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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Physics
Class Information
Number: 257/738
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Bump leads > Ball shaped
Description: Subject matter wherein the bump contacts have the spherical shape of a ball.


Patents under this class:

Patent Number Title Of Patent Date Issued
7615864 Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus Nov. 10, 2009
7615842 Inductor integrated chip Nov. 10, 2009
7612450 Semiconductor package including dummy board and method of fabricating the same Nov. 3, 2009
7612449 Optimized power delivery to high speed, high pin-count devices Nov. 3, 2009
7612444 Semiconductor package with flow controller Nov. 3, 2009
7608922 Semiconductor device including amplifier and frequency converter Oct. 27, 2009
7608921 Multi-layer semiconductor package Oct. 27, 2009
7608911 Semiconductor device package having a semiconductor element with a roughened surface Oct. 27, 2009
7605459 Coreless substrate and manufacturing thereof Oct. 20, 2009
7603769 Method of coupling a surface mount device Oct. 20, 2009
7602062 Package substrate with dual material build-up layers Oct. 13, 2009
7602060 Heat spreader in a flip chip package Oct. 13, 2009
7598621 Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths Oct. 6, 2009
7598617 Stack package utilizing through vias and re-distribution lines Oct. 6, 2009
7598613 Flip chip bonding structure Oct. 6, 2009
7595268 Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the same Sep. 29, 2009
7592244 Semiconductor device and method of manufacturing the same Sep. 22, 2009
7589426 Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom Sep. 15, 2009
7586187 Interconnect structure with stress buffering ability and the manufacturing method thereof Sep. 8, 2009
7582972 Semiconductor device and fabrication method thereof Sep. 1, 2009
7582968 Wiring board with a protective film greater in heights than bumps Sep. 1, 2009
7582967 Semiconductor device, electronic module, and method of manufacturing electronic module Sep. 1, 2009
7579692 Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument Aug. 25, 2009
7576430 Bonding structure Aug. 18, 2009
7573140 Semiconductor device and method for manufacturing the same Aug. 11, 2009
7573131 Die-up integrated circuit package with grounded stiffener Aug. 11, 2009
7572725 Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods Aug. 11, 2009
7569939 Self alignment features for an electronic assembly Aug. 4, 2009
7569934 Copper interconnect Aug. 4, 2009
7569471 Method of providing mixed size solder bumps on a substrate using a solder delivery head Aug. 4, 2009
7566970 Stacked bump structure and manufacturing method thereof Jul. 28, 2009
7566969 Semiconductor device with improved arrangement of a through-hole in a wiring substrate Jul. 28, 2009
7566960 Interposing structure Jul. 28, 2009
7566649 Compressible films surrounding solder connectors Jul. 28, 2009
7564131 Semiconductor package and method of making a semiconductor package Jul. 21, 2009
7564130 Power micro surface-mount device package Jul. 21, 2009
7560818 Stacked structure of chips and water structure for making the same Jul. 14, 2009
7560808 Chip scale power LDMOS device Jul. 14, 2009
7554206 Microelectronic packages and methods therefor Jun. 30, 2009
7554201 Tin-bismuth (Sn-Bi) family alloy solder and semiconductor device using the same Jun. 30, 2009
7554198 Flexible joint methodology to attach a die on an organic substrate Jun. 30, 2009
7550847 Packaged microelectronic devices and methods for packaging microelectronic devices Jun. 23, 2009
7550846 Conductive bump with a plurality of contact elements Jun. 23, 2009
7550845 Ball grid array package with separated stiffener layer Jun. 23, 2009
7550833 Semiconductor device having a second semiconductor construction mounted on a first semiconductor construction and a manufacturing method thereof Jun. 23, 2009
7550680 Package-on-package system Jun. 23, 2009
7550673 Electrode pattern and wire bonding method Jun. 23, 2009
7547968 Semiconductor device Jun. 16, 2009
7546941 Ball attaching apparatus for correcting warpage of substrate and method of attaching solder balls using the same Jun. 16, 2009
7545047 Semiconductor device with a wiring substrate and method for producing the same Jun. 9, 2009



 
 
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