| |
 |
|
Class Information
Number: 257/730
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Outside periphery of package having specified shape or configuration
Description: Subject matter wherein the outside periphery of a package or housing has a particular shape or configuration.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618896 |
Semiconductor die package including multiple dies and a common node structure |
Nov. 17, 2009 |
| 7618575 |
Method for wafer scale molding of protective caps |
Nov. 17, 2009 |
| 7612386 |
High power light emitting diode device |
Nov. 3, 2009 |
| 7612443 |
Inter-chip communication |
Nov. 3, 2009 |
| 7608920 |
Memory card and method for devising |
Oct. 27, 2009 |
| 7605454 |
Memory card and method for devising |
Oct. 20, 2009 |
| 7596850 |
Method for temporarily inactivating a wireless communication device |
Oct. 6, 2009 |
| 7598611 |
Semiconductor device with side terminals |
Oct. 6, 2009 |
| 7595547 |
Semiconductor die package including cup-shaped leadframe |
Sep. 29, 2009 |
| 7595553 |
Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus |
Sep. 29, 2009 |
| 7592699 |
Hidden plating traces |
Sep. 22, 2009 |
| 7582964 |
Semiconductor package having non-ceramic based window frame |
Sep. 1, 2009 |
| 7579688 |
Heat radiation structure of semiconductor device, and manufacturing method thereof |
Aug. 25, 2009 |
| 7554167 |
Three-dimensional analog input control device |
Jun. 30, 2009 |
| 7541294 |
Semiconductor package and semiconductor package mounting method |
Jun. 2, 2009 |
| 7538421 |
Flip-chip package structure with stiffener |
May. 26, 2009 |
| 7538425 |
Power semiconductor package having integral fluid cooling |
May. 26, 2009 |
| 7528482 |
Embedded chip package with improved heat dissipation performance and method of making the same |
May. 5, 2009 |
| 7528477 |
Castellation wafer level packaging of integrated circuit chips |
May. 5, 2009 |
| 7521795 |
Semiconductor package |
Apr. 21, 2009 |
| 7521807 |
Semiconductor device with inclined through holes |
Apr. 21, 2009 |
| 7518223 |
Semiconductor devices and semiconductor device assemblies including a nonconfluent spacer layer |
Apr. 14, 2009 |
| 7518239 |
Semiconductor device with substrate having penetrating hole having a protrusion |
Apr. 14, 2009 |
| 7511379 |
Surface mountable direct chip attach device and method including integral integrated circuit |
Mar. 31, 2009 |
| 7508056 |
Surface mount hermetic package for power semiconductor die |
Mar. 24, 2009 |
| 7508058 |
Stacked integrated circuit module |
Mar. 24, 2009 |
| 7504670 |
Sealing structure for mounting a semiconductor device to a substrate |
Mar. 17, 2009 |
| 7504722 |
Semiconductor device with slanting side surface for external connection |
Mar. 17, 2009 |
| 7501703 |
Acoustic transducer module |
Mar. 10, 2009 |
| 7498660 |
Semiconductor device |
Mar. 3, 2009 |
| 7492044 |
System and method for decreasing stress on solder holding BGA module to computer motherboard |
Feb. 17, 2009 |
| 7479697 |
Resilient carrier assembly for an integrated circuit |
Jan. 20, 2009 |
| 7476952 |
Semiconductor input control device |
Jan. 13, 2009 |
| 7476964 |
High voltage semiconductor device housing with increased clearance between housing can and die for improved flux flushing |
Jan. 13, 2009 |
| 7466015 |
Supporting frame for surface-mount diode package |
Dec. 16, 2008 |
| 7466022 |
Wafer-level seal for non-silicon-based devices |
Dec. 16, 2008 |
| 7459784 |
High capacity thin module system |
Dec. 2, 2008 |
| 7446383 |
Electronic device mountable onto a substrate using surface mount techniques, and method |
Nov. 4, 2008 |
| 7446406 |
Circuit device and manufacturing method thereof |
Nov. 4, 2008 |
| 7446410 |
Circuit module with thermal casing systems |
Nov. 4, 2008 |
| 7443038 |
Flip-chip image sensor packages |
Oct. 28, 2008 |
| 7443023 |
High capacity thin module system |
Oct. 28, 2008 |
| 7443016 |
Semiconductor device for use as multimedia memory card, has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of |
Oct. 28, 2008 |
| 7442968 |
Chip on film (COF) package having test pad for testing electrical function of chip and method for manufacturing same |
Oct. 28, 2008 |
| 7439616 |
Miniature silicon condenser microphone |
Oct. 21, 2008 |
| 7436061 |
Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device |
Oct. 14, 2008 |
| 7436077 |
Semiconductor device and method of manufacturing the same |
Oct. 14, 2008 |
| 7432600 |
System having semiconductor component with multiple stacked dice |
Oct. 7, 2008 |
| 7429787 |
Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides |
Sep. 30, 2008 |
| 7427806 |
Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component |
Sep. 23, 2008 |
|
|
|
