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Class Information
Number: 257/734
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead
Description: Subject matter wherein the active solid-state device is provided with one or more electrical contacts or leads.
Sub-classes under this class:
| Class Number |
Class Name |
Patents |
| 257/780 |
Ball or nail head type contact, lead, or bond |
1,370 |
| 257/735 |
Beam leads (i.e., leads that extend beyond the ends or sides of a chip component) |
374 |
| 257/737 |
Bump leads |
1,919 |
| 257/785 |
By pressure alone |
221 |
| 257/777 |
Chip mounted on chip |
1,873 |
| 257/786 |
Configuration or pattern of bonds |
1,626 |
| 257/782 |
Die bond |
581 |
| 257/778 |
Flip chip |
2,594 |
| 257/773 |
Of specified configuration |
1,977 |
| 257/741 |
Of specified material other than unalloyed aluminum |
296 |
| 257/779 |
Solder wettable contact, lead, or bond |
881 |
| 257/784 |
Wire contact, lead, or bond |
1,705 |
| 257/740 |
With means to prevent contact from penetrating shallow pn junction (e.g., prevention of aluminum "spiking") |
70 |
| 257/739 |
With textured surface |
129 |
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615411 |
Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof |
Nov. 10, 2009 |
| 7608932 |
Deterministic generation of an integrated circuit identification number |
Oct. 27, 2009 |
| 7605474 |
Structure of polymer-matrix conductive film and method for fabricating the same |
Oct. 20, 2009 |
| 7602070 |
Room temperature metal direct bonding |
Oct. 13, 2009 |
| 7602063 |
Semiconductor device and manufacturing method therefor |
Oct. 13, 2009 |
| 7602061 |
Semiconductor device and method for manufacturing semiconductor device |
Oct. 13, 2009 |
| 7598603 |
Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink |
Oct. 6, 2009 |
| 7598609 |
Structure of polymer-matrix conductive film and method for fabricating the same |
Oct. 6, 2009 |
| 7598617 |
Stack package utilizing through vias and re-distribution lines |
Oct. 6, 2009 |
| 7595562 |
Device package structure, device packaging method, droplet ejection head, connector, and semiconductor device |
Sep. 29, 2009 |
| 7592702 |
Via heat sink material |
Sep. 22, 2009 |
| 7589422 |
Micro-element package having a dual-thickness substrate and manufacturing method thereof |
Sep. 15, 2009 |
| 7589421 |
Heat-radiating semiconductor chip, tape wiring substrate and tape package using the same |
Sep. 15, 2009 |
| 7586186 |
Ball grid array |
Sep. 8, 2009 |
| 7582976 |
Semiconductor device tape carrier, manufacturing method for semiconductor device, semiconductor device, and semiconductor module device |
Sep. 1, 2009 |
| 7582966 |
Semiconductor chip and method for fabricating the same |
Sep. 1, 2009 |
| 7582919 |
Functional coating of the SCFM preform |
Sep. 1, 2009 |
| 7576424 |
Semiconductor device |
Aug. 18, 2009 |
| 7577323 |
Photoelectric circuit board |
Aug. 18, 2009 |
| 7569411 |
Metal MEMS devices and methods of making same |
Aug. 4, 2009 |
| 7569938 |
Interconnections for integrated circuits |
Aug. 4, 2009 |
| 7566968 |
Biosensor with smart card configuration |
Jul. 28, 2009 |
| 7564136 |
Integration scheme for Cu/low-k interconnects |
Jul. 21, 2009 |
| 7564130 |
Power micro surface-mount device package |
Jul. 21, 2009 |
| 7560743 |
Electro-optical device, method of manufacturing the same, and image forming apparatus |
Jul. 14, 2009 |
| 7560814 |
Semiconductor device that improves electrical connection reliability |
Jul. 14, 2009 |
| 7557444 |
Power-via structure for integration in advanced logic/smart-power technologies |
Jul. 7, 2009 |
| 7554136 |
Micro-switch device and method for manufacturing the same |
Jun. 30, 2009 |
| 7554201 |
Tin-bismuth (Sn-Bi) family alloy solder and semiconductor device using the same |
Jun. 30, 2009 |
| 7550830 |
Stacked semiconductor package having fan-out structure through wire bonding |
Jun. 23, 2009 |
| 7550833 |
Semiconductor device having a second semiconductor construction mounted on a first semiconductor construction and a manufacturing method thereof |
Jun. 23, 2009 |
| 7550842 |
Integrated circuit assembly |
Jun. 23, 2009 |
| 7550843 |
Semiconductor device including a base member and a semiconductor constructing body directly fixed to thermosetting resin of the base member |
Jun. 23, 2009 |
| 7547967 |
Semiconductor device and method of manufacturing the same |
Jun. 16, 2009 |
| 7545044 |
Semiconductor device and radiation detector employing it |
Jun. 9, 2009 |
| 7545037 |
Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same |
Jun. 9, 2009 |
| 7545031 |
Multipackage module having stacked packages with asymmetrically arranged die and molding |
Jun. 9, 2009 |
| 7545653 |
Semiconductor integrated circuit device |
Jun. 9, 2009 |
| 7538428 |
Semiconductor device |
May. 26, 2009 |
| 7533361 |
System and process for manufacturing custom electronics by combining traditional electronics with printable electronics |
May. 12, 2009 |
| 7531906 |
Flip chip packaging using recessed interposer terminals |
May. 12, 2009 |
| 7531896 |
Semiconductor device having a minimal via resistance created by applying a nitrogen plasma to a titanium via liner |
May. 12, 2009 |
| 7528478 |
Semiconductor devices having post passivation interconnections and a buffer layer |
May. 5, 2009 |
| 7525186 |
Stack package having guard ring which insulates through-via interconnection plug and method for manufacturing the same |
Apr. 28, 2009 |
| 7521796 |
Method of making the semiconductor device, circuit board, and electronic instrument |
Apr. 21, 2009 |
| 7518240 |
Deposition pattern for eliminating backside metal peeling during die separation in semiconductor device fabrication |
Apr. 14, 2009 |
| 7518239 |
Semiconductor device with substrate having penetrating hole having a protrusion |
Apr. 14, 2009 |
| 7518223 |
Semiconductor devices and semiconductor device assemblies including a nonconfluent spacer layer |
Apr. 14, 2009 |
| 7514340 |
Composite integrated device and methods for forming thereof |
Apr. 7, 2009 |
| 7514751 |
SiGe DIAC ESD protection structure |
Apr. 7, 2009 |
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