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Class Information
Number: 257/736
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Beam leads (i.e., leads that extend beyond the ends or sides of a chip component) > Layered
Description: Subject matter wherein the leads are made of at least two separate layers of the same or different material.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459789 |
Bonding method of flexible film and display bonded thereby |
Dec. 2, 2008 |
| 7446414 |
Semiconductor device |
Nov. 4, 2008 |
| 7443019 |
Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same |
Oct. 28, 2008 |
| 7427532 |
Method of manufacturing a device having a contacting structure |
Sep. 23, 2008 |
| 7414313 |
Polymeric conductor donor and transfer method |
Aug. 19, 2008 |
| 7405419 |
Unidirectionally conductive materials for interconnection |
Jul. 29, 2008 |
| 7375032 |
Semiconductor substrate thinning method for manufacturing thinned die |
May. 20, 2008 |
| 7371598 |
Wiring substrate and method of manufacturing thereof, and thin film transistor and method of manufacturing thereof |
May. 13, 2008 |
| 7368326 |
Methods and apparatus to reduce growth formations on plated conductive leads |
May. 6, 2008 |
| 7361976 |
Data carrier with a module with a reinforcement strip |
Apr. 22, 2008 |
| 7358607 |
Substrates and systems to minimize signal path discontinuities |
Apr. 15, 2008 |
| 7358618 |
Semiconductor device and manufacturing method thereof |
Apr. 15, 2008 |
| 7344968 |
Semiconductor chip having pads with plural junctions for different assembly methods |
Mar. 18, 2008 |
| 7323767 |
Standoffs for centralizing internals in packaging process |
Jan. 29, 2008 |
| 7315000 |
Electronic module with dual connectivity |
Jan. 1, 2008 |
| 7285845 |
Lead frame for semiconductor package |
Oct. 23, 2007 |
| 7276801 |
Designs and methods for conductive bumps |
Oct. 2, 2007 |
| 7271498 |
Bump electrodes having multiple under ball metallurgy (UBM) layers |
Sep. 18, 2007 |
| 7271482 |
Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods |
Sep. 18, 2007 |
| 7250673 |
Signal isolation in a package substrate |
Jul. 31, 2007 |
| 7247947 |
Semiconductor device comprising a plurality of semiconductor constructs |
Jul. 24, 2007 |
| 7247943 |
Integrated circuit with at least one bump |
Jul. 24, 2007 |
| 7176568 |
Semiconductor device and its manufacturing method, electronic module, and electronic unit |
Feb. 13, 2007 |
| 7176487 |
Semiconductor integrated circuit |
Feb. 13, 2007 |
| 7170169 |
LGA socket with EMI protection |
Jan. 30, 2007 |
| 7170187 |
Low stress conductive polymer bump |
Jan. 30, 2007 |
| 7102229 |
Capacitor containing high purity tantalum |
Sep. 5, 2006 |
| 7091613 |
Elongated bonding pad for wire bonding and sort probing |
Aug. 15, 2006 |
| 7078796 |
Corrosion-resistant copper bond pad and integrated device |
Jul. 18, 2006 |
| 7067918 |
Wiring board |
Jun. 27, 2006 |
| 7067353 |
Method for manufacturing semiconductor package having electrodes penetrating through semiconductor wafer |
Jun. 27, 2006 |
| 7064015 |
Semiconductor device and manufacturing method of the same |
Jun. 20, 2006 |
| 7060525 |
Semiconductive chip having a bond pad located on an active device |
Jun. 13, 2006 |
| 7030446 |
Semiconductor switching devices |
Apr. 18, 2006 |
| 7023067 |
Bond pad design |
Apr. 4, 2006 |
| 7023088 |
Semiconductor package, semiconductor device and electronic device |
Apr. 4, 2006 |
| 7019396 |
Electronic chip component and method for manufacturing electronic chip component |
Mar. 28, 2006 |
| 7015065 |
Manufacturing method of ball grid array package |
Mar. 21, 2006 |
| 7015583 |
Submount and semiconductor device |
Mar. 21, 2006 |
| 6998713 |
Wiring board and method for producing same |
Feb. 14, 2006 |
| 6992386 |
Semiconductor device and a method of manufacturing the same |
Jan. 31, 2006 |
| 6956288 |
Semiconductor device with folded film substrate and display device using the same |
Oct. 18, 2005 |
| 6955938 |
Tantalum sputtering target and method of manufacture |
Oct. 18, 2005 |
| 6946725 |
Electronic device having microscopically small contact areas and methods for producing the electronic device |
Sep. 20, 2005 |
| 6943455 |
Packaging system for power supplies |
Sep. 13, 2005 |
| 6940156 |
Electronic module with a semiconductor chip which has flexible chip contacts, and method for producing the electronic module |
Sep. 6, 2005 |
| 6911721 |
Semiconductor device, method for manufacturing semiconductor device and electronic equipment |
Jun. 28, 2005 |
| 6909173 |
Flexible substrate, semiconductor device, imaging device, radiation imaging device and radiation imaging system |
Jun. 21, 2005 |
| 6909180 |
Semiconductor device, mounting circuit board, method of producing the same, and method of producing mounting structure using the same |
Jun. 21, 2005 |
| 6900142 |
Inhibition of tin oxide formation in lead free interconnect formation |
May. 31, 2005 |
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