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Class Information
Number: 257/741
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum
Description: Subject matter wherein the contact or lead is made of a specified material other than an aluminum alloy.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7449782 |
Self-aligned metal to form contacts to Ge containing substrates and structure formed thereby |
Nov. 11, 2008 |
| 7420227 |
Cu-metalized compound semiconductor device |
Sep. 2, 2008 |
| 7414313 |
Polymeric conductor donor and transfer method |
Aug. 19, 2008 |
| 7411298 |
Source/drain electrodes, thin-film transistor substrates, manufacture methods thereof, and display devices |
Aug. 12, 2008 |
| 7411259 |
Wiring material and a semiconductor device having a wiring using the material, and the manufacturing method thereof |
Aug. 12, 2008 |
| 7411223 |
Compound electrodes for electronic devices |
Aug. 12, 2008 |
| 7385287 |
Preventing damage to low-k materials during resist stripping |
Jun. 10, 2008 |
| 7382050 |
Semiconductor device and method for producing the same |
Jun. 3, 2008 |
| 7332810 |
Integrated circuit device and method of producing the same |
Feb. 19, 2008 |
| 7327031 |
Semiconductor device and method of manufacturing the same |
Feb. 5, 2008 |
| 7291558 |
Copper interconnect wiring and method of forming thereof |
Nov. 6, 2007 |
| 7285842 |
Siloxane epoxy polymers as metal diffusion barriers to reduce electromigration |
Oct. 23, 2007 |
| 7265450 |
Semiconductor device and method for fabricating the same |
Sep. 4, 2007 |
| 7244635 |
Semiconductor device and method of manufacturing the same |
Jul. 17, 2007 |
| 7243424 |
Production method for a multilayer ceramic substrate |
Jul. 17, 2007 |
| 7242034 |
Method for fabricating a component having an electrical contact region, and component having an electrical contact region |
Jul. 10, 2007 |
| 7233068 |
Filling small dimension vias using supercritical carbon dioxide |
Jun. 19, 2007 |
| 7190075 |
Method of forming smooth polycrystalline silicon electrodes for molecular electronic devices |
Mar. 13, 2007 |
| 7181831 |
Method of manufacturing strain sensor |
Feb. 27, 2007 |
| 7166921 |
Aluminum alloy film for wiring and sputter target material for forming the film |
Jan. 23, 2007 |
| 7161246 |
Interconnect alloys and methods and apparatus using same |
Jan. 9, 2007 |
| 7160820 |
Method of preparing oxide crystal film/substrate composite and solution for use therein |
Jan. 9, 2007 |
| 7161247 |
Polishing composition for noble metals |
Jan. 9, 2007 |
| 7154180 |
Electronic device, method of manufacture of the same, and sputtering target |
Dec. 26, 2006 |
| 7151313 |
Method of forming wirings for tile-shaped elements, structures of wirings for tile-shaped elements, and electronic equipment |
Dec. 19, 2006 |
| 7135776 |
Semiconductor device and method for manufacturing same |
Nov. 14, 2006 |
| 7115991 |
Method for creating barriers for copper diffusion |
Oct. 3, 2006 |
| 7084501 |
Interconnecting component |
Aug. 1, 2006 |
| 7081676 |
Structure for controlling the interface roughness of cobalt disilicide |
Jul. 25, 2006 |
| 7078820 |
Semiconductor apparatus and process of production thereof |
Jul. 18, 2006 |
| 7069641 |
Method for preparing composite materials of a positive temperature coefficient thermistor |
Jul. 4, 2006 |
| 7052922 |
Stable electroless fine pitch interconnect plating |
May. 30, 2006 |
| 7030451 |
Method and apparatus for performing nickel salicidation |
Apr. 18, 2006 |
| 7026716 |
Self-assembled sub-nanolayers as interfacial adhesion enhancers and diffusion barriers |
Apr. 11, 2006 |
| 7023030 |
MISFET |
Apr. 4, 2006 |
| 7009298 |
Low-resistance contact to silicon having a titanium silicide interface and an amorphous titanium carbonitride barrier layer |
Mar. 7, 2006 |
| 6993828 |
Method for manufacturing metal thin film resistor |
Feb. 7, 2006 |
| 6992324 |
Organic semiconductor device |
Jan. 31, 2006 |
| 6991854 |
Gold alloy bonding wire for semiconductor device |
Jan. 31, 2006 |
| 6989608 |
Method and apparatus to eliminate galvanic corrosion on copper doped aluminum bond pads on integrated circuits |
Jan. 24, 2006 |
| 6984875 |
Semiconductor device with improved reliability and manufacturing method of the same |
Jan. 10, 2006 |
| 6979889 |
Plastic lead frames for semiconductor devices |
Dec. 27, 2005 |
| 6977437 |
Method for forming a void free via |
Dec. 20, 2005 |
| 6975031 |
Semiconductor device and chip carrier |
Dec. 13, 2005 |
| 6946735 |
Side-wall barrier structure and method of fabrication |
Sep. 20, 2005 |
| 6940094 |
Electronic device and method for manufacturing the same |
Sep. 6, 2005 |
| 6940173 |
Interconnect structures incorporating low-k dielectric barrier films |
Sep. 6, 2005 |
| 6930391 |
Method for alloy-electroplating group IB metals with refractory metals for interconnections |
Aug. 16, 2005 |
| 6921970 |
Package for electronic parts, lid thereof, material for the lid and method for producing the lid material |
Jul. 26, 2005 |
| 6903365 |
Electronic device using carbon element linear structure and production method thereof |
Jun. 7, 2005 |
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