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Browse by Category: Main > Physics
Class Information
Number: 257/733
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With housing mount > Stud mount
Description: Subject matter wherein the housing mount is a threaded element shaped like a bolt extending from the housing for fastening into a threaded hole in a support.










Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8703599 Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts Apr. 22, 2014
8687668 Multi-wavelength semiconductor laser device Apr. 1, 2014
8664748 Package-level integrated circuit connection without top metal pads or bonding wire Mar. 4, 2014
8633059 Integrated circuit packaging system with interconnect and method of manufacture thereof Jan. 21, 2014
8610292 Resin sealing method of semiconductor device Dec. 17, 2013
8592992 Semiconductor device and method of forming vertical interconnect structure with conductive micro via array for 3-D Fo-WLCSP Nov. 26, 2013
8564115 Package structure having micro-electromechanical element Oct. 22, 2013
8551814 Method of fabricating a semiconductor device that limits damage to elements of the semiconductor device that are exposed during processing Oct. 8, 2013
8518743 Die structure and die connecting method Aug. 27, 2013
8497586 Package module structure for high power device with metal substrate and method of manufacturing the same Jul. 30, 2013
8404523 Method for fabricating stacked semiconductor system with encapsulated through wire interconnects (TWI) Mar. 26, 2013
8354747 Conductive polymer lid for a sensor package and method therefor Jan. 15, 2013
8351482 Multi-wavelength semiconductor laser device Jan. 8, 2013
8319332 Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts Nov. 27, 2012
8304900 Integrated circuit packaging system with stacked lead and method of manufacture thereof Nov. 6, 2012
8264077 Backside metal of redistribution line with silicide layer on through-silicon via of semiconductor chips Sep. 11, 2012
8247895 4D device process and structure Aug. 21, 2012
8217510 Semiconductor module system having stacked components with encapsulated through wire interconnects (TWI) Jul. 10, 2012
8198689 Package structure having micro-electromechanical element and fabrication method thereof Jun. 12, 2012
8125081 Semiconductor device, printed wiring board for mounting the semiconductor device and connecting structure for these Feb. 28, 2012
8120167 System with semiconductor components having encapsulated through wire interconnects (TWI) Feb. 21, 2012
8089149 Semiconductor device Jan. 3, 2012
8053282 Mounting structure of component of lighting device and method thereof Nov. 8, 2011
8004089 Semiconductor device having wiring line and manufacturing method thereof Aug. 23, 2011
8003447 Multi-chip module for battery power control Aug. 23, 2011
7989852 Integrated circuits and interconnect structure for integrated circuits Aug. 2, 2011
7985639 Method for fabricating a semiconductor device having a semiconductive resistor structure Jul. 26, 2011
7939937 Chip housing having reduced induced vibration May. 10, 2011
7932590 Stacked-die electronics package with planar and three-dimensional inductor elements Apr. 26, 2011
7902653 Semiconductor module Mar. 8, 2011
7902663 Semiconductor package having stepwise depression in substrate Mar. 8, 2011
7883908 Method for fabricating semiconductor component having encapsulated through wire interconnect (TWI) Feb. 8, 2011
7868432 Multi-chip module for battery power control Jan. 11, 2011
7858438 Semiconductor device, chip package and method of fabricating the same Dec. 28, 2010
7847375 Electronic device and method of manufacturing same Dec. 7, 2010
7790504 Integrated circuit package system Sep. 7, 2010
7777328 Substrate and multilayer circuit board Aug. 17, 2010
7755189 Metal cap with ringed projection to be welded to stem and ringed groove provided immediately inside of ringed projection and optical device having the same Jul. 13, 2010
7745944 Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts Jun. 29, 2010
7732931 Semiconductor package and method for manufacturing the same for decreasing number of processes Jun. 8, 2010
7723846 Power semiconductor module and method of manufacturing the same May. 25, 2010
7709968 Micro pin grid array with pin motion isolation May. 4, 2010
7701048 Power module for low thermal resistance and method of fabricating the same Apr. 20, 2010
7659612 Semiconductor components having encapsulated through wire interconnects (TWI) Feb. 9, 2010
7656031 Stackable semiconductor package having metal pin within through hole of package Feb. 2, 2010
7642634 Chip package and stacked structure of chip packages Jan. 5, 2010
7619304 Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof Nov. 17, 2009
7605467 Package and electronic apparatus using the same Oct. 20, 2009
7595553 Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus Sep. 29, 2009
7582965 Electronic device and method for bonding an electronic device Sep. 1, 2009

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