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Class Information
Number: 257/741
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum
Description: Subject matter wherein the contact or lead is made of a specified material other than an aluminum alloy.

Sub-classes under this class:

Class Number Class Name Patents
257/771 Alloy containing aluminum 283
257/749 At least portion of which is transparent to ultraviolet, visible or infrared light 158
257/746 Composite material (e.g., fibers or strands embedded in solid matrix) 190
257/744 For compound semiconductor material 179
257/750 Layered 1,317
257/768 Refractory or platinum group metal or alloy or silicide thereof 411
257/767 Resistive to electromigration or diffusion of the contact or lead material 473
257/772 Solder composition 462
257/742 With a semiconductor conductivity substitution type dopant (e.g., germanium in the case of a gallium arsenide semiconductor) in a contact metal) 78
257/747 With thermal expansion matching of contact or lead material to semiconductor active device 164

Patents under this class:
1 2 3 4 5 6 7 8 9

Patent Number Title Of Patent Date Issued
8710679 Electrode structure and its manufacturing method, and semiconductor module Apr. 29, 2014
8710591 Semiconductor chip, stack module, and memory card Apr. 29, 2014
8691688 Method of manufacturing semiconductor structure Apr. 8, 2014
8692284 Interposer and manufacturing method thereof Apr. 8, 2014
8692372 Semiconductor device having impurity doped polycrystalline layer including impurity diffusion prevention layer and dynamic random memory device including the semiconductor device Apr. 8, 2014
8692376 Semiconductor device and method of manufacturing the same Apr. 8, 2014
8680682 Barrier for through-silicon via Mar. 25, 2014
8680686 Method and system for thin multi chip stack package with film on wire and copper wire Mar. 25, 2014
8680677 Carbon nanotube-based conductive connections for integrated circuit devices Mar. 25, 2014
8673773 Method for producing a nanoporous layer Mar. 18, 2014
8643185 Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint material Feb. 4, 2014
8629562 Techniques for modular chip fabrication Jan. 14, 2014
8629561 Air gap-containing interconnect structure having photo-patternable low k material Jan. 14, 2014
8629559 Stress reduction apparatus with an inverted cup-shaped layer Jan. 14, 2014
8617967 Vertically oriented nanostructure and fabricating method thereof Dec. 31, 2013
8618531 Transparent conductors comprising metal nanowires Dec. 31, 2013
8618660 Integrated circuit device Dec. 31, 2013
8598458 Electronic device and method of manufacturing the same Dec. 3, 2013
8598705 Composite substrate for a semiconductor chip Dec. 3, 2013
8592979 Semiconductor device conductive pattern structures and methods of manufacturing the same Nov. 26, 2013
8575751 Conductive bump, method for producing the same, and electronic component mounted structure Nov. 5, 2013
8575750 Semiconductor detector element configuration for very high efficiency gamma-ray detection Nov. 5, 2013
8564102 Semiconductor device having through silicon via (TSV) Oct. 22, 2013
8564129 Low resistivity contact Oct. 22, 2013
8558381 Semiconductor device Oct. 15, 2013
8552558 Conductive compositions and processes for use in the manufacture of semiconductor devices Oct. 8, 2013
8518303 Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device Aug. 27, 2013
8513804 Nanotube-based electrodes Aug. 20, 2013
8497578 Terminal face contact structure and method of making same Jul. 30, 2013
8497420 Thick-film pastes containing lead- and tellurium-oxides, and their use in the manufacture of semiconductor devices Jul. 30, 2013
8487424 Routable array metal integrated circuit package fabricated using partial etching process Jul. 16, 2013
8487436 Semiconductor device, electronic device, and method of manufacturing semiconductor device Jul. 16, 2013
8487439 Laminated and sintered ceramic circuit board, and semiconductor package including the circuit board Jul. 16, 2013
8482089 Conductive compositions and processes for use in the manufacture of semiconductor devices--organic medium components Jul. 9, 2013
8476763 Semiconductor device conductive pattern structures including dummy conductive patterns Jul. 2, 2013
8471155 Metal plugged substrates with no adhesive between metal and polyimide Jun. 25, 2013
8461681 Layered structure for corrosion resistant interconnect contacts Jun. 11, 2013
8461036 Multiple surface finishes for microelectronic package substrates Jun. 11, 2013
8455304 Routable array metal integrated circuit package fabricated using partial etching process Jun. 4, 2013
8450204 Structure and process for metallization in high aspect ratio features May. 28, 2013
8431484 Stable electroless fine pitch interconnect plating Apr. 30, 2013
8432024 Integrated circuit including bond wire directly bonded to pad Apr. 30, 2013
8421227 Semiconductor chip structure Apr. 16, 2013
8421246 Joint structure and electronic component Apr. 16, 2013
8415797 Gold wire for semiconductor element connection Apr. 9, 2013
8395257 Electronic module and method for producing an electric functional layer on a substrate by blowing powder particles of an electrically conductive material Mar. 12, 2013
8395262 Semiconductor device and method for manufacturing the same Mar. 12, 2013
8390125 Through-silicon via formed with a post passivation interconnect structure Mar. 5, 2013
8384205 Electronic device package and method of manufacture Feb. 26, 2013
8384217 Increasing reliability of copper-based metallization structures in a microstructure device by using aluminum nitride Feb. 26, 2013

1 2 3 4 5 6 7 8 9

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