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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Physics
Class Information
Number: 257/736
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Beam leads (i.e., leads that extend beyond the ends or sides of a chip component) > Layered
Description: Subject matter wherein the leads are made of at least two separate layers of the same or different material.










Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
8642465 Method for manufacturing and making planar contact with an electronic apparatus, and correspondingly manufactured apparatus Feb. 4, 2014
8624403 Semiconductor device and a method of manufacturing the same Jan. 7, 2014
8587135 Semiconductor device having electrode/film opening edge spacing smaller than bonding pad/electrode edge spacing Nov. 19, 2013
8564106 Wafer level packaging Oct. 22, 2013
8546253 Self-aligned polymer passivation/aluminum pad Oct. 1, 2013
8525334 Semiconductor on semiconductor substrate multi-chip-scale package Sep. 3, 2013
8525330 Connecting member for connecting a semiconductor element and a frame, formed of an Al-based layer and first and second Zn-based layers provided on surfaces of the Al-based layer Sep. 3, 2013
8482121 Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus Jul. 9, 2013
8476759 Electrical connection structure Jul. 2, 2013
8461681 Layered structure for corrosion resistant interconnect contacts Jun. 11, 2013
8456011 Method to control metal semiconductor micro-structure Jun. 4, 2013
8395258 Semiconductor element, semiconductor device, and fabrication method thereof Mar. 12, 2013
8373282 Wafer level chip scale package with reduced stress on solder balls Feb. 12, 2013
8368211 Solderable top metalization and passivation for source mounted package Feb. 5, 2013
8357860 Wiring board having a connecting pad area which is smaller than a surface plating layer area Jan. 22, 2013
8350390 Wiring substrate and semiconductor device Jan. 8, 2013
8338288 Method of manufacturing semiconductor device Dec. 25, 2012
8312397 Method for generating layout pattern of semiconductor device and layout pattern generating apparatus Nov. 13, 2012
8310048 Microelectronic devices Nov. 13, 2012
8304903 Wirebond-less semiconductor package Nov. 6, 2012
8288178 Lead frame, method of manufacturing the same, and method of manufacturing semiconductor device Oct. 16, 2012
8253027 Circuit board and structure using the same Aug. 28, 2012
8237270 Wiring board manufacturing method, semiconductor device manufacturing method and wiring board Aug. 7, 2012
8232639 Semiconductor-device mounted board and method of manufacturing the same Jul. 31, 2012
8193636 Chip assembly with interconnection by metal bump Jun. 5, 2012
8178957 Electronic component device, and method of manufacturing the same May. 15, 2012
8148823 Low loss package for electronic device Apr. 3, 2012
8124449 Device including a semiconductor chip and metal foils Feb. 28, 2012
8106513 Copper damascene and dual damascene interconnect wiring Jan. 31, 2012
8102052 Process for the simultaneous deposition of crystalline and amorphous layers with doping Jan. 24, 2012
8089147 IMS formed as can for semiconductor housing Jan. 3, 2012
8084848 Leadframe, leadframe type package and lead lane Dec. 27, 2011
8013441 Power semiconductor device in lead frame employing connecting element with conductive film Sep. 6, 2011
7993979 Leadless package system having external contacts Aug. 9, 2011
7981698 Removal of integrated circuits from packages Jul. 19, 2011
7982310 Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus Jul. 19, 2011
7968921 Asymmetric field-effect transistor having asymmetric channel zone and differently configured source/drain extensions Jun. 28, 2011
7956462 Semiconductor device and manufacturing method thereof Jun. 7, 2011
7951709 Method and apparatus providing integrated circuit having redistribution layer with recessed connectors May. 31, 2011
7951302 Method for forming bump of probe card May. 31, 2011
7944026 Semiconductor device May. 17, 2011
7915088 Wiring board manufacturing method, semiconductor device manufacturing method and wiring board Mar. 29, 2011
7906840 Semiconductor integrated circuit package, printed circuit board, semiconductor apparatus, and power supply wiring structure Mar. 15, 2011
7898082 Nitrogen rich barrier layers and methods of fabrication thereof Mar. 1, 2011
7863729 Circuit board structure embedded with semiconductor chips Jan. 4, 2011
7863737 Integrated circuit package system with wire bond pattern Jan. 4, 2011
7858438 Semiconductor device, chip package and method of fabricating the same Dec. 28, 2010
7855460 Electronic component to protect an interface between a conductor and an insulator and method for manufacturing the same Dec. 21, 2010
7851910 Diffusion soldered semiconductor device Dec. 14, 2010
7842889 Substrate for mounting electronic part and electronic part Nov. 30, 2010

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