apparatus, systems, and methods Jul. 15, 2008
7361993 Terminal pad structures and methods of fabricating same Apr. 22, 2008
7223992 Thermal conducting trench in a semiconductor structure May. 29, 2007
7205652 Electronic assembly including multiple substrates Apr. 17, 2007
7091619 Semiconductor device, semiconductor package, electronic device, electronic apparatus, and manufacturing methods of semiconductor device and electronic device Aug. 15, 2006
7084502 Microelectromechanical device and method for producing it Aug. 1, 2006
7067916 Extension of fatigue life for C4 solder ball to chip connection Jun. 27, 2006
7038322 Multi-chip module May. 2, 2006
7009253 Method and apparatus for preventing microcircuit thermo-mechanical damage during an ESD event Mar. 7, 2006
7005724 Semiconductor device and a method of manufacture therefor Feb. 28, 2006
6943391 Modification of carrier mobility in a semiconductor device Sep. 13, 2005
6943376 Electrode for p-type SiC Sep. 13, 2005
6921970 Package for electronic parts, lid thereof, material for the lid and method for producing the lid material Jul. 26, 2005
6922272 Method and apparatus for leveling thermal stress variations in multi-layer MEMS devices Jul. 26, 2005
6861750 Ball grid array package with multiple interposers Mar. 1, 2005
6849922 Organic electro-luminescent display device and method of fabricating the same Feb. 1, 2005
6841867 Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials Jan. 11, 2005
6818972 Reduction of chip carrier flexing during thermal cycling Nov. 16, 2004
6812569 Semiconductor device using bumps, method for fabricating same, and method for forming bumps Nov. 2, 2004
6798078 Power control device with semiconductor chips mounted on a substrate Sep. 28, 2004
6784535 Composite lid for land grid array (LGA) flip-chip package assembly Aug. 31, 2004
6777816 Multi-chip module Aug. 17, 2004
6737752 Flip-chip package containing a chip and a substrate having differing pitches for electrical connections May. 18, 2004
6734515 Semiconductor light receiving element May. 11, 2004

1 2 3 4

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