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Class Information
Number: 257/735
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Beam leads (i.e., leads that extend beyond the ends or sides of a chip component)
Description: Subject matter wherein electrical contact leads extend like beams beyond the ends of a chip component.










Sub-classes under this class:

Class Number Class Name Patents
257/736 Layered 250


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11

Patent Number Title Of Patent Date Issued
8710664 Wafer-level chip scale package Apr. 29, 2014
8703598 Manufacturing method of lead frame substrate Apr. 22, 2014
8704344 Ultra-small chip package and method for manufacturing the same Apr. 22, 2014
8705245 Sensor device and method for manufacture Apr. 22, 2014
8692369 Semiconductor chip and solar system Apr. 8, 2014
8686574 Semiconductor device Apr. 1, 2014
8680568 Semiconductor light-emitting device Mar. 25, 2014
8648450 Semiconductor device including leadframe with a combination of leads and lands Feb. 11, 2014
8642465 Method for manufacturing and making planar contact with an electronic apparatus, and correspondingly manufactured apparatus Feb. 4, 2014
8643188 Connecting system for electrically connecting electronic devices and method for connecting an electrically conductive first connector and electrically conductive second connector Feb. 4, 2014
8633507 LED with versatile mounting ways Jan. 21, 2014
RE44699 Semiconductor integrated circuit having pads layout for increasing signal integrity and reducing chip size Jan. 14, 2014
8629467 Semiconductor device Jan. 14, 2014
8624403 Semiconductor device and a method of manufacturing the same Jan. 7, 2014
8618644 Electronic device and manufacturing thereof Dec. 31, 2013
8592967 Semiconductor apparatus and power supply circuit Nov. 26, 2013
8592993 Method and structure of integrated micro electro-mechanical systems and electronic devices using edge bond pads Nov. 26, 2013
8587118 Light emitting device package and manufacturing method thereof Nov. 19, 2013
8587001 Light-emitting diode light module free of jumper wires Nov. 19, 2013
8580609 Semiconductor device with embedded interconnect pad Nov. 12, 2013
8581371 Connection element for a semiconductor component and method for producing the same Nov. 12, 2013
8569884 Multiple die in a face down package Oct. 29, 2013
8564110 Power device with bottom source electrode Oct. 22, 2013
8546940 Manufacturing method of lead frame substrate and semiconductor apparatus Oct. 1, 2013
8541808 Semiconductor light-emitting device Sep. 24, 2013
8537527 Mounting board and display device Sep. 17, 2013
8519547 Chip arrangement and method for producing a chip arrangement Aug. 27, 2013
8519534 Microsprings partially embedded in a laminate structure and methods for producing same Aug. 27, 2013
8519470 Semiconductor chip, and semiconductor package and system each including the semiconductor chip Aug. 27, 2013
8513811 Electronic device and method for connecting a die to a connection terminal Aug. 20, 2013
8461678 Structure with self aligned resist layer on an interconnect surface and method of making same Jun. 11, 2013
8461681 Layered structure for corrosion resistant interconnect contacts Jun. 11, 2013
8450853 Semiconductor device and a method of manufacturing the same, and an electronic device May. 28, 2013
8445330 Interconnects for packaged semiconductor devices and methods for manufacturing such devices May. 21, 2013
8431827 Circuit modules and method of managing the same Apr. 30, 2013
8431993 Semiconductor package for forming a leadframe package Apr. 30, 2013
8426963 Power semiconductor package structure and manufacturing method thereof Apr. 23, 2013
8421227 Semiconductor chip structure Apr. 16, 2013
8415791 Semiconductor device and fabrication method therefor Apr. 9, 2013
8384230 Semiconductor device Feb. 26, 2013
8378468 Semiconductor device and method of manufacturing the same Feb. 19, 2013
8378447 Electrically programmable fuse and fabrication method Feb. 19, 2013
8367522 Method and structure of integrated micro electro-mechanical systems and electronic devices using edge bond pads Feb. 5, 2013
8360325 Wireless IC device, electronic apparatus, and method for adjusting resonant frequency of wireless IC device Jan. 29, 2013
8358014 Structure and method for power field effect transistor Jan. 22, 2013
8338968 Semiconductor device and a method of manufacturing the same Dec. 25, 2012
8338902 Uncooled infrared image sensor Dec. 25, 2012
8319245 Lead frame, and light emitting diode module having the same Nov. 27, 2012
8304864 Lead frame routed chip pads for semiconductor packages Nov. 6, 2012
8304901 Semiconductor device having a groove and a junction termination extension layer surrounding a guard ring layer Nov. 6, 2012

1 2 3 4 5 6 7 8 9 10 11










 
 
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