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Class Information
Number: 257/728
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > For high frequency (e.g., microwave) device
Description: Subject matter wherein the active solid-state device provided with a housing or package is a high frequency solid-state electronic device operating at high frequencies, such as microwave frequencies or above.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5982632 |
Short power signal path integrated circuit package |
Nov. 9, 1999 |
| 5977631 |
Semiconductor device including a semiconductor package with electromagnetic coupling slots |
Nov. 2, 1999 |
| 5955789 |
Ball grid array module |
Sep. 21, 1999 |
| 5955783 |
High frequency signal processing chip having signal pins distributed to minimize signal interference |
Sep. 21, 1999 |
| 5949140 |
Microwave semiconductor device with via holes and associated structure |
Sep. 7, 1999 |
| 5946794 |
Method of manufacturing a composite microwave circuit module |
Sep. 7, 1999 |
| 5945734 |
Wire-bond free input/output interface for GaAs ICs with means of determining known good die |
Aug. 31, 1999 |
| 5942960 |
Printed circuit board with a high frequency coupling island |
Aug. 24, 1999 |
| 5939954 |
Equivalent circuit of package ground terminal paddle |
Aug. 17, 1999 |
| 5939739 |
Separation of thermal and electrical paths in flip chip ballasted power heterojunction bipolar transistors |
Aug. 17, 1999 |
| 5932927 |
High-frequency device package |
Aug. 3, 1999 |
| 5932926 |
Microwave semiconductor integrated circuit |
Aug. 3, 1999 |
| 5930686 |
Integrated transceiver circuit packaged component |
Jul. 27, 1999 |
| 5929510 |
Integrated electronic circuit |
Jul. 27, 1999 |
| 5923540 |
Semiconductor unit having semiconductor device and multilayer substrate, in which grounding conductors surround conductors used for signal and power |
Jul. 13, 1999 |
| 5920119 |
Power semiconductor module employing metal based molded case and screw fastening type terminals for high reliability |
Jul. 6, 1999 |
| 5917241 |
High frequency semiconductor device having source, drain, and gate leads |
Jun. 29, 1999 |
| 5917233 |
Integrated circuit having a parasitic resonance filter |
Jun. 29, 1999 |
| 5913134 |
Micromachined self packaged circuits for high-frequency applications |
Jun. 15, 1999 |
| 5892272 |
Integrated circuit with on-chip ground base |
Apr. 6, 1999 |
| 5889232 |
Ultrahigh-frequency electronic component |
Mar. 30, 1999 |
| 5877555 |
Direct contact die attach |
Mar. 2, 1999 |
| 5869894 |
RF IC package |
Feb. 9, 1999 |
| 5869898 |
Lead-frame having interdigitated signal and ground leads with high frequency leads positioned adjacent a corner and shielded by ground leads on either side thereof |
Feb. 9, 1999 |
| 5869903 |
Sealed semiconductor device including opposed substrates and metal wall |
Feb. 9, 1999 |
| 5852391 |
Microwave/millimeter-wave functional module package |
Dec. 22, 1998 |
| 5847453 |
Microwave circuit package |
Dec. 8, 1998 |
| 5844321 |
Semiconductor device comprising a chip which is provided with a via opening and is soldered on a support, and method of realizing this device |
Dec. 1, 1998 |
| 5841184 |
Integrated emitter drain bypass capacitor for microwave/RF power device applications |
Nov. 24, 1998 |
| 5838551 |
Electronic package carrying an electronic component and assembly of mother board and electronic package |
Nov. 17, 1998 |
| 5838031 |
Low noise-high linearity HEMT-HBT composite |
Nov. 17, 1998 |
| 5831489 |
Compact magnetic shielding enclosure with high frequency feeds for cryogenic high frequency electronic apparatus |
Nov. 3, 1998 |
| 5796165 |
High-frequency integrated circuit device having a multilayer structure |
Aug. 18, 1998 |
| 5793098 |
Package including conductive layers having notches formed |
Aug. 11, 1998 |
| 5789817 |
Electrical apparatus with a metallic layer coupled to a lower region of a substrate and a metallic layer coupled to a lower region of a semiconductor device |
Aug. 4, 1998 |
| 5773897 |
Flip chip monolithic microwave integrated circuit with mushroom-shaped, solder-capped, plated metal bumps |
Jun. 30, 1998 |
| 5773887 |
High frequency semiconductor component |
Jun. 30, 1998 |
| 5767569 |
Tab tape and semiconductor chip mounted on tab tape |
Jun. 16, 1998 |
| 5768109 |
Multi-layer circuit board and semiconductor flip chip connection |
Jun. 16, 1998 |
| 5760473 |
Semiconductor package having a eutectic bonding layer |
Jun. 2, 1998 |
| 5757074 |
Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements |
May. 26, 1998 |
| 5753972 |
Microelectronics package |
May. 19, 1998 |
| 5744869 |
Apparatus for mounting a flip-chip semiconductor device |
Apr. 28, 1998 |
| 5736913 |
Method and apparatus for providing grounding to microwave circuit by low impedance means |
Apr. 7, 1998 |
| 5736787 |
Transistor package structured to provide heat dissipation enabling use of silicon carbide transistors and other high power semiconductor devices |
Apr. 7, 1998 |
| 5736783 |
High frequency microelectronics package |
Apr. 7, 1998 |
| 5734193 |
Termal shunt stabilization of multiple part heterojunction bipolar transistors |
Mar. 31, 1998 |
| 5719437 |
Smart cards having thin die |
Feb. 17, 1998 |
| 5717249 |
RF power amplifying circuit device |
Feb. 10, 1998 |
| 5698898 |
Semiconductor apparatus with a multiple element electrode structure |
Dec. 16, 1997 |
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