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Class Information
Number: 257/732
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With housing mount > Flanged mount
Description: Subject matter wherein the housing mount is a flange with openings therein (e.g., threaded holes) to permit the housing to be attached (e.g., by fasteners) to a support.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7425758 |
Metal core foldover package structures |
Sep. 16, 2008 |
| 7416332 |
Flexible circuit temperature sensor assembly for flanged mounted electronic devices |
Aug. 26, 2008 |
| 7361880 |
Digital camera module for detachably mounting with flex printed circuit board |
Apr. 22, 2008 |
| 7358106 |
Hermetic MEMS package and method of manufacture |
Apr. 15, 2008 |
| 7329947 |
Heat treatment jig for semiconductor substrate |
Feb. 12, 2008 |
| 7298046 |
Semiconductor package having non-ceramic based window frame |
Nov. 20, 2007 |
| 7282793 |
Multiple die stack apparatus employing T-shaped interposer elements |
Oct. 16, 2007 |
| 7253520 |
CSP semiconductor device having signal and radiation bump groups |
Aug. 7, 2007 |
| 7242085 |
Semiconductor device including a semiconductor chip mounted on a metal base |
Jul. 10, 2007 |
| 7138713 |
Chip-type solid electrolytic capacitor and method of producing the same |
Nov. 21, 2006 |
| 7102228 |
Semiconductor device |
Sep. 5, 2006 |
| 7095098 |
Electrically isolated and thermally conductive double-sided pre-packaged component |
Aug. 22, 2006 |
| 7061101 |
Carrier module |
Jun. 13, 2006 |
| 7030477 |
Optical semiconductor device |
Apr. 18, 2006 |
| 7012331 |
Device for mounting a semiconductor package on a support plate via a base |
Mar. 14, 2006 |
| 6992375 |
Anchor for device package |
Jan. 31, 2006 |
| 6911723 |
Multiple die stack apparatus employing T-shaped interposer elements |
Jun. 28, 2005 |
| 6909182 |
Spherical semiconductor device and method for fabricating the same |
Jun. 21, 2005 |
| 6891259 |
Semiconductor package having dam and method for fabricating the same |
May. 10, 2005 |
| 6882040 |
Semiconductor device |
Apr. 19, 2005 |
| 6878875 |
Small form factor optical transceiver with extended transmission range |
Apr. 12, 2005 |
| 6879033 |
Semiconductor device |
Apr. 12, 2005 |
| 6864573 |
Two piece heat sink and device package |
Mar. 8, 2005 |
| 6853066 |
Semiconductor device |
Feb. 8, 2005 |
| 6849947 |
Semiconductor device and pattern layout method thereof |
Feb. 1, 2005 |
| 6841865 |
Semiconductor device having clips for connecting to external elements |
Jan. 11, 2005 |
| 6825558 |
Carrier module for .mu.-BGA type device |
Nov. 30, 2004 |
| 6812553 |
Electrically isolated and thermally conductive double-sided pre-packaged component |
Nov. 2, 2004 |
| 6806561 |
Electronic apparatus |
Oct. 19, 2004 |
| 6791184 |
Support assembly for an integrated circuit package having solder columns |
Sep. 14, 2004 |
| 6787900 |
Semiconductor module and insulating substrate thereof |
Sep. 7, 2004 |
| 6756667 |
Hermetically sealed semiconductor power module and large scale module comprising the same |
Jun. 29, 2004 |
| 6742169 |
Semiconductor device |
May. 25, 2004 |
| 6734548 |
High-power double throw lever zip socket |
May. 11, 2004 |
| 6677669 |
Semiconductor package including two semiconductor die disposed within a common clip |
Jan. 13, 2004 |
| 6670698 |
Integrated circuit package mounting |
Dec. 30, 2003 |
| 6657294 |
Data carrier having an IC module with a protection mechanism for protecting the parts of the IC module from mechanical stress |
Dec. 2, 2003 |
| 6624448 |
Semiconductor device with multiple supporting points |
Sep. 23, 2003 |
| 6621154 |
Semiconductor apparatus having stress cushioning layer |
Sep. 16, 2003 |
| 6566751 |
Carrier module for holding a .mu.-BGU type device for testing |
May. 20, 2003 |
| 6541874 |
Encapsulation of microelectronic assemblies |
Apr. 1, 2003 |
| 6489634 |
Microelectronic device structure utilizing a diamond inlay in a package flange |
Dec. 3, 2002 |
| 6465883 |
Capsule for at least one high power transistor chip for high frequencies |
Oct. 15, 2002 |
| 6462413 |
LDMOS transistor heatsink package assembly and manufacturing method |
Oct. 8, 2002 |
| 6414389 |
Alignment pedestals in an LDMOS power package |
Jul. 2, 2002 |
| 6392298 |
Functional lid for RF power package |
May. 21, 2002 |
| 6355979 |
Hard mask for copper plasma etch |
Mar. 12, 2002 |
| 6351028 |
Multiple die stack apparatus employing T-shaped interposer elements |
Feb. 26, 2002 |
| 6348727 |
High current semiconductor device package with plastic housing and conductive tab |
Feb. 19, 2002 |
| 6331730 |
Push-in type semiconductor device including heat spreader |
Dec. 18, 2001 |
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