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Class Information
Number: 257/746
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Composite material (e.g., fibers or strands embedded in solid matrix)
Description: Subject matter in which the semiconductor contact material is formed as a composite of, for example, fibers or strands embedded in a solid matrix.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615776 |
Method of self-assembling electronic circuitry and circuits formed thereby |
Nov. 10, 2009 |
| 7612438 |
Active matrix substrate with height control member |
Nov. 3, 2009 |
| 7582964 |
Semiconductor package having non-ceramic based window frame |
Sep. 1, 2009 |
| 7550848 |
Semiconductor constructions comprising particle-containing materials |
Jun. 23, 2009 |
| 7535014 |
Integrally gated carbon nanotube field ionizer device and method of manufacture therefor |
May. 19, 2009 |
| 7485908 |
Insulated gate silicon nanowire transistor and method of manufacture |
Feb. 3, 2009 |
| 7456502 |
Wiring board with connection electrode formed in opening and semiconductor device using the same |
Nov. 25, 2008 |
| 7453157 |
Microelectronic packages and methods therefor |
Nov. 18, 2008 |
| 7439560 |
Semiconductor device using semiconductor nanowire and display apparatus and image pick-up apparatus using the same |
Oct. 21, 2008 |
| 7429795 |
Bond pad structure |
Sep. 30, 2008 |
| 7414313 |
Polymeric conductor donor and transfer method |
Aug. 19, 2008 |
| 7405419 |
Unidirectionally conductive materials for interconnection |
Jul. 29, 2008 |
| 7348670 |
Nanostructure, electronic device and method of manufacturing the same |
Mar. 25, 2008 |
| 7332810 |
Integrated circuit device and method of producing the same |
Feb. 19, 2008 |
| 7298046 |
Semiconductor package having non-ceramic based window frame |
Nov. 20, 2007 |
| 7247877 |
Integrated carbon nanotube sensors |
Jul. 24, 2007 |
| 7151313 |
Method of forming wirings for tile-shaped elements, structures of wirings for tile-shaped elements, and electronic equipment |
Dec. 19, 2006 |
| 7135728 |
Large-area nanoenabled macroelectronic substrates and uses therefor |
Nov. 14, 2006 |
| 7132677 |
Super bright light emitting diode of nanorod array structure having InGaN quantum well and method for manufacturing the same |
Nov. 7, 2006 |
| 7105428 |
Systems and methods for nanowire growth and harvesting |
Sep. 12, 2006 |
| 7084507 |
Integrated circuit device and method of producing the same |
Aug. 1, 2006 |
| 7064372 |
Large-area nanoenabled macroelectronic substrates and uses therefor |
Jun. 20, 2006 |
| 6992389 |
Barrier for interconnect and method |
Jan. 31, 2006 |
| 6987320 |
Pressure-welded semiconductor device |
Jan. 17, 2006 |
| 6973720 |
Method for manufacturing a connector integrated with a LED |
Dec. 13, 2005 |
| 6946675 |
Microelectronic components and electronic networks comprising DNA |
Sep. 20, 2005 |
| 6936912 |
Active matrix substrate with height control member |
Aug. 30, 2005 |
| 6909185 |
Composite material including copper and cuprous oxide and application thereof |
Jun. 21, 2005 |
| 6882051 |
Nanowires, nanostructures and devices fabricated therefrom |
Apr. 19, 2005 |
| 6875367 |
Attaching components to a printed circuit card |
Apr. 5, 2005 |
| 6825560 |
Solder filler |
Nov. 30, 2004 |
| 6818155 |
Attaching components to a printed circuit card |
Nov. 16, 2004 |
| 6818972 |
Reduction of chip carrier flexing during thermal cycling |
Nov. 16, 2004 |
| 6784543 |
External connection terminal and semiconductor device |
Aug. 31, 2004 |
| 6781156 |
Recombination center diffusion controlled by carbon concentration |
Aug. 24, 2004 |
| 6740972 |
Electronic device having fibrous interface |
May. 25, 2004 |
| 6727117 |
Semiconductor substrate having copper/diamond composite material and method of making same |
Apr. 27, 2004 |
| 6717191 |
Aluminum-beryllium alloys for air bridges |
Apr. 6, 2004 |
| 6693353 |
Semiconductor package and method for producing heat-radiating substrate for it |
Feb. 17, 2004 |
| 6657303 |
Integrated circuit with low solubility metal-conductor interconnect cap |
Dec. 2, 2003 |
| 6651736 |
Short carbon fiber enhanced thermal grease |
Nov. 25, 2003 |
| 6646344 |
Composite material, and manufacturing method and uses of same |
Nov. 11, 2003 |
| 6548898 |
External connection terminal and semiconductor device |
Apr. 15, 2003 |
| 6543524 |
Overplated thermally conductive part with EMI shielding |
Apr. 8, 2003 |
| 6545356 |
Graded layer for use in semiconductor circuits and method for making same |
Apr. 8, 2003 |
| 6528179 |
Reduction of chip carrier flexing during thermal cycling |
Mar. 4, 2003 |
| 6521998 |
Electrode structure for nitride III-V compound semiconductor devices |
Feb. 18, 2003 |
| 6509590 |
Aluminum-beryllium alloys for air bridges |
Jan. 21, 2003 |
| 6479897 |
Semiconductor device having fluorine-added carbon dielectric film and method of fabricating the same |
Nov. 12, 2002 |
| 6444496 |
Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof |
Sep. 3, 2002 |
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