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Class Information
Number: 257/737
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Bump leads
Description: Subject matter wherein an electrical contact is in the form of a relatively abrupt protuberance on the surface of a solid-state electronic device or chip/die containing such a device.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618844 |
Method of packaging and interconnection of integrated circuits |
Nov. 17, 2009 |
| 7615874 |
Electronic component module |
Nov. 10, 2009 |
| 7615866 |
Contact surrounded by passivation and polymide and method therefor |
Nov. 10, 2009 |
| 7615865 |
Standoff height improvement for bumping technology using solder resist |
Nov. 10, 2009 |
| 7612444 |
Semiconductor package with flow controller |
Nov. 3, 2009 |
| 7608921 |
Multi-layer semiconductor package |
Oct. 27, 2009 |
| 7608789 |
Component arrangement provided with a carrier substrate |
Oct. 27, 2009 |
| 7606042 |
High capacity thin module system and method |
Oct. 20, 2009 |
| 7605459 |
Coreless substrate and manufacturing thereof |
Oct. 20, 2009 |
| 7605452 |
Semiconductor light-emitting device, semiconductor light-emitting module, and method of manufacturing the semiconductor light-emitting module |
Oct. 20, 2009 |
| 7603769 |
Method of coupling a surface mount device |
Oct. 20, 2009 |
| 7602062 |
Package substrate with dual material build-up layers |
Oct. 13, 2009 |
| 7602060 |
Heat spreader in a flip chip package |
Oct. 13, 2009 |
| 7602056 |
On-die termination method for multi-chip packages |
Oct. 13, 2009 |
| 7598617 |
Stack package utilizing through vias and re-distribution lines |
Oct. 6, 2009 |
| 7598613 |
Flip chip bonding structure |
Oct. 6, 2009 |
| 7598612 |
Semiconductor device and manufacturing method thereof |
Oct. 6, 2009 |
| 7595268 |
Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the same |
Sep. 29, 2009 |
| 7592704 |
Etched interposer for integrated circuit devices |
Sep. 22, 2009 |
| 7592700 |
Semiconductor chip and method of manufacturing semiconductor chip |
Sep. 22, 2009 |
| 7592244 |
Semiconductor device and method of manufacturing the same |
Sep. 22, 2009 |
| 7589426 |
Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom |
Sep. 15, 2009 |
| 7589400 |
Inverter and vehicle drive unit using the same |
Sep. 15, 2009 |
| 7586199 |
Structures, architectures, systems, methods, algorithms and software for configuring and integrated circuit for multiple packaging types |
Sep. 8, 2009 |
| 7582972 |
Semiconductor device and fabrication method thereof |
Sep. 1, 2009 |
| 7582967 |
Semiconductor device, electronic module, and method of manufacturing electronic module |
Sep. 1, 2009 |
| 7582965 |
Electronic device and method for bonding an electronic device |
Sep. 1, 2009 |
| 7582956 |
Flip chip in leaded molded package and method of manufacture thereof |
Sep. 1, 2009 |
| 7579692 |
Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument |
Aug. 25, 2009 |
| 7579683 |
Memory interface optimized for stacked configurations |
Aug. 25, 2009 |
| 7579681 |
Super high density module with integrated wafer level packages |
Aug. 25, 2009 |
| 7579679 |
Chipcard with contact areas and method for producing contact areas |
Aug. 25, 2009 |
| 7576424 |
Semiconductor device |
Aug. 18, 2009 |
| 7576004 |
Semiconductor chip and method of manufacturing semiconductor chip |
Aug. 18, 2009 |
| 7575994 |
Semiconductor device and manufacturing method of the same |
Aug. 18, 2009 |
| 7572725 |
Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods |
Aug. 11, 2009 |
| 7569939 |
Self alignment features for an electronic assembly |
Aug. 4, 2009 |
| 7569935 |
Pillar-to-pillar flip-chip assembly |
Aug. 4, 2009 |
| 7569934 |
Copper interconnect |
Aug. 4, 2009 |
| 7566970 |
Stacked bump structure and manufacturing method thereof |
Jul. 28, 2009 |
| 7566969 |
Semiconductor device with improved arrangement of a through-hole in a wiring substrate |
Jul. 28, 2009 |
| 7566960 |
Interposing structure |
Jul. 28, 2009 |
| 7564131 |
Semiconductor package and method of making a semiconductor package |
Jul. 21, 2009 |
| 7564130 |
Power micro surface-mount device package |
Jul. 21, 2009 |
| 7560819 |
Semiconductor device and method of manufacture thereof, circuit board and electronic instrument |
Jul. 14, 2009 |
| 7560808 |
Chip scale power LDMOS device |
Jul. 14, 2009 |
| 7560805 |
Semiconductor package and method of manufacturing the same |
Jul. 14, 2009 |
| 7557452 |
Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating same |
Jul. 7, 2009 |
| 7554206 |
Microelectronic packages and methods therefor |
Jun. 30, 2009 |
| 7554201 |
Tin-bismuth (Sn-Bi) family alloy solder and semiconductor device using the same |
Jun. 30, 2009 |
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