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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Physics
Class Information
Number: 257/738
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Bump leads > Ball shaped
Description: Subject matter wherein the bump contacts have the spherical shape of a ball.


Patents under this class:

Patent Number Title Of Patent Date Issued
7459785 Electrical interconnection structure formation Dec. 2, 2008
7459773 Stackable ball grid array Dec. 2, 2008
7456502 Wiring board with connection electrode formed in opening and semiconductor device using the same Nov. 25, 2008
7456496 Package design and method of manufacture for chip grid array Nov. 25, 2008
7456493 Structure for mounting semiconductor part in which bump and land portion are hardly detached from each other and method of manufacturing mounting substrate used therein Nov. 25, 2008
7454300 Extracting high frequency impedance in a circuit design using broadband representations Nov. 18, 2008
7453155 Method for fabricating a flip chip package Nov. 18, 2008
7453140 Semiconductor chip assembly with laterally aligned filler and insulative base Nov. 18, 2008
7449785 Solder bump on a semiconductor substrate Nov. 11, 2008
7449364 Device and method for including passive components in a chip scale package Nov. 11, 2008
7446414 Semiconductor device Nov. 4, 2008
7443041 Packaging of a microchip device Oct. 28, 2008
7443040 Aluminum cap with electroless nickel/immersion gold Oct. 28, 2008
7443038 Flip-chip image sensor packages Oct. 28, 2008
7436063 Packaging substrate and semiconductor device Oct. 14, 2008
7432595 System and method to reduce metal series resistance of bumped chip Oct. 7, 2008
7432585 Semiconductor device electronic component, circuit board, and electronic device Oct. 7, 2008
7432188 Structure of bumps forming on an under metallurgy layer and method for making the same Oct. 7, 2008
7429797 Electronic device and carrier substrate Sep. 30, 2008
7429793 Semiconductor device having an electronic circuit disposed therein Sep. 30, 2008
7429704 Electronic component, electro-optical device, and electronic apparatus Sep. 30, 2008
7427812 Semiconductor device with increased number of external connection electrodes Sep. 23, 2008
7425759 Semiconductor chip assembly with bumped terminal and filler Sep. 16, 2008
7420280 Reduced stress under bump metallization structure Sep. 2, 2008
7417326 Semiconductor device and manufacturing method of the same Aug. 26, 2008
7411297 Microfeature devices and methods for manufacturing microfeature devices Aug. 12, 2008
7407878 Method of providing solder bumps on a substrate using localized heating Aug. 5, 2008
7407877 Self-coplanarity bumping shape for flip-chip Aug. 5, 2008
7405479 Wired circuit board Jul. 29, 2008
7402908 Intermediate semiconductor device structures Jul. 22, 2008
7400035 Semiconductor device having multilayer printed wiring board Jul. 15, 2008
7393719 Increased stand-off height integrated circuit assemblies, systems, and methods Jul. 1, 2008
7391113 Semiconductor device Jun. 24, 2008
7391112 Capping copper bumps Jun. 24, 2008
7391110 Apparatus for providing capacitive decoupling between on-die power and ground conductors Jun. 24, 2008
7391106 Stack type package Jun. 24, 2008
7388293 Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions Jun. 17, 2008
7388288 Flip chip metallization method and devices Jun. 17, 2008
7388281 Encapsulated electronic component and production method Jun. 17, 2008
7388277 Chip and wafer integration process using vertical connections Jun. 17, 2008
7387910 Method of bonding solder pads of flip-chip package Jun. 17, 2008
7382060 Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts Jun. 3, 2008
7382057 Surface structure of flip chip substrate Jun. 3, 2008
7378745 Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns May. 27, 2008
7378736 Ball grid array structures having tape-based circuitry May. 27, 2008
7378735 High performance sub-system design and assembly May. 27, 2008
7378734 Stacked contact bump May. 27, 2008
7378616 Heating apparatus and method for semiconductor devices May. 27, 2008
7378297 Methods of bonding two semiconductor devices May. 27, 2008
7375431 Solder bump formation in electronics packaging May. 20, 2008



 
 
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