| |
 |
|
Class Information
Number: 257/738
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Bump leads > Ball shaped
Description: Subject matter wherein the bump contacts have the spherical shape of a ball.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615864 |
Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus |
Nov. 10, 2009 |
| 7615842 |
Inductor integrated chip |
Nov. 10, 2009 |
| 7612450 |
Semiconductor package including dummy board and method of fabricating the same |
Nov. 3, 2009 |
| 7612449 |
Optimized power delivery to high speed, high pin-count devices |
Nov. 3, 2009 |
| 7612444 |
Semiconductor package with flow controller |
Nov. 3, 2009 |
| 7608922 |
Semiconductor device including amplifier and frequency converter |
Oct. 27, 2009 |
| 7608921 |
Multi-layer semiconductor package |
Oct. 27, 2009 |
| 7608911 |
Semiconductor device package having a semiconductor element with a roughened surface |
Oct. 27, 2009 |
| 7605459 |
Coreless substrate and manufacturing thereof |
Oct. 20, 2009 |
| 7603769 |
Method of coupling a surface mount device |
Oct. 20, 2009 |
| 7602062 |
Package substrate with dual material build-up layers |
Oct. 13, 2009 |
| 7602060 |
Heat spreader in a flip chip package |
Oct. 13, 2009 |
| 7598621 |
Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths |
Oct. 6, 2009 |
| 7598617 |
Stack package utilizing through vias and re-distribution lines |
Oct. 6, 2009 |
| 7598613 |
Flip chip bonding structure |
Oct. 6, 2009 |
| 7595268 |
Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the same |
Sep. 29, 2009 |
| 7592244 |
Semiconductor device and method of manufacturing the same |
Sep. 22, 2009 |
| 7589426 |
Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom |
Sep. 15, 2009 |
| 7586187 |
Interconnect structure with stress buffering ability and the manufacturing method thereof |
Sep. 8, 2009 |
| 7582972 |
Semiconductor device and fabrication method thereof |
Sep. 1, 2009 |
| 7582968 |
Wiring board with a protective film greater in heights than bumps |
Sep. 1, 2009 |
| 7582967 |
Semiconductor device, electronic module, and method of manufacturing electronic module |
Sep. 1, 2009 |
| 7579692 |
Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument |
Aug. 25, 2009 |
| 7576430 |
Bonding structure |
Aug. 18, 2009 |
| 7573140 |
Semiconductor device and method for manufacturing the same |
Aug. 11, 2009 |
| 7573131 |
Die-up integrated circuit package with grounded stiffener |
Aug. 11, 2009 |
| 7572725 |
Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods |
Aug. 11, 2009 |
| 7569939 |
Self alignment features for an electronic assembly |
Aug. 4, 2009 |
| 7569934 |
Copper interconnect |
Aug. 4, 2009 |
| 7569471 |
Method of providing mixed size solder bumps on a substrate using a solder delivery head |
Aug. 4, 2009 |
| 7566970 |
Stacked bump structure and manufacturing method thereof |
Jul. 28, 2009 |
| 7566969 |
Semiconductor device with improved arrangement of a through-hole in a wiring substrate |
Jul. 28, 2009 |
| 7566960 |
Interposing structure |
Jul. 28, 2009 |
| 7566649 |
Compressible films surrounding solder connectors |
Jul. 28, 2009 |
| 7564131 |
Semiconductor package and method of making a semiconductor package |
Jul. 21, 2009 |
| 7564130 |
Power micro surface-mount device package |
Jul. 21, 2009 |
| 7560818 |
Stacked structure of chips and water structure for making the same |
Jul. 14, 2009 |
| 7560808 |
Chip scale power LDMOS device |
Jul. 14, 2009 |
| 7554206 |
Microelectronic packages and methods therefor |
Jun. 30, 2009 |
| 7554201 |
Tin-bismuth (Sn-Bi) family alloy solder and semiconductor device using the same |
Jun. 30, 2009 |
| 7554198 |
Flexible joint methodology to attach a die on an organic substrate |
Jun. 30, 2009 |
| 7550847 |
Packaged microelectronic devices and methods for packaging microelectronic devices |
Jun. 23, 2009 |
| 7550846 |
Conductive bump with a plurality of contact elements |
Jun. 23, 2009 |
| 7550845 |
Ball grid array package with separated stiffener layer |
Jun. 23, 2009 |
| 7550833 |
Semiconductor device having a second semiconductor construction mounted on a first semiconductor construction and a manufacturing method thereof |
Jun. 23, 2009 |
| 7550680 |
Package-on-package system |
Jun. 23, 2009 |
| 7550673 |
Electrode pattern and wire bonding method |
Jun. 23, 2009 |
| 7547968 |
Semiconductor device |
Jun. 16, 2009 |
| 7546941 |
Ball attaching apparatus for correcting warpage of substrate and method of attaching solder balls using the same |
Jun. 16, 2009 |
| 7545047 |
Semiconductor device with a wiring substrate and method for producing the same |
Jun. 9, 2009 |
|
|
|
