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Browse by Category: Main > Physics
Class Information
Number: 257/732
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With housing mount > Flanged mount
Description: Subject matter wherein the housing mount is a flange with openings therein (e.g., threaded holes) to permit the housing to be attached (e.g., by fasteners) to a support.










Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8687668 Multi-wavelength semiconductor laser device Apr. 1, 2014
8648461 Semiconductor device Feb. 11, 2014
8630326 Method and system of heterogeneous substrate bonding for photonic integration Jan. 14, 2014
8624369 Balance filter packaging chip having balun mounted therein and manufacturing method thereof Jan. 7, 2014
8611388 Method and system for heterogeneous substrate bonding of waveguide receivers Dec. 17, 2013
8583311 Overhead wire transportation system and control method thereof Nov. 12, 2013
8471289 Semiconductor laser device, optical pickup device and semiconductor device Jun. 25, 2013
8461689 Packaging structure having embedded semiconductor element Jun. 11, 2013
8421223 Conductive structure for a semiconductor integrated circuit Apr. 16, 2013
8410601 RF package Apr. 2, 2013
8373249 Programmable capacitor associated with an input/output pad Feb. 12, 2013
8351482 Multi-wavelength semiconductor laser device Jan. 8, 2013
RE43807 Microcircuit package having ductile layer Nov. 20, 2012
8299610 Semiconductor device having RF shielding and method therefor Oct. 30, 2012
8288845 Package including proximately-positioned lead frame Oct. 16, 2012
8238108 Power semiconductor module system Aug. 7, 2012
8198712 Hermetically sealed semiconductor device module Jun. 12, 2012
8072047 Integrated circuit package system with shield and tie bar Dec. 6, 2011
8026583 Flip-chip module and method for the production thereof Sep. 27, 2011
7994630 Power transistor package with integrated bus bar Aug. 9, 2011
7989951 Die assemblies Aug. 2, 2011
7961470 Power amplifier Jun. 14, 2011
7960829 Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates Jun. 14, 2011
7923822 Integrated circuit package system including shield Apr. 12, 2011
7902663 Semiconductor package having stepwise depression in substrate Mar. 8, 2011
7902653 Semiconductor module Mar. 8, 2011
7898080 Power semiconductor device comprising a semiconductor chip stack and method for producing the same Mar. 1, 2011
7851903 Infrared detector with plurality of metallization between first and second container members Dec. 14, 2010
7823322 Silicon chip having inclined contact pads and electronic module comprising such a chip Nov. 2, 2010
7741711 Power semiconductor module with a connected substrate carrier and production method therefor Jun. 22, 2010
7728417 Integrated circuit package system including shield Jun. 1, 2010
7723846 Power semiconductor module and method of manufacturing the same May. 25, 2010
7692299 Semiconductor apparatus having improved thermal fatigue life Apr. 6, 2010
7683268 Semiconductor module with high process accuracy, manufacturing method thereof, and semiconductor device therewith Mar. 23, 2010
7679185 Microcircuit package having ductile layer Mar. 16, 2010
7602054 Method of forming a molded array package device having an exposed tab and structure Oct. 13, 2009
7595553 Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus Sep. 29, 2009
7582964 Semiconductor package having non-ceramic based window frame Sep. 1, 2009
7518227 Multiple die stack apparatus employing T-shaped interposer elements Apr. 14, 2009
7518238 Mounting flexible circuits onto integrated circuit substrates Apr. 14, 2009
7508063 Low cost hermetically sealed package Mar. 24, 2009
7504670 Sealing structure for mounting a semiconductor device to a substrate Mar. 17, 2009
7425758 Metal core foldover package structures Sep. 16, 2008
7416332 Flexible circuit temperature sensor assembly for flanged mounted electronic devices Aug. 26, 2008
7361880 Digital camera module for detachably mounting with flex printed circuit board Apr. 22, 2008
7358106 Hermetic MEMS package and method of manufacture Apr. 15, 2008
7329947 Heat treatment jig for semiconductor substrate Feb. 12, 2008
7298046 Semiconductor package having non-ceramic based window frame Nov. 20, 2007
7282793 Multiple die stack apparatus employing T-shaped interposer elements Oct. 16, 2007
7253520 CSP semiconductor device having signal and radiation bump groups Aug. 7, 2007

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