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Class Information
Number: 257/747
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > With thermal expansion matching of contact or lead material to semiconductor active device
Description: Subject matter in which the electrical contact or lead material is chosen to have a coefficient of thermal expansion which closely matches that of the semiconductor active device material.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7432596 |
Apparatus and method for bonding silicon wafer to conductive substrate |
Oct. 7, 2008 |
| 7417315 |
Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging |
Aug. 26, 2008 |
| 7400040 |
Thermal interface apparatus, systems, and methods |
Jul. 15, 2008 |
| 7361993 |
Terminal pad structures and methods of fabricating same |
Apr. 22, 2008 |
| 7223992 |
Thermal conducting trench in a semiconductor structure |
May. 29, 2007 |
| 7205652 |
Electronic assembly including multiple substrates |
Apr. 17, 2007 |
| 7091619 |
Semiconductor device, semiconductor package, electronic device, electronic apparatus, and manufacturing methods of semiconductor device and electronic device |
Aug. 15, 2006 |
| 7084502 |
Microelectromechanical device and method for producing it |
Aug. 1, 2006 |
| 7067916 |
Extension of fatigue life for C4 solder ball to chip connection |
Jun. 27, 2006 |
| 7038322 |
Multi-chip module |
May. 2, 2006 |
| 7009253 |
Method and apparatus for preventing microcircuit thermo-mechanical damage during an ESD event |
Mar. 7, 2006 |
| 7005724 |
Semiconductor device and a method of manufacture therefor |
Feb. 28, 2006 |
| 6943391 |
Modification of carrier mobility in a semiconductor device |
Sep. 13, 2005 |
| 6943376 |
Electrode for p-type SiC |
Sep. 13, 2005 |
| 6922272 |
Method and apparatus for leveling thermal stress variations in multi-layer MEMS devices |
Jul. 26, 2005 |
| 6921970 |
Package for electronic parts, lid thereof, material for the lid and method for producing the lid material |
Jul. 26, 2005 |
| 6861750 |
Ball grid array package with multiple interposers |
Mar. 1, 2005 |
| 6849922 |
Organic electro-luminescent display device and method of fabricating the same |
Feb. 1, 2005 |
| 6841867 |
Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials |
Jan. 11, 2005 |
| 6818972 |
Reduction of chip carrier flexing during thermal cycling |
Nov. 16, 2004 |
| 6812569 |
Semiconductor device using bumps, method for fabricating same, and method for forming bumps |
Nov. 2, 2004 |
| 6798078 |
Power control device with semiconductor chips mounted on a substrate |
Sep. 28, 2004 |
| 6784535 |
Composite lid for land grid array (LGA) flip-chip package assembly |
Aug. 31, 2004 |
| 6777816 |
Multi-chip module |
Aug. 17, 2004 |
| 6737752 |
Flip-chip package containing a chip and a substrate having differing pitches for electrical connections |
May. 18, 2004 |
| 6734515 |
Semiconductor light receiving element |
May. 11, 2004 |
| 6731004 |
Electronic device and method of producing same |
May. 4, 2004 |
| 6724093 |
Semiconductor devices and their manufacture |
Apr. 20, 2004 |
| 6696765 |
Multi-chip module |
Feb. 24, 2004 |
| 6664637 |
Flip chip C4 extension structure and process |
Dec. 16, 2003 |
| 6646350 |
Semiconductor device |
Nov. 11, 2003 |
| 6642604 |
Semiconductor device with resistor layer having heat radiation path to semiconductor substrate |
Nov. 4, 2003 |
| 6639321 |
Balanced coefficient of thermal expansion for flip chip ball grid array |
Oct. 28, 2003 |
| 6617690 |
Interconnect structures containing stress adjustment cap layer |
Sep. 9, 2003 |
| 6614105 |
Chip-type semiconductor device |
Sep. 2, 2003 |
| 6614111 |
Semiconductor device using bumps, method for fabricating same, and method for forming bumps |
Sep. 2, 2003 |
| 6614115 |
Enhancement of carrier concentration in As-containing layers |
Sep. 2, 2003 |
| 6570259 |
Apparatus to reduce thermal fatigue stress on flip chip solder connections |
May. 27, 2003 |
| 6551856 |
Method for forming copper pad redistribution and device formed |
Apr. 22, 2003 |
| 6525418 |
Semiconductor device |
Feb. 25, 2003 |
| 6525407 |
Integrated circuit package |
Feb. 25, 2003 |
| 6515347 |
Wafer level semiconductor device and method of manufacturing the same |
Feb. 4, 2003 |
| 6512304 |
Nickel-iron expansion contact for semiconductor die |
Jan. 28, 2003 |
| 6452256 |
Semiconductor device |
Sep. 17, 2002 |
| 6445062 |
Semiconductor device having a flip chip cavity with lower stress and method for forming same |
Sep. 3, 2002 |
| 6441493 |
Circuit board having interconnection ball lands and ball grid array (BGA) package using the circuit board |
Aug. 27, 2002 |
| 6433419 |
Face-up semiconductor chip assemblies |
Aug. 13, 2002 |
| 6399891 |
Multilayer boards |
Jun. 4, 2002 |
| 6380632 |
Center bond flip-chip semiconductor device and method of making it |
Apr. 30, 2002 |
| 6316832 |
Moldless semiconductor device and photovoltaic device module making use of the same |
Nov. 13, 2001 |
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