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Browse by Category: Main > Physics
Class Information
Number: 257/738
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Bump leads > Ball shaped
Description: Subject matter wherein the bump contacts have the spherical shape of a ball.










Patents under this class:

Patent Number Title Of Patent Date Issued
8710681 Isolation rings for blocking the interface between package components and the respective molding compound Apr. 29, 2014
8710671 Multi-level integrated circuit, device and method for modeling multi-level integrated circuits Apr. 29, 2014
8710658 Under bump passive components in wafer level packaging Apr. 29, 2014
8710657 Semiconductor assembly and semiconductor package including a solder channel Apr. 29, 2014
8710656 Redistribution layer (RDL) with variable offset bumps Apr. 29, 2014
8710655 Die packages and systems having the die packages Apr. 29, 2014
8710653 Chip on chip semiconductor device including an underfill layer having a resin containing an amine-based curing agent Apr. 29, 2014
8709935 Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties Apr. 29, 2014
8709934 Electronic system with vertical intermetallic compound Apr. 29, 2014
8704383 Silicon-based thin substrate and packaging schemes Apr. 22, 2014
8704377 Compliant conductive nano-particle electrical interconnect Apr. 22, 2014
8704371 Semiconductor device having multiple bump heights and multiple bump diameters Apr. 22, 2014
8704370 Semiconductor package structure having an air gap and method for forming Apr. 22, 2014
8704350 Stacked wafer level package and method of manufacturing the same Apr. 22, 2014
8703599 Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts Apr. 22, 2014
8693203 Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices Apr. 8, 2014
8692370 Semiconductor device with copper wire ball-bonded to electrode pad including buffer layer Apr. 8, 2014
8686560 Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress Apr. 1, 2014
8680675 Structures and methods for improving solder bump connections in semiconductor devices Mar. 25, 2014
8680663 Methods and apparatus for package on package devices with reduced strain Mar. 25, 2014
8674511 Method of forming a semiconductor device with a contact pad on a sloped silicon dioxide surface Mar. 18, 2014
8674506 Structures and methods to reduce maximum current density in a solder ball Mar. 18, 2014
8674505 Integrated circuit packaging with ball grid array having differential pitch to enhance thermal performance Mar. 18, 2014
8674503 Circuit board, fabricating method thereof and package structure Mar. 18, 2014
8674232 Device-embedded flexible printed circuit board and manufacturing method thereof Mar. 18, 2014
8664773 Mounting structure of semiconductor package component and manufacturing method therefor Mar. 4, 2014
8664768 Interposer having a defined through via pattern Mar. 4, 2014
8664762 Semiconductor package, electrical and electronic apparatus including the semiconductor package, and method of manufacturing the semiconductor package Mar. 4, 2014
8664760 Connector design for packaging integrated circuits Mar. 4, 2014
8664750 Semiconductor substrate, package and device Mar. 4, 2014
8664666 Semiconductor device and process for fabricating the same Mar. 4, 2014
8664090 Electronic component package fabrication method Mar. 4, 2014
8659172 Semiconductor device and method of confining conductive bump material with solder mask patch Feb. 25, 2014
8659170 Semiconductor device having conductive pads and a method of manufacturing the same Feb. 25, 2014
8659161 Chip package with reinforced positive alignment features Feb. 25, 2014
8659155 Mechanisms for forming copper pillar bumps Feb. 25, 2014
8659154 Semiconductor device including adhesive covered element Feb. 25, 2014
8659145 Semiconductor device Feb. 25, 2014
8659138 Semiconductor package having electrode on side surface, and semiconductor device Feb. 25, 2014
8659123 Metal pad structures in dies Feb. 25, 2014
8658528 Bumping process and structure thereof Feb. 25, 2014
8653674 Electronic component package fabrication method and structure Feb. 18, 2014
8653668 Copper bonding wire for semiconductor device and bonding structure thereof Feb. 18, 2014
8653662 Structure for monitoring stress induced failures in interlevel dielectric layers of solder bump integrated circuits Feb. 18, 2014
8653661 Package having MEMS element and fabrication method thereof Feb. 18, 2014
8653658 Planarized bumps for underfill control Feb. 18, 2014
8648463 Assembly of multi-chip modules with proximity connectors using reflowable features Feb. 11, 2014
8648341 Methods and apparatus for testing pads on wafers Feb. 11, 2014
8648261 Printed circuit board Feb. 11, 2014
8647978 Use of graphene to limit copper surface oxidation, diffusion and electromigration in interconnect structures Feb. 11, 2014











 
 
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