| |
 |
|
Class Information
Number: 257/733
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With housing mount > Stud mount
Description: Subject matter wherein the housing mount is a threaded element shaped like a bolt extending from the housing for fastening into a threaded hole in a support.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7416332 |
Flexible circuit temperature sensor assembly for flanged mounted electronic devices |
Aug. 26, 2008 |
| 7274093 |
Semiconductor device connector, semiconductor device carrier, semiconductor device socket using the same and probe card |
Sep. 25, 2007 |
| 7272015 |
Electronic unit with EMC shielding |
Sep. 18, 2007 |
| 7271034 |
Semiconductor device with a high thermal dissipation efficiency |
Sep. 18, 2007 |
| 7247942 |
Techniques for joining an opto-electronic module to a semiconductor package |
Jul. 24, 2007 |
| 7183647 |
Wiring substrate and electronic parts packaging structure |
Feb. 27, 2007 |
| 7164196 |
Semiconductor device |
Jan. 16, 2007 |
| 7102228 |
Semiconductor device |
Sep. 5, 2006 |
| 7091592 |
Stacked package for electronic elements and packaging method thereof |
Aug. 15, 2006 |
| 7091582 |
Electronic package with snap-on perimeter wall |
Aug. 15, 2006 |
| 7030477 |
Optical semiconductor device |
Apr. 18, 2006 |
| 7026709 |
Stacked chip-packaging structure |
Apr. 11, 2006 |
| 6870261 |
Discrete circuit component having an up-right circuit die with lateral electrical connections |
Mar. 22, 2005 |
| 6822318 |
Stress isolating die attach structure and method |
Nov. 23, 2004 |
| 6762491 |
Power semiconductor device |
Jul. 13, 2004 |
| 6750551 |
Direct BGA attachment without solder reflow |
Jun. 15, 2004 |
| 6713844 |
Semiconductor-chip mounting substrate having at least one projection thereon and a pressure holding means |
Mar. 30, 2004 |
| 6670698 |
Integrated circuit package mounting |
Dec. 30, 2003 |
| 6495914 |
Multi-chip module structure having conductive blocks to provide electrical connection between conductors on first and second sides of a conductive base substrate |
Dec. 17, 2002 |
| 6465883 |
Capsule for at least one high power transistor chip for high frequencies |
Oct. 15, 2002 |
| 6430052 |
Techniques for cooling a circuit board component |
Aug. 6, 2002 |
| 6297548 |
Stackable ceramic FBGA for high thermal applications |
Oct. 2, 2001 |
| 6208020 |
Leadframe for use in manufacturing a resin-molded semiconductor device |
Mar. 27, 2001 |
| 6072235 |
Terminal arrangement for an SMD-capable hybrid circuit |
Jun. 6, 2000 |
| 6060780 |
Surface mount type unit and transducer assembly using same |
May. 9, 2000 |
| 6049464 |
Electronic modules manufacturing |
Apr. 11, 2000 |
| 5986342 |
Liquid crystal display apparatus structure for mounting semiconductor device |
Nov. 16, 1999 |
| 5770891 |
Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer |
Jun. 23, 1998 |
| 5736787 |
Transistor package structured to provide heat dissipation enabling use of silicon carbide transistors and other high power semiconductor devices |
Apr. 7, 1998 |
| 5677569 |
Semiconductor multi-package stack |
Oct. 14, 1997 |
| 5543659 |
Package for power semiconductor device with snubber circuit |
Aug. 6, 1996 |
| 5519253 |
Coaxial switch module |
May. 21, 1996 |
| RE34794 |
Gull-wing zig-zag inline lead package having end-of-package anchoring pins |
Nov. 22, 1994 |
| 5278728 |
Diode mounting |
Jan. 11, 1994 |
| 5260601 |
Edge-mounted, surface-mount package for semiconductor integrated circuit devices |
Nov. 9, 1993 |
| 5256902 |
Metal heatsink attach system |
Oct. 26, 1993 |
| 5198887 |
Semiconductor chip carrier |
Mar. 30, 1993 |
| 5134460 |
Aluminum bump, reworkable bump, and titanium nitride structure for tab bonding |
Jul. 28, 1992 |
| 4975763 |
Edge-mounted, surface-mount package for semiconductor integrated circuit devices |
Dec. 4, 1990 |
| 4792844 |
Pressure contact semiconductor device |
Dec. 20, 1988 |
| 4774558 |
Thermally-activated, shorting diode switch having non-operationally-alterable junction path |
Sep. 27, 1988 |
| 4760037 |
Pressure contact type semiconductor device |
Jul. 26, 1988 |
| 4661834 |
Semiconductor structures and manufacturing methods |
Apr. 28, 1987 |
| 4567598 |
Optoelectronic semiconductor devices in hermetically sealed packages |
Jan. 28, 1986 |
| 4536469 |
Semiconductor structures and manufacturing methods |
Aug. 20, 1985 |
| 4425575 |
Base for encapsulating components with coplanar electrodes |
Jan. 10, 1984 |
| 4420767 |
Thermally balanced leadless microelectronic circuit chip carrier |
Dec. 13, 1983 |
| 4394679 |
Light emitting device with a continuous layer of copper covering the entire header |
Jul. 19, 1983 |
| 4355718 |
Grammophone record sleeve |
Oct. 26, 1982 |
| 4347655 |
Mounting arrangement for semiconductor optoelectronic devices |
Sep. 7, 1982 |
|
|
|
