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Class Information
Number: 257/734
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead
Description: Subject matter wherein the active solid-state device is provided with one or more electrical contacts or leads.
Sub-classes under this class:
| Class Number |
Class Name |
Patents |
| 257/780 |
Ball or nail head type contact, lead, or bond |
1,279 |
| 257/735 |
Beam leads (i.e., leads that extend beyond the ends or sides of a chip component) |
362 |
| 257/737 |
Bump leads |
1,765 |
| 257/785 |
By pressure alone |
216 |
| 257/777 |
Chip mounted on chip |
1,682 |
| 257/786 |
Configuration or pattern of bonds |
1,514 |
| 257/782 |
Die bond |
549 |
| 257/778 |
Flip chip |
2,424 |
| 257/773 |
Of specified configuration |
1,837 |
| 257/741 |
Of specified material other than unalloyed aluminum |
290 |
| 257/779 |
Solder wettable contact, lead, or bond |
823 |
| 257/784 |
Wire contact, lead, or bond |
1,564 |
| 257/740 |
With means to prevent contact from penetrating shallow pn junction (e.g., prevention of aluminum "spiking") |
70 |
| 257/739 |
With textured surface |
123 |
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7456502 |
Wiring board with connection electrode formed in opening and semiconductor device using the same |
Nov. 25, 2008 |
| 7452803 |
Method for fabricating chip structure |
Nov. 18, 2008 |
| 7453148 |
Structure of dielectric layers in built-up layers of wafer level package |
Nov. 18, 2008 |
| 7446384 |
CMOS image sensor module with wafers |
Nov. 4, 2008 |
| 7443027 |
Electronic device having coalesced metal nanoparticles |
Oct. 28, 2008 |
| 7443028 |
Imaging module and method for forming the same |
Oct. 28, 2008 |
| 7439624 |
Enhanced mechanical strength via contacts |
Oct. 21, 2008 |
| 7432584 |
Leadframe for use in a semiconductor package |
Oct. 7, 2008 |
| 7429795 |
Bond pad structure |
Sep. 30, 2008 |
| 7427813 |
Structure, material, and design for assembling a low-K Si die to achieve an industrial grade reliability wire bonding package |
Sep. 23, 2008 |
| 7423332 |
Vertical laminated electrical switch circuit |
Sep. 9, 2008 |
| 7416964 |
Semiconductor wafer, semiconductor chip and dicing method of a semiconductor wafer |
Aug. 26, 2008 |
| 7413971 |
Method of producing a layered arrangement and layered arrangement |
Aug. 19, 2008 |
| 7414299 |
Semiconductor package assembly and method for electrically isolating modules |
Aug. 19, 2008 |
| 7411219 |
Uniform contact |
Aug. 12, 2008 |
| 7408244 |
Semiconductor package and stack arrangement thereof |
Aug. 5, 2008 |
| 7408260 |
Microelectronic assemblies having compliant layers |
Aug. 5, 2008 |
| 7405485 |
Semiconductor device |
Jul. 29, 2008 |
| 7405420 |
Method and system for chalcogenide-based nanowire memory |
Jul. 29, 2008 |
| 7405419 |
Unidirectionally conductive materials for interconnection |
Jul. 29, 2008 |
| 7402907 |
Semiconductor device and manufacturing method thereof |
Jul. 22, 2008 |
| 7400039 |
Semiconductor device and semiconductor package |
Jul. 15, 2008 |
| 7397097 |
Integrated released beam layer structure fabricated in trenches and manufacturing method thereof |
Jul. 8, 2008 |
| 7394088 |
Thermally contained/insulated phase change memory device and method (combined) |
Jul. 1, 2008 |
| 7391110 |
Apparatus for providing capacitive decoupling between on-die power and ground conductors |
Jun. 24, 2008 |
| 7391111 |
Systems and methods for maintaining performance at a reduced power |
Jun. 24, 2008 |
| 7385287 |
Preventing damage to low-k materials during resist stripping |
Jun. 10, 2008 |
| 7382057 |
Surface structure of flip chip substrate |
Jun. 3, 2008 |
| 7382053 |
Power supply wiring structure |
Jun. 3, 2008 |
| 7381634 |
Integrated circuit system for bonding |
Jun. 3, 2008 |
| 7378616 |
Heating apparatus and method for semiconductor devices |
May. 27, 2008 |
| 7375032 |
Semiconductor substrate thinning method for manufacturing thinned die |
May. 20, 2008 |
| 7368326 |
Methods and apparatus to reduce growth formations on plated conductive leads |
May. 6, 2008 |
| 7368817 |
Bump-on-lead flip chip interconnection |
May. 6, 2008 |
| 7369090 |
Ball Grid Array package having integrated antenna pad |
May. 6, 2008 |
| 7365436 |
Substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same |
Apr. 29, 2008 |
| 7365429 |
Semiconductor device and method for manufacturing the same |
Apr. 29, 2008 |
| 7365434 |
Semiconductor device and manufacturing method for the same |
Apr. 29, 2008 |
| 7361988 |
Apparatuses and methods to route line to line |
Apr. 22, 2008 |
| 7361976 |
Data carrier with a module with a reinforcement strip |
Apr. 22, 2008 |
| 7361987 |
Circuit device with at least partial packaging and method for forming |
Apr. 22, 2008 |
| 7352054 |
Semiconductor device having conducting portion of upper and lower conductive layers |
Apr. 1, 2008 |
| 7348679 |
Electronic part having reinforcing member |
Mar. 25, 2008 |
| 7348680 |
Electronic device and use thereof |
Mar. 25, 2008 |
| 7344984 |
Technique for enhancing stress transfer into channel regions of NMOS and PMOS transistors |
Mar. 18, 2008 |
| 7342319 |
Semiconductor integrated circuit package having electrically disconnected solder balls for mounting |
Mar. 11, 2008 |
| 7342312 |
Semiconductor device |
Mar. 11, 2008 |
| 7342308 |
Component stacking for integrated circuit electronic package |
Mar. 11, 2008 |
| 7339194 |
Semiconductor laser device and manufacturing method thereof |
Mar. 4, 2008 |
| 7335987 |
Semiconductor package and method for manufacturing the same |
Feb. 26, 2008 |
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