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Class Information
Number: 257/737
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Bump leads
Description: Subject matter wherein an electrical contact is in the form of a relatively abrupt protuberance on the surface of a solid-state electronic device or chip/die containing such a device.










Sub-classes under this class:

Class Number Class Name Patents
257/738 Ball shaped 2,490


Patents under this class:

Patent Number Title Of Patent Date Issued
8710681 Isolation rings for blocking the interface between package components and the respective molding compound Apr. 29, 2014
8710671 Multi-level integrated circuit, device and method for modeling multi-level integrated circuits Apr. 29, 2014
8710658 Under bump passive components in wafer level packaging Apr. 29, 2014
8710656 Redistribution layer (RDL) with variable offset bumps Apr. 29, 2014
8710655 Die packages and systems having the die packages Apr. 29, 2014
8710654 Semiconductor device and manufacturing method thereof Apr. 29, 2014
8710653 Chip on chip semiconductor device including an underfill layer having a resin containing an amine-based curing agent Apr. 29, 2014
8710652 Embedded package and method for manufacturing the same Apr. 29, 2014
8710651 Semiconductor device and method for manufacturing the same Apr. 29, 2014
8710630 Mechanisms for marking the orientation of a sawed die Apr. 29, 2014
8709934 Electronic system with vertical intermetallic compound Apr. 29, 2014
8704377 Compliant conductive nano-particle electrical interconnect Apr. 22, 2014
8704372 Integrated circuits and methods for processing integrated circuits with embedded features Apr. 22, 2014
8704371 Semiconductor device having multiple bump heights and multiple bump diameters Apr. 22, 2014
8704369 Flip chip bump structure and fabrication method Apr. 22, 2014
8704368 Stackable via package and method Apr. 22, 2014
8704367 Semiconductor device and manufacturing method of semiconductor device Apr. 22, 2014
8704366 Ultra thin bumped wafer with under-film Apr. 22, 2014
8704350 Stacked wafer level package and method of manufacturing the same Apr. 22, 2014
8703537 System and method to manufacture an implantable electrode Apr. 22, 2014
8703508 Method for wafer-level testing diced multi-chip stacked packages Apr. 22, 2014
8692134 Brace for long wire bond Apr. 8, 2014
8686574 Semiconductor device Apr. 1, 2014
8686570 Multi-dimensional integrated circuit structures and methods of forming the same Apr. 1, 2014
8686560 Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress Apr. 1, 2014
8680685 Semiconductor package and method for fabricating the same Mar. 25, 2014
8680676 Semiconductor package with under bump metallization routing Mar. 25, 2014
8680675 Structures and methods for improving solder bump connections in semiconductor devices Mar. 25, 2014
8674511 Method of forming a semiconductor device with a contact pad on a sloped silicon dioxide surface Mar. 18, 2014
8674506 Structures and methods to reduce maximum current density in a solder ball Mar. 18, 2014
8674505 Integrated circuit packaging with ball grid array having differential pitch to enhance thermal performance Mar. 18, 2014
8674504 Wire-based methodology of widening the pitch of semiconductor chip terminals Mar. 18, 2014
8674503 Circuit board, fabricating method thereof and package structure Mar. 18, 2014
8674502 Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device Mar. 18, 2014
8674501 Semiconductor integrated circuit device Mar. 18, 2014
8674500 Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask Mar. 18, 2014
8673690 Method for manufacturing a semiconductor device and a semiconductor device Mar. 18, 2014
8670638 Signal distribution and radiation in a wireless enabled integrated circuit (IC) using a leaky waveguide Mar. 11, 2014
8669660 Solder interconnect pads with current spreading layers Mar. 11, 2014
8669659 Semiconductor device and a method of manufacturing the same Mar. 11, 2014
8669658 Crosstalk-free WLCSP structure for high frequency application Mar. 11, 2014
8669651 Package-on-package structures with reduced bump bridging Mar. 11, 2014
8665605 Substrate structure and package structure using the same Mar. 4, 2014
8664773 Mounting structure of semiconductor package component and manufacturing method therefor Mar. 4, 2014
8664761 Semiconductor structure and manufacturing method of the same Mar. 4, 2014
8664760 Connector design for packaging integrated circuits Mar. 4, 2014
8664750 Semiconductor substrate, package and device Mar. 4, 2014
8664666 Semiconductor device and process for fabricating the same Mar. 4, 2014
8664090 Electronic component package fabrication method Mar. 4, 2014
8664041 Method for designing a package and substrate layout Mar. 4, 2014











 
 
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