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Class Information
Number: 257/729
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Portion of housing of specific materials
Description: Subject matter wherein at least a portion of the housing or package is made of specific materials.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7612445 |
Circuit apparatus and method of fabricating the apparatus |
Nov. 3, 2009 |
| 7596850 |
Method for temporarily inactivating a wireless communication device |
Oct. 6, 2009 |
| 7595553 |
Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus |
Sep. 29, 2009 |
| 7589420 |
Print head with reduced bonding stress and method |
Sep. 15, 2009 |
| 7586194 |
Semiconductor device having exposed heat dissipating metal plate |
Sep. 8, 2009 |
| 7586188 |
Chip package and coreless package substrate thereof |
Sep. 8, 2009 |
| 7582964 |
Semiconductor package having non-ceramic based window frame |
Sep. 1, 2009 |
| 7566957 |
Support device with discrete getter material microelectronic devices |
Jul. 28, 2009 |
| 7554196 |
Plastic package and semiconductor component comprising such a plastic package, and method for its production |
Jun. 30, 2009 |
| 7504670 |
Sealing structure for mounting a semiconductor device to a substrate |
Mar. 17, 2009 |
| 7489032 |
Semiconductor device including a hard sheet to reduce warping of a base plate and method of fabricating the same |
Feb. 10, 2009 |
| 7439616 |
Miniature silicon condenser microphone |
Oct. 21, 2008 |
| 7436077 |
Semiconductor device and method of manufacturing the same |
Oct. 14, 2008 |
| 7427786 |
Diode device utilizing bellows |
Sep. 23, 2008 |
| 7425758 |
Metal core foldover package structures |
Sep. 16, 2008 |
| 7425764 |
Top layers of metal for high performance IC's |
Sep. 16, 2008 |
| 7408259 |
Sheet to form a protective film for chips |
Aug. 5, 2008 |
| 7405477 |
Ball grid array package-to-board interconnect co-design apparatus |
Jul. 29, 2008 |
| 7384698 |
Metal article intended for at least partially coating with a substance and a method for producing the same |
Jun. 10, 2008 |
| 7372142 |
Vertical conduction power electronic device package and corresponding assembling method |
May. 13, 2008 |
| 7358605 |
Heat dissipation structure for electronic device |
Apr. 15, 2008 |
| 7332809 |
Glass substrate having a grooved portion, method for fabricating the same, and press mold for fabricating the glass substrate |
Feb. 19, 2008 |
| 7329861 |
Integrally packaged imaging module |
Feb. 12, 2008 |
| 7323238 |
Printed circuit board having colored outer layer |
Jan. 29, 2008 |
| 7301224 |
Surface acoustic wave device and manufacturing method of the same |
Nov. 27, 2007 |
| 7298039 |
Electronic circuit device |
Nov. 20, 2007 |
| 7298046 |
Semiconductor package having non-ceramic based window frame |
Nov. 20, 2007 |
| 7279239 |
Laminating product including adhesion layer and laminate product including protective film |
Oct. 9, 2007 |
| 7253029 |
Non-magnetic, hermetically-sealed micro device package |
Aug. 7, 2007 |
| 7247940 |
Optoelectronic device with patterned-metallized package body, method for producing such a device and method for the patterned metallization of a plastic-containing body |
Jul. 24, 2007 |
| 7217999 |
Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semiconductor chip on the interconnection board |
May. 15, 2007 |
| 7208827 |
Encasing arrangement for a semiconductor component |
Apr. 24, 2007 |
| 7192870 |
Semiconductor device and fabrication process therefor |
Mar. 20, 2007 |
| 7189449 |
Metal/ceramic bonding substrate and method for producing same |
Mar. 13, 2007 |
| 7180197 |
Semiconductor device containing stacked semiconductor chips and manufacturing method thereof |
Feb. 20, 2007 |
| 7176567 |
Semiconductor device protective structure and method for fabricating the same |
Feb. 13, 2007 |
| 7173325 |
Expansion constrained die stack |
Feb. 6, 2007 |
| 7166910 |
Miniature silicon condenser microphone |
Jan. 23, 2007 |
| 7145230 |
Semiconductor device with a solder creep-up prevention zone |
Dec. 5, 2006 |
| 7122243 |
Metal/ceramic bonding substrate and method for producing same |
Oct. 17, 2006 |
| 7115989 |
Adhesive sheet for producing a semiconductor device |
Oct. 3, 2006 |
| 7109575 |
Low-cost flexible film package module and method of manufacturing the same |
Sep. 19, 2006 |
| 7102228 |
Semiconductor device |
Sep. 5, 2006 |
| 7081661 |
High-frequency module and method for manufacturing the same |
Jul. 25, 2006 |
| 7078804 |
Micro-electro-mechanical system (MEMS) package with side sealing member and method of manufacturing the same |
Jul. 18, 2006 |
| 7071548 |
Semiconductor coated with a mixture containing an adhesion promoter |
Jul. 4, 2006 |
| 7053494 |
Semiconductor device and production method therefor |
May. 30, 2006 |
| 7042075 |
Electronic device sealed under vacuum containing a getter and method of operation |
May. 9, 2006 |
| 7038327 |
Anisotropic conductive film bonding pad |
May. 2, 2006 |
| 6984867 |
Magnetic memory device |
Jan. 10, 2006 |
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