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Class Information
Number: 257/730
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Outside periphery of package having specified shape or configuration
Description: Subject matter wherein the outside periphery of a package or housing has a particular shape or configuration.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459784 |
High capacity thin module system |
Dec. 2, 2008 |
| 7446383 |
Electronic device mountable onto a substrate using surface mount techniques, and method |
Nov. 4, 2008 |
| 7446406 |
Circuit device and manufacturing method thereof |
Nov. 4, 2008 |
| 7446410 |
Circuit module with thermal casing systems |
Nov. 4, 2008 |
| 7443023 |
High capacity thin module system |
Oct. 28, 2008 |
| 7443016 |
Semiconductor device for use as multimedia memory card, has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of |
Oct. 28, 2008 |
| 7442968 |
Chip on film (COF) package having test pad for testing electrical function of chip and method for manufacturing same |
Oct. 28, 2008 |
| 7443038 |
Flip-chip image sensor packages |
Oct. 28, 2008 |
| 7439616 |
Miniature silicon condenser microphone |
Oct. 21, 2008 |
| 7436077 |
Semiconductor device and method of manufacturing the same |
Oct. 14, 2008 |
| 7436061 |
Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device |
Oct. 14, 2008 |
| 7432600 |
System having semiconductor component with multiple stacked dice |
Oct. 7, 2008 |
| 7429787 |
Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides |
Sep. 30, 2008 |
| 7427806 |
Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component |
Sep. 23, 2008 |
| 7425758 |
Metal core foldover package structures |
Sep. 16, 2008 |
| 7417309 |
Circuit device and portable device with symmetrical arrangement |
Aug. 26, 2008 |
| 7414305 |
Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices |
Aug. 19, 2008 |
| 7408259 |
Sheet to form a protective film for chips |
Aug. 5, 2008 |
| 7405477 |
Ball grid array package-to-board interconnect co-design apparatus |
Jul. 29, 2008 |
| 7396741 |
Method for connecting substrate and composite element |
Jul. 8, 2008 |
| 7397118 |
Ceramic chip-type electronic component and method of making the same |
Jul. 8, 2008 |
| 7394148 |
Module having stacked chip scale semiconductor packages |
Jul. 1, 2008 |
| 7391110 |
Apparatus for providing capacitive decoupling between on-die power and ground conductors |
Jun. 24, 2008 |
| 7391122 |
Techniques for flip chip package migration |
Jun. 24, 2008 |
| 7385298 |
Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same |
Jun. 10, 2008 |
| 7378748 |
Solid-state imaging device and method for manufacturing the same |
May. 27, 2008 |
| 7375421 |
High density multilayer circuit module |
May. 20, 2008 |
| 7372150 |
Semiconductor wafer having identification indication |
May. 13, 2008 |
| 7372141 |
Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides |
May. 13, 2008 |
| 7371673 |
Method and apparatus for attaching an IC package to a PCB assembly |
May. 13, 2008 |
| 7368795 |
Image sensor module with passive component |
May. 6, 2008 |
| 7368803 |
System and method for protecting microelectromechanical systems array using back-plate with non-flat portion |
May. 6, 2008 |
| 7364945 |
Method of mounting an integrated circuit package in an encapsulant cavity |
Apr. 29, 2008 |
| 7358602 |
Semiconductor chip, and semiconductor wafer including a variable thickness insulating layer |
Apr. 15, 2008 |
| 7354800 |
Method of fabricating a stacked integrated circuit package system |
Apr. 8, 2008 |
| 7355278 |
Mold die for a semiconductor device |
Apr. 8, 2008 |
| 7345359 |
Integrated circuit package with chip-side signal connections |
Mar. 18, 2008 |
| 7342311 |
Electronic unit integrated into a flexible polymer body |
Mar. 11, 2008 |
| 7341887 |
Integrated circuit die configuration for packaging |
Mar. 11, 2008 |
| 7335970 |
Semiconductor device having a chip-size package |
Feb. 26, 2008 |
| 7335987 |
Semiconductor package and method for manufacturing the same |
Feb. 26, 2008 |
| 7335994 |
Semiconductor component having multiple stacked dice |
Feb. 26, 2008 |
| 7329861 |
Integrally packaged imaging module |
Feb. 12, 2008 |
| 7327042 |
Interconnection structure of electric conductive wirings |
Feb. 5, 2008 |
| 7327020 |
Multi-chip package including at least one semiconductor device enclosed therein |
Feb. 5, 2008 |
| 7327019 |
Semiconductor device of a charge storage type |
Feb. 5, 2008 |
| 7319553 |
Optical modulator module package structure |
Jan. 15, 2008 |
| 7298046 |
Semiconductor package having non-ceramic based window frame |
Nov. 20, 2007 |
| 7288843 |
Integrated circuit chip support substrate for placing in a mold, and associated method |
Oct. 30, 2007 |
| 7285847 |
Chip stack package, connecting board, and method of connecting chips |
Oct. 23, 2007 |
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