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Class Information
Number: 257/734
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead
Description: Subject matter wherein the active solid-state device is provided with one or more electrical contacts or leads.










Sub-classes under this class:

Class Number Class Name Patents
257/780 Ball or nail head type contact, lead, or bond 1,797
257/735 Beam leads (i.e., leads that extend beyond the ends or sides of a chip component) 514
257/737 Bump leads 2,978
257/785 By pressure alone 254
257/777 Chip mounted on chip 3,297
257/786 Configuration or pattern of bonds 2,273
257/782 Die bond 803
257/778 Flip chip 3,691
257/773 Of specified configuration 3,117
257/741 Of specified material other than unalloyed aluminum 437
257/779 Solder wettable contact, lead, or bond 1,242
257/784 Wire contact, lead, or bond 2,490
257/740 With means to prevent contact from penetrating shallow pn junction (e.g., prevention of aluminum "spiking") 76
257/739 With textured surface 199


Patents under this class:

Patent Number Title Of Patent Date Issued
8704377 Compliant conductive nano-particle electrical interconnect Apr. 22, 2014
8704347 Packaged semiconductor chips Apr. 22, 2014
8693210 Product packaging Apr. 8, 2014
8692372 Semiconductor device having impurity doped polycrystalline layer including impurity diffusion prevention layer and dynamic random memory device including the semiconductor device Apr. 8, 2014
8686574 Semiconductor device Apr. 1, 2014
8686548 Wiring substrate, method for manufacturing wiring substrate, and semiconductor package including wiring substrate Apr. 1, 2014
8684572 LED connector assembly Apr. 1, 2014
8680678 Formulations for improved electrodes for electronic devices Mar. 25, 2014
8679591 Method for reducing voids in a copper-tin interface and structure formed thereby Mar. 25, 2014
8674503 Circuit board, fabricating method thereof and package structure Mar. 18, 2014
8674500 Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask Mar. 18, 2014
8671565 Blind via capture pad structure fabrication method Mar. 18, 2014
8664774 Bondwire configuration for reduced crosstalk Mar. 4, 2014
8659164 Microelectronic package with terminals on dielectric mass Feb. 25, 2014
8659162 Semiconductor device having an interconnect structure with TSV using encapsulant for structural support Feb. 25, 2014
8659154 Semiconductor device including adhesive covered element Feb. 25, 2014
8658887 Substrate provided with transparent conductive film for photoelectric conversion device, method for manufacturing the substrate, and photoelectric conversion device using the substrate Feb. 25, 2014
8653668 Copper bonding wire for semiconductor device and bonding structure thereof Feb. 18, 2014
8653658 Planarized bumps for underfill control Feb. 18, 2014
8653656 Semiconductor device having multiple external electrodes Feb. 18, 2014
8647961 Method for filling cavities in wafers, correspondingly filled blind hole and wafer having correspondingly filled insulation trenches Feb. 11, 2014
8643184 Crosstalk polarity reversal and cancellation through substrate material tuning Feb. 4, 2014
8643178 Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same Feb. 4, 2014
8643177 Wafers including patterned back side layers thereon Feb. 4, 2014
8642996 Graphene nanoribbons and carbon nanotubes fabricated from SiC fins or nanowire templates Feb. 4, 2014
8642370 Cavity open process to improve undercut Feb. 4, 2014
8637991 Microelectronic package with terminals on dielectric mass Jan. 28, 2014
8637983 Face-to-face (F2F) hybrid structure for an integrated circuit Jan. 28, 2014
8637982 Split loop cut pattern for spacer process Jan. 28, 2014
8637973 Packaged microelectronic components with terminals exposed through encapsulant Jan. 28, 2014
8633102 Module comprising a semiconductor chip Jan. 21, 2014
8629559 Stress reduction apparatus with an inverted cup-shaped layer Jan. 14, 2014
8618650 Flange package for a semiconductor device Dec. 31, 2013
8610292 Resin sealing method of semiconductor device Dec. 17, 2013
8610271 Chip package and manufacturing method thereof Dec. 17, 2013
8610269 Semiconductor device, method for manufacturing semiconductor device, and circuit device using semiconductor device Dec. 17, 2013
8610266 Semiconductor device for radio frequency applications and method for making the same Dec. 17, 2013
8609533 Methods for fabricating integrated circuits having substrate contacts and integrated circuits having substrate contacts Dec. 17, 2013
8604615 Semiconductor device including a stack of semiconductor chips, underfill material and molding material Dec. 10, 2013
8598704 Semiconductor device Dec. 3, 2013
8598703 Semiconductor device Dec. 3, 2013
8598617 Methods of fabricating light emitting diode packages Dec. 3, 2013
8592993 Method and structure of integrated micro electro-mechanical systems and electronic devices using edge bond pads Nov. 26, 2013
8592957 Semiconductor device having shield layer and chip-side power supply terminal capacitively coupled therein Nov. 26, 2013
8592286 Ultra-thin wafer system and method of manufacture thereof Nov. 26, 2013
8587119 Conductive feature for semiconductor substrate and method of manufacture Nov. 19, 2013
8586857 Combined diode, lead assembly incorporating an expansion joint Nov. 19, 2013
8581407 Electronic system modules and method of fabrication Nov. 12, 2013
8581401 Mechanisms for forming copper pillar bumps using patterned anodes Nov. 12, 2013
8581398 Trap rich layer with through-silicon-vias in semiconductor devices Nov. 12, 2013











 
 
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