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Class Information
Number: 257/735
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Beam leads (i.e., leads that extend beyond the ends or sides of a chip component)
Description: Subject matter wherein electrical contact leads extend like beams beyond the ends of a chip component.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7439612 |
Integrated circuit package structure with gap through lead bar between a die edge and an attachment point corresponding to a conductive connector |
Oct. 21, 2008 |
| 7439619 |
Electronic package structure and the packaging process thereof |
Oct. 21, 2008 |
| 7432594 |
Semiconductor chip, electrically connections therefor |
Oct. 7, 2008 |
| 7425470 |
Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths |
Sep. 16, 2008 |
| 7414301 |
Printed circuit board with soldering lands |
Aug. 19, 2008 |
| 7414299 |
Semiconductor package assembly and method for electrically isolating modules |
Aug. 19, 2008 |
| 7408244 |
Semiconductor package and stack arrangement thereof |
Aug. 5, 2008 |
| 7405419 |
Unidirectionally conductive materials for interconnection |
Jul. 29, 2008 |
| 7394146 |
MOSFET package |
Jul. 1, 2008 |
| 7378616 |
Heating apparatus and method for semiconductor devices |
May. 27, 2008 |
| 7375032 |
Semiconductor substrate thinning method for manufacturing thinned die |
May. 20, 2008 |
| 7372139 |
Semiconductor chip package |
May. 13, 2008 |
| 7368326 |
Methods and apparatus to reduce growth formations on plated conductive leads |
May. 6, 2008 |
| 7368818 |
Methods of making microelectronic assemblies including compliant interfaces |
May. 6, 2008 |
| 7361976 |
Data carrier with a module with a reinforcement strip |
Apr. 22, 2008 |
| 7358607 |
Substrates and systems to minimize signal path discontinuities |
Apr. 15, 2008 |
| 7348659 |
Semiconductor device and method of manufacturing thereof |
Mar. 25, 2008 |
| 7339261 |
Semiconductor device |
Mar. 4, 2008 |
| 7332803 |
Circuit device |
Feb. 19, 2008 |
| 7329597 |
Semiconductor chip and tab package having the same |
Feb. 12, 2008 |
| 7323767 |
Standoffs for centralizing internals in packaging process |
Jan. 29, 2008 |
| 7323774 |
Integrated circuit package system with pedestal structure |
Jan. 29, 2008 |
| 7323778 |
Semiconductor device with improved design freedom of external terminal |
Jan. 29, 2008 |
| 7282795 |
Modifying a semiconductor device to provide electrical parameter monitoring |
Oct. 16, 2007 |
| 7279784 |
Semiconductor package |
Oct. 9, 2007 |
| 7279356 |
Depopulation of a ball grid array to allow via placement |
Oct. 9, 2007 |
| 7271472 |
Circuit board and method for producing a circuit board |
Sep. 18, 2007 |
| 7271481 |
Microelectronic component and assembly having leads with offset portions |
Sep. 18, 2007 |
| 7268439 |
Semiconductor device having resin-sealed area on circuit board thereof |
Sep. 11, 2007 |
| 7266888 |
Method for fabricating a warpage-preventive circuit board |
Sep. 11, 2007 |
| 7253507 |
Semiconductor device |
Aug. 7, 2007 |
| 7247936 |
Tape circuit substrate having wavy beam leads and semiconductor chip package using the same |
Jul. 24, 2007 |
| 7247944 |
Connector assembly |
Jul. 24, 2007 |
| 7238962 |
Semiconductor chip with test pads and tape carrier package using the same |
Jul. 3, 2007 |
| 7239009 |
Lead frame and semiconductor device having the same as well as method of resin-molding the same |
Jul. 3, 2007 |
| 7230314 |
Semiconductor device and method of forming a semiconductor device |
Jun. 12, 2007 |
| 7227198 |
Half-bridge package |
Jun. 5, 2007 |
| 7224049 |
Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same |
May. 29, 2007 |
| 7221049 |
Circuit device and manufacturing method thereof |
May. 22, 2007 |
| 7205673 |
Reduce or eliminate IMC cracking in post wire bonded dies by doping aluminum used in bond pads during Cu/Low-k BEOL processing |
Apr. 17, 2007 |
| 7176557 |
Semiconductor device |
Feb. 13, 2007 |
| 7176568 |
Semiconductor device and its manufacturing method, electronic module, and electronic unit |
Feb. 13, 2007 |
| 7176487 |
Semiconductor integrated circuit |
Feb. 13, 2007 |
| 7170169 |
LGA socket with EMI protection |
Jan. 30, 2007 |
| 7157790 |
Single die stitch bonding |
Jan. 2, 2007 |
| 7154116 |
Rewiring substrate strip with a number of semiconductor component positions |
Dec. 26, 2006 |
| 7145252 |
Configuration for testing the bonding positions of conductive drops and test method for using the same |
Dec. 5, 2006 |
| 7135763 |
Technique for attaching die to leads |
Nov. 14, 2006 |
| 7132314 |
System and method for forming one or more integrated circuit packages using a flexible leadframe structure |
Nov. 7, 2006 |
| 7102185 |
Lightshield architecture for interline transfer image sensors |
Sep. 5, 2006 |
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