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Class Information
Number: 257/734
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead
Description: Subject matter wherein the active solid-state device is provided with one or more electrical contacts or leads.


Sub-classes under this class:

Class Number Class Name Patents
257/780 Ball or nail head type contact, lead, or bond 1,370
257/735 Beam leads (i.e., leads that extend beyond the ends or sides of a chip component) 374
257/737 Bump leads 1,919
257/785 By pressure alone 221
257/777 Chip mounted on chip 1,873
257/786 Configuration or pattern of bonds 1,626
257/782 Die bond 581
257/778 Flip chip 2,594
257/773 Of specified configuration 1,977
257/741 Of specified material other than unalloyed aluminum 296
257/779 Solder wettable contact, lead, or bond 881
257/784 Wire contact, lead, or bond 1,705
257/740 With means to prevent contact from penetrating shallow pn junction (e.g., prevention of aluminum "spiking") 70
257/739 With textured surface 129


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18

Patent Number Title Of Patent Date Issued
7615411 Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof Nov. 10, 2009
7608932 Deterministic generation of an integrated circuit identification number Oct. 27, 2009
7605474 Structure of polymer-matrix conductive film and method for fabricating the same Oct. 20, 2009
7602070 Room temperature metal direct bonding Oct. 13, 2009
7602063 Semiconductor device and manufacturing method therefor Oct. 13, 2009
7602061 Semiconductor device and method for manufacturing semiconductor device Oct. 13, 2009
7598603 Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink Oct. 6, 2009
7598609 Structure of polymer-matrix conductive film and method for fabricating the same Oct. 6, 2009
7598617 Stack package utilizing through vias and re-distribution lines Oct. 6, 2009
7595562 Device package structure, device packaging method, droplet ejection head, connector, and semiconductor device Sep. 29, 2009
7592702 Via heat sink material Sep. 22, 2009
7589422 Micro-element package having a dual-thickness substrate and manufacturing method thereof Sep. 15, 2009
7589421 Heat-radiating semiconductor chip, tape wiring substrate and tape package using the same Sep. 15, 2009
7586186 Ball grid array Sep. 8, 2009
7582976 Semiconductor device tape carrier, manufacturing method for semiconductor device, semiconductor device, and semiconductor module device Sep. 1, 2009
7582966 Semiconductor chip and method for fabricating the same Sep. 1, 2009
7582919 Functional coating of the SCFM preform Sep. 1, 2009
7576424 Semiconductor device Aug. 18, 2009
7577323 Photoelectric circuit board Aug. 18, 2009
7569411 Metal MEMS devices and methods of making same Aug. 4, 2009
7569938 Interconnections for integrated circuits Aug. 4, 2009
7566968 Biosensor with smart card configuration Jul. 28, 2009
7564136 Integration scheme for Cu/low-k interconnects Jul. 21, 2009
7564130 Power micro surface-mount device package Jul. 21, 2009
7560743 Electro-optical device, method of manufacturing the same, and image forming apparatus Jul. 14, 2009
7560814 Semiconductor device that improves electrical connection reliability Jul. 14, 2009
7557444 Power-via structure for integration in advanced logic/smart-power technologies Jul. 7, 2009
7554136 Micro-switch device and method for manufacturing the same Jun. 30, 2009
7554201 Tin-bismuth (Sn-Bi) family alloy solder and semiconductor device using the same Jun. 30, 2009
7550830 Stacked semiconductor package having fan-out structure through wire bonding Jun. 23, 2009
7550833 Semiconductor device having a second semiconductor construction mounted on a first semiconductor construction and a manufacturing method thereof Jun. 23, 2009
7550842 Integrated circuit assembly Jun. 23, 2009
7550843 Semiconductor device including a base member and a semiconductor constructing body directly fixed to thermosetting resin of the base member Jun. 23, 2009
7547967 Semiconductor device and method of manufacturing the same Jun. 16, 2009
7545044 Semiconductor device and radiation detector employing it Jun. 9, 2009
7545037 Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same Jun. 9, 2009
7545031 Multipackage module having stacked packages with asymmetrically arranged die and molding Jun. 9, 2009
7545653 Semiconductor integrated circuit device Jun. 9, 2009
7538428 Semiconductor device May. 26, 2009
7533361 System and process for manufacturing custom electronics by combining traditional electronics with printable electronics May. 12, 2009
7531906 Flip chip packaging using recessed interposer terminals May. 12, 2009
7531896 Semiconductor device having a minimal via resistance created by applying a nitrogen plasma to a titanium via liner May. 12, 2009
7528478 Semiconductor devices having post passivation interconnections and a buffer layer May. 5, 2009
7525186 Stack package having guard ring which insulates through-via interconnection plug and method for manufacturing the same Apr. 28, 2009
7521796 Method of making the semiconductor device, circuit board, and electronic instrument Apr. 21, 2009
7518240 Deposition pattern for eliminating backside metal peeling during die separation in semiconductor device fabrication Apr. 14, 2009
7518239 Semiconductor device with substrate having penetrating hole having a protrusion Apr. 14, 2009
7518223 Semiconductor devices and semiconductor device assemblies including a nonconfluent spacer layer Apr. 14, 2009
7514340 Composite integrated device and methods for forming thereof Apr. 7, 2009
7514751 SiGe DIAC ESD protection structure Apr. 7, 2009

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