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Class Information
Number: 257/734
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead
Description: Subject matter wherein the active solid-state device is provided with one or more electrical contacts or leads.


Sub-classes under this class:

Class Number Class Name Patents
257/780 Ball or nail head type contact, lead, or bond 1,279
257/735 Beam leads (i.e., leads that extend beyond the ends or sides of a chip component) 362
257/737 Bump leads 1,765
257/785 By pressure alone 216
257/777 Chip mounted on chip 1,682
257/786 Configuration or pattern of bonds 1,514
257/782 Die bond 549
257/778 Flip chip 2,424
257/773 Of specified configuration 1,837
257/741 Of specified material other than unalloyed aluminum 290
257/779 Solder wettable contact, lead, or bond 823
257/784 Wire contact, lead, or bond 1,564
257/740 With means to prevent contact from penetrating shallow pn junction (e.g., prevention of aluminum "spiking") 70
257/739 With textured surface 123


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

Patent Number Title Of Patent Date Issued
7456502 Wiring board with connection electrode formed in opening and semiconductor device using the same Nov. 25, 2008
7452803 Method for fabricating chip structure Nov. 18, 2008
7453148 Structure of dielectric layers in built-up layers of wafer level package Nov. 18, 2008
7446384 CMOS image sensor module with wafers Nov. 4, 2008
7443027 Electronic device having coalesced metal nanoparticles Oct. 28, 2008
7443028 Imaging module and method for forming the same Oct. 28, 2008
7439624 Enhanced mechanical strength via contacts Oct. 21, 2008
7432584 Leadframe for use in a semiconductor package Oct. 7, 2008
7429795 Bond pad structure Sep. 30, 2008
7427813 Structure, material, and design for assembling a low-K Si die to achieve an industrial grade reliability wire bonding package Sep. 23, 2008
7423332 Vertical laminated electrical switch circuit Sep. 9, 2008
7416964 Semiconductor wafer, semiconductor chip and dicing method of a semiconductor wafer Aug. 26, 2008
7413971 Method of producing a layered arrangement and layered arrangement Aug. 19, 2008
7414299 Semiconductor package assembly and method for electrically isolating modules Aug. 19, 2008
7411219 Uniform contact Aug. 12, 2008
7408244 Semiconductor package and stack arrangement thereof Aug. 5, 2008
7408260 Microelectronic assemblies having compliant layers Aug. 5, 2008
7405485 Semiconductor device Jul. 29, 2008
7405420 Method and system for chalcogenide-based nanowire memory Jul. 29, 2008
7405419 Unidirectionally conductive materials for interconnection Jul. 29, 2008
7402907 Semiconductor device and manufacturing method thereof Jul. 22, 2008
7400039 Semiconductor device and semiconductor package Jul. 15, 2008
7397097 Integrated released beam layer structure fabricated in trenches and manufacturing method thereof Jul. 8, 2008
7394088 Thermally contained/insulated phase change memory device and method (combined) Jul. 1, 2008
7391110 Apparatus for providing capacitive decoupling between on-die power and ground conductors Jun. 24, 2008
7391111 Systems and methods for maintaining performance at a reduced power Jun. 24, 2008
7385287 Preventing damage to low-k materials during resist stripping Jun. 10, 2008
7382057 Surface structure of flip chip substrate Jun. 3, 2008
7382053 Power supply wiring structure Jun. 3, 2008
7381634 Integrated circuit system for bonding Jun. 3, 2008
7378616 Heating apparatus and method for semiconductor devices May. 27, 2008
7375032 Semiconductor substrate thinning method for manufacturing thinned die May. 20, 2008
7368326 Methods and apparatus to reduce growth formations on plated conductive leads May. 6, 2008
7368817 Bump-on-lead flip chip interconnection May. 6, 2008
7369090 Ball Grid Array package having integrated antenna pad May. 6, 2008
7365436 Substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same Apr. 29, 2008
7365429 Semiconductor device and method for manufacturing the same Apr. 29, 2008
7365434 Semiconductor device and manufacturing method for the same Apr. 29, 2008
7361988 Apparatuses and methods to route line to line Apr. 22, 2008
7361976 Data carrier with a module with a reinforcement strip Apr. 22, 2008
7361987 Circuit device with at least partial packaging and method for forming Apr. 22, 2008
7352054 Semiconductor device having conducting portion of upper and lower conductive layers Apr. 1, 2008
7348679 Electronic part having reinforcing member Mar. 25, 2008
7348680 Electronic device and use thereof Mar. 25, 2008
7344984 Technique for enhancing stress transfer into channel regions of NMOS and PMOS transistors Mar. 18, 2008
7342319 Semiconductor integrated circuit package having electrically disconnected solder balls for mounting Mar. 11, 2008
7342312 Semiconductor device Mar. 11, 2008
7342308 Component stacking for integrated circuit electronic package Mar. 11, 2008
7339194 Semiconductor laser device and manufacturing method thereof Mar. 4, 2008
7335987 Semiconductor package and method for manufacturing the same Feb. 26, 2008

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16


 
 
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