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Class Information
Number: 257/737
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Bump leads
Description: Subject matter wherein an electrical contact is in the form of a relatively abrupt protuberance on the surface of a solid-state electronic device or chip/die containing such a device.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459773 |
Stackable ball grid array |
Dec. 2, 2008 |
| 7456502 |
Wiring board with connection electrode formed in opening and semiconductor device using the same |
Nov. 25, 2008 |
| 7456088 |
Integrated circuit package system including stacked die |
Nov. 25, 2008 |
| 7453155 |
Method for fabricating a flip chip package |
Nov. 18, 2008 |
| 7453148 |
Structure of dielectric layers in built-up layers of wafer level package |
Nov. 18, 2008 |
| 7453141 |
Semiconductor device package, method of manufacturing the same, and semiconductor device |
Nov. 18, 2008 |
| 7453140 |
Semiconductor chip assembly with laterally aligned filler and insulative base |
Nov. 18, 2008 |
| 7450395 |
Circuit module and circuit device including circuit module |
Nov. 11, 2008 |
| 7449779 |
Wire bonded wafer level cavity package |
Nov. 11, 2008 |
| 7446414 |
Semiconductor device |
Nov. 4, 2008 |
| 7446398 |
Bump pattern design for flip chip semiconductor package |
Nov. 4, 2008 |
| 7443041 |
Packaging of a microchip device |
Oct. 28, 2008 |
| 7443040 |
Aluminum cap with electroless nickel/immersion gold |
Oct. 28, 2008 |
| 7443038 |
Flip-chip image sensor packages |
Oct. 28, 2008 |
| 7442878 |
Low stress conductive polymer bump |
Oct. 28, 2008 |
| 7436063 |
Packaging substrate and semiconductor device |
Oct. 14, 2008 |
| 7436062 |
Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting method |
Oct. 14, 2008 |
| 7432595 |
System and method to reduce metal series resistance of bumped chip |
Oct. 7, 2008 |
| 7432585 |
Semiconductor device electronic component, circuit board, and electronic device |
Oct. 7, 2008 |
| 7429796 |
Semiconductor device and fabrication process thereof |
Sep. 30, 2008 |
| 7425759 |
Semiconductor chip assembly with bumped terminal and filler |
Sep. 16, 2008 |
| 7425458 |
Selectable decoupling capacitors for integrated circuits and associated methods |
Sep. 16, 2008 |
| 7422974 |
Method of manufacturing electronic component mounting body, electronic component mounting body, and electro-optical device |
Sep. 9, 2008 |
| 7420285 |
Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
Sep. 2, 2008 |
| 7420284 |
Semiconductor device and manufacturing method thereof |
Sep. 2, 2008 |
| 7420274 |
Method for forming a redistribution layer in a wafer structure |
Sep. 2, 2008 |
| 7420267 |
Image sensor assembly and method for fabricating the same |
Sep. 2, 2008 |
| 7417326 |
Semiconductor device and manufacturing method of the same |
Aug. 26, 2008 |
| 7417314 |
Semiconductor chip assembly with laterally aligned bumped terminal and filler |
Aug. 26, 2008 |
| 7417309 |
Circuit device and portable device with symmetrical arrangement |
Aug. 26, 2008 |
| 7416963 |
Manufacturing method of semiconductor device |
Aug. 26, 2008 |
| 7411296 |
Method, system, and apparatus for gravity assisted chip attachment |
Aug. 12, 2008 |
| 7411295 |
Circuit board, device mounting structure, device mounting method, and electronic apparatus |
Aug. 12, 2008 |
| 7408261 |
BGA package board and method for manufacturing the same |
Aug. 5, 2008 |
| 7408119 |
Electrical interconnection for high-frequency devices |
Aug. 5, 2008 |
| 7407877 |
Self-coplanarity bumping shape for flip-chip |
Aug. 5, 2008 |
| 7407833 |
Process for fabricating chip package structure |
Aug. 5, 2008 |
| 7405478 |
Substrate package structure and packaging method thereof |
Jul. 29, 2008 |
| 7402509 |
Method of forming self-passivating interconnects and resulting devices |
Jul. 22, 2008 |
| 7402508 |
Bump structure and method of manufacturing the same, and mounting structure for IC chip and circuit board |
Jul. 22, 2008 |
| 7401523 |
Capacitive sensor and method of fabricating |
Jul. 22, 2008 |
| 7400213 |
System and method for configuring conductors within an integrated circuit to reduce impedance variation caused by connection bumps |
Jul. 15, 2008 |
| 7400035 |
Semiconductor device having multilayer printed wiring board |
Jul. 15, 2008 |
| 7397129 |
Interposers with flexible solder pad elements |
Jul. 8, 2008 |
| 7397121 |
Semiconductor chip with post-passivation scheme formed over passivation layer |
Jul. 8, 2008 |
| 7396752 |
Method and apparatus for reducing cold joint defects in flip chip products |
Jul. 8, 2008 |
| 7394164 |
Semiconductor device having bumps in a same row for staggered probing |
Jul. 1, 2008 |
| 7394159 |
Delamination reduction between vias and conductive pads |
Jul. 1, 2008 |
| 7394153 |
Encapsulation of electronic devices |
Jul. 1, 2008 |
| 7394026 |
Multilayer wiring board |
Jul. 1, 2008 |
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