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Class Information
Number: 257/738
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Bump leads > Ball shaped
Description: Subject matter wherein the bump contacts have the spherical shape of a ball.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459785 |
Electrical interconnection structure formation |
Dec. 2, 2008 |
| 7459773 |
Stackable ball grid array |
Dec. 2, 2008 |
| 7456502 |
Wiring board with connection electrode formed in opening and semiconductor device using the same |
Nov. 25, 2008 |
| 7456496 |
Package design and method of manufacture for chip grid array |
Nov. 25, 2008 |
| 7456493 |
Structure for mounting semiconductor part in which bump and land portion are hardly detached from each other and method of manufacturing mounting substrate used therein |
Nov. 25, 2008 |
| 7454300 |
Extracting high frequency impedance in a circuit design using broadband representations |
Nov. 18, 2008 |
| 7453155 |
Method for fabricating a flip chip package |
Nov. 18, 2008 |
| 7453140 |
Semiconductor chip assembly with laterally aligned filler and insulative base |
Nov. 18, 2008 |
| 7449785 |
Solder bump on a semiconductor substrate |
Nov. 11, 2008 |
| 7449364 |
Device and method for including passive components in a chip scale package |
Nov. 11, 2008 |
| 7446414 |
Semiconductor device |
Nov. 4, 2008 |
| 7443041 |
Packaging of a microchip device |
Oct. 28, 2008 |
| 7443040 |
Aluminum cap with electroless nickel/immersion gold |
Oct. 28, 2008 |
| 7443038 |
Flip-chip image sensor packages |
Oct. 28, 2008 |
| 7436063 |
Packaging substrate and semiconductor device |
Oct. 14, 2008 |
| 7432595 |
System and method to reduce metal series resistance of bumped chip |
Oct. 7, 2008 |
| 7432585 |
Semiconductor device electronic component, circuit board, and electronic device |
Oct. 7, 2008 |
| 7432188 |
Structure of bumps forming on an under metallurgy layer and method for making the same |
Oct. 7, 2008 |
| 7429797 |
Electronic device and carrier substrate |
Sep. 30, 2008 |
| 7429793 |
Semiconductor device having an electronic circuit disposed therein |
Sep. 30, 2008 |
| 7429704 |
Electronic component, electro-optical device, and electronic apparatus |
Sep. 30, 2008 |
| 7427812 |
Semiconductor device with increased number of external connection electrodes |
Sep. 23, 2008 |
| 7425759 |
Semiconductor chip assembly with bumped terminal and filler |
Sep. 16, 2008 |
| 7420280 |
Reduced stress under bump metallization structure |
Sep. 2, 2008 |
| 7417326 |
Semiconductor device and manufacturing method of the same |
Aug. 26, 2008 |
| 7411297 |
Microfeature devices and methods for manufacturing microfeature devices |
Aug. 12, 2008 |
| 7407878 |
Method of providing solder bumps on a substrate using localized heating |
Aug. 5, 2008 |
| 7407877 |
Self-coplanarity bumping shape for flip-chip |
Aug. 5, 2008 |
| 7405479 |
Wired circuit board |
Jul. 29, 2008 |
| 7402908 |
Intermediate semiconductor device structures |
Jul. 22, 2008 |
| 7400035 |
Semiconductor device having multilayer printed wiring board |
Jul. 15, 2008 |
| 7393719 |
Increased stand-off height integrated circuit assemblies, systems, and methods |
Jul. 1, 2008 |
| 7391113 |
Semiconductor device |
Jun. 24, 2008 |
| 7391112 |
Capping copper bumps |
Jun. 24, 2008 |
| 7391110 |
Apparatus for providing capacitive decoupling between on-die power and ground conductors |
Jun. 24, 2008 |
| 7391106 |
Stack type package |
Jun. 24, 2008 |
| 7388293 |
Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions |
Jun. 17, 2008 |
| 7388288 |
Flip chip metallization method and devices |
Jun. 17, 2008 |
| 7388281 |
Encapsulated electronic component and production method |
Jun. 17, 2008 |
| 7388277 |
Chip and wafer integration process using vertical connections |
Jun. 17, 2008 |
| 7387910 |
Method of bonding solder pads of flip-chip package |
Jun. 17, 2008 |
| 7382060 |
Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts |
Jun. 3, 2008 |
| 7382057 |
Surface structure of flip chip substrate |
Jun. 3, 2008 |
| 7378745 |
Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns |
May. 27, 2008 |
| 7378736 |
Ball grid array structures having tape-based circuitry |
May. 27, 2008 |
| 7378735 |
High performance sub-system design and assembly |
May. 27, 2008 |
| 7378734 |
Stacked contact bump |
May. 27, 2008 |
| 7378616 |
Heating apparatus and method for semiconductor devices |
May. 27, 2008 |
| 7378297 |
Methods of bonding two semiconductor devices |
May. 27, 2008 |
| 7375431 |
Solder bump formation in electronics packaging |
May. 20, 2008 |
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