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Class Information
Number: 257/739
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > With textured surface
Description: Subject matter wherein the surface of the contact or lead is rough or has a characteristic of a closely interwoven fabric, rather than being smooth.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7405418 |
Memory device electrode with a surface structure |
Jul. 29, 2008 |
| 7391120 |
Increasing the adhesion of an adhesive connection in housings |
Jun. 24, 2008 |
| 7358607 |
Substrates and systems to minimize signal path discontinuities |
Apr. 15, 2008 |
| 7329934 |
Smooth metal semiconductor surface and method for making the same |
Feb. 12, 2008 |
| 7314817 |
Microelectronic device interconnects |
Jan. 1, 2008 |
| 7285856 |
Package for semiconductor devices |
Oct. 23, 2007 |
| 7279792 |
Semiconductor device and method of manufacturing same |
Oct. 9, 2007 |
| 7276793 |
Semiconductor device and semiconductor module |
Oct. 2, 2007 |
| 7274102 |
Contacting device, testing method and corresponding production method |
Sep. 25, 2007 |
| 7245014 |
Semiconductor light emitting apparatus and method for producing the same |
Jul. 17, 2007 |
| 7233067 |
Manufacturing a bump electrode with roughened face |
Jun. 19, 2007 |
| 7208964 |
Probe card |
Apr. 24, 2007 |
| 7205652 |
Electronic assembly including multiple substrates |
Apr. 17, 2007 |
| 7190073 |
Circuit film with bump, film package using the same, and related fabrication methods |
Mar. 13, 2007 |
| 7173336 |
Hybrid integrated circuit device |
Feb. 6, 2007 |
| 7170187 |
Low stress conductive polymer bump |
Jan. 30, 2007 |
| 7170172 |
Semiconductor device having a roughened surface |
Jan. 30, 2007 |
| 7129579 |
Semiconductor apparatus and method for fabricating the same |
Oct. 31, 2006 |
| 7115991 |
Method for creating barriers for copper diffusion |
Oct. 3, 2006 |
| 7088006 |
Integrated circuit arrangement |
Aug. 8, 2006 |
| 7088008 |
Electronic package with optimized circuitization pattern |
Aug. 8, 2006 |
| 7078809 |
Chemical leadframe roughening process and resulting leadframe and integrated circuit package |
Jul. 18, 2006 |
| 7015580 |
Roughened bonding pad and bonding wire surfaces for low pressure wire bonding |
Mar. 21, 2006 |
| 6992388 |
Formation of micro rough polysurface for low sheet resistant salicided sub-quarter micron polylines |
Jan. 31, 2006 |
| 6924553 |
Semiconductor chip and wiring board with bumps formed on pads/land and on passivation/insulation film and manufacturing method of the same |
Aug. 2, 2005 |
| 6909184 |
TAB type semiconductor device |
Jun. 21, 2005 |
| 6888158 |
Bare chip carrier and method for manufacturing semiconductor device using the bare chip carrier |
May. 3, 2005 |
| 6880244 |
Circuit board having simultaneously and unitarily formed wiring patterns and protrusions |
Apr. 19, 2005 |
| 6879050 |
Packaged microelectronic devices and methods for packaging microelectronic devices |
Apr. 12, 2005 |
| 6872651 |
Manufacturing a bump electrode with roughened face |
Mar. 29, 2005 |
| 6864576 |
Large line conductive pads for interconnection of stackable circuitry |
Mar. 8, 2005 |
| 6861750 |
Ball grid array package with multiple interposers |
Mar. 1, 2005 |
| 6847117 |
Semiconductor device including a passivation film to cover directly an interface of a bump and an intermediated layer |
Jan. 25, 2005 |
| 6828678 |
Semiconductor topography with a fill material arranged within a plurality of valleys associated with the surface roughness of the metal layer |
Dec. 7, 2004 |
| 6774499 |
Non-leaded semiconductor package and method of fabricating the same |
Aug. 10, 2004 |
| 6756671 |
Microelectronic device with a redistribution layer having a step shaped portion and method of making the same |
Jun. 29, 2004 |
| 6747352 |
Integrated circuit having multiple power/ground connections to a single external terminal |
Jun. 8, 2004 |
| 6744122 |
Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
Jun. 1, 2004 |
| 6700198 |
Resin for semiconductor wire |
Mar. 2, 2004 |
| 6691406 |
Methods of die attachment for BOC and F/C surface mount |
Feb. 17, 2004 |
| 6680536 |
Probe unit having resilient metal leads |
Jan. 20, 2004 |
| 6670706 |
Semiconductor device including a semiconductor pellet having bump electrodes connected to pad electrodes of an interconnect board and method for manufacturing same |
Dec. 30, 2003 |
| 6670708 |
Thin film transistor array panel and method for fabricating the same |
Dec. 30, 2003 |
| 6627994 |
Semiconductor device and film carrier tape |
Sep. 30, 2003 |
| 6590293 |
Electronic component, having projection electrodes and methods for manufacturing thereof |
Jul. 8, 2003 |
| 6577002 |
180 degree bump placement layout for an integrated circuit power grid |
Jun. 10, 2003 |
| 6552436 |
Semiconductor device having a ball grid array and method therefor |
Apr. 22, 2003 |
| 6541352 |
Semiconductor die with contoured bottom surface and method for making same |
Apr. 1, 2003 |
| 6538898 |
Method and apparatus of die attachment for BOC and F/C surface mount |
Mar. 25, 2003 |
| 6486565 |
Semiconductor device |
Nov. 26, 2002 |
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