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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Physics
Class Information
Number: 257/730
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Outside periphery of package having specified shape or configuration
Description: Subject matter wherein the outside periphery of a package or housing has a particular shape or configuration.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8709870 Method of forming solderable side-surface terminals of quad no-lead frame (QFN) integrated circuit packages Apr. 29, 2014
8710640 Integrated circuit packaging system with heat slug and method of manufacture thereof Apr. 29, 2014
8703535 Integrated circuit packaging system with warpage preventing mechanism and method of manufacture thereof Apr. 22, 2014
8703599 Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts Apr. 22, 2014
8692366 Apparatus and method for microelectromechanical systems device packaging Apr. 8, 2014
8691631 Device including two mounting surfaces Apr. 8, 2014
8680532 Method of fabricating a semiconductor device Mar. 25, 2014
8680692 Carrier, semiconductor package and fabrication method thereof Mar. 25, 2014
8669657 Stackable semiconductor assemblies and methods of manufacturing such assemblies Mar. 11, 2014
8659169 Corner structure for IC die Feb. 25, 2014
8653655 Semiconductor device and manufacturing method thereof Feb. 18, 2014
8648461 Semiconductor device Feb. 11, 2014
8644125 Seek scan probe (SSP) cantilever to mover wafer bond stop Feb. 4, 2014
8638000 Micromechanical method and corresponding assembly for bonding semiconductor substrates and correspondingly bonded semiconductor chip Jan. 28, 2014
8624358 Semiconductor substrate and semiconductor device Jan. 7, 2014
8623703 Silicon device and silicon device manufacturing method Jan. 7, 2014
8618573 Layered substrate, light-emitting diode including the layered substrate and lighting device using the light-emitting diode Dec. 31, 2013
8610156 Light emitting device package Dec. 17, 2013
8610292 Resin sealing method of semiconductor device Dec. 17, 2013
8587109 Stacked microelectronic dies and methods for stacking microelectronic dies Nov. 19, 2013
8581396 Semiconductor device Nov. 12, 2013
8581386 Chip package Nov. 12, 2013
8583311 Overhead wire transportation system and control method thereof Nov. 12, 2013
8575760 Semiconductor devices having electrodes Nov. 5, 2013
8575742 Semiconductor device with increased I/O leadframe including power bars Nov. 5, 2013
8569874 High memory density, high input/output bandwidth logic-memory structure and architecture Oct. 29, 2013
8551799 Encapsulated micro-electro-mechanical device, in particular a MEMS acoustic transducer Oct. 8, 2013
8536694 Semiconductor device Sep. 17, 2013
8531034 Semiconductor package and package on package having the same Sep. 10, 2013
8530266 Image sensor having metal grid with a triangular cross-section Sep. 10, 2013
8524534 Semiconductor device and manufacturing method thereof Sep. 3, 2013
8519547 Chip arrangement and method for producing a chip arrangement Aug. 27, 2013
8513790 Package-base structure of luminescent diode Aug. 20, 2013
8508639 Semiconductor module, MOS type solid-state image pickup device, camera and manufacturing method of camera Aug. 13, 2013
8487426 Semiconductor package with embedded die and manufacturing methods thereof Jul. 16, 2013
8487416 Coaxial power module Jul. 16, 2013
8487434 Integrated circuit package system with redistribution layer and method for manufacturing thereof Jul. 16, 2013
8481369 Method of making semiconductor package with improved standoff Jul. 9, 2013
8482026 Optoelectronic component Jul. 9, 2013
8476746 Package structure enhancing molding compound bondability Jul. 2, 2013
8471382 Package and high frequency terminal structure for the same Jun. 25, 2013
8471287 LED package and method for making the same Jun. 25, 2013
8471378 Power semiconductor device and method therefor Jun. 25, 2013
8466010 Seal ring support for backside illuminated image sensor Jun. 18, 2013
8461667 Semiconductor device Jun. 11, 2013
8461677 Magnetic field sensors and methods for fabricating the magnetic field sensors Jun. 11, 2013
8456000 Semiconductor module and an electronic system including the same Jun. 4, 2013
8456001 Pressure-contact semiconductor device Jun. 4, 2013
8448326 Method of manufacturing an accelerometer May. 28, 2013
8441112 Method of manufacturing layered chip package May. 14, 2013

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