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Class Information
Number: 257/729
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Portion of housing of specific materials
Description: Subject matter wherein at least a portion of the housing or package is made of specific materials.

Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
8680669 Electronic component, electronic module, and method for manufacturing the same Mar. 25, 2014
8664779 Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulus Mar. 4, 2014
8643165 Semiconductor device having agglomerate terminals Feb. 4, 2014
8637593 Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate Jan. 28, 2014
8637971 Semiconductor device and method of manufacturing semiconductor device Jan. 28, 2014
8633585 Device comprising an encapsulation unit Jan. 21, 2014
8608323 Barrier layer and a method of manufacturing the barrier layer Dec. 17, 2013
8610224 MEMS element and electrical device using the same Dec. 17, 2013
8604612 Chip attach adhesive to facilitate embedded chip build up and related systems and methods Dec. 10, 2013
8590136 Method of fabricating a dual single-crystal backplate microphone Nov. 26, 2013
8585272 Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate Nov. 19, 2013
8546934 Method for manufacturing semiconductor devices having a glass substrate Oct. 1, 2013
8546923 Rigid power module suited for high-voltage applications Oct. 1, 2013
8546933 Semiconductor apparatus including resin case Oct. 1, 2013
8481365 MEMS devices Jul. 9, 2013
8471382 Package and high frequency terminal structure for the same Jun. 25, 2013
8448326 Method of manufacturing an accelerometer May. 28, 2013
8422243 Integrated circuit package system employing a support structure with a recess Apr. 16, 2013
8384205 Electronic device package and method of manufacture Feb. 26, 2013
8338950 Electronic component Dec. 25, 2012
8334592 Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and use Dec. 18, 2012
8327521 Method for production and using a capacitive micro-machined ultrasonic transducer Dec. 11, 2012
8314488 Sample liquid supply container, sample liquid supply container set, and microchip set Nov. 20, 2012
8310069 Semiconductor package having marking layer Nov. 13, 2012
8232632 Composite contact for fine pitch electrical interconnect assembly Jul. 31, 2012
8211730 Nanophotonic transceiver Jul. 3, 2012
8212365 Printed wiring board and manufacturing method thereof Jul. 3, 2012
8207453 Glass core substrate for integrated circuit devices and methods of making the same Jun. 26, 2012
8193009 Apparatus and methods for packaging electronic devices for optical testing Jun. 5, 2012
8178893 Semiconductor element mounting substrate, semiconductor device using the same, and method for manufacturing semiconductor element mounting substrate May. 15, 2012
8178963 Wafer level package with die receiving through-hole and method of the same May. 15, 2012
8164201 Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulus Apr. 24, 2012
8148818 Semiconductor device and method for manufacturing the same Apr. 3, 2012
8143721 Package substrate dynamic pressure structure Mar. 27, 2012
8138601 Ultrasonic measuring method, electronic component manufacturing method, and semiconductor package Mar. 20, 2012
8125057 Magnetic shielding for integrated circuit Feb. 28, 2012
8120170 Integrated package circuit with stiffener Feb. 21, 2012
8120168 Methods and materials useful for chip stacking, chip and wafer bonding Feb. 21, 2012
8110118 Method of manufacturing circuit board Feb. 7, 2012
8107208 Insulated surge suppression circuit Jan. 31, 2012
8107207 Potted electrical circuit with protective insulation Jan. 31, 2012
8067781 Light emitting structure and securing device thereof Nov. 29, 2011
8063473 Nanophotonic transceiver Nov. 22, 2011
8044502 Composite contact for fine pitch electrical interconnect assembly Oct. 25, 2011
8030733 Copper-compatible fuse target Oct. 4, 2011
8018049 Silicon condenser microphone and manufacturing method Sep. 13, 2011
8008763 Stacked electronic component and manufacturing method thereof Aug. 30, 2011
8007673 Method of manufacturing circuit board Aug. 30, 2011
7990025 Silicon package with embedded oscillator Aug. 2, 2011
7982309 Integrated circuit including gas phase deposited packaging material Jul. 19, 2011

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