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Class Information
Number: 257/728
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > For high frequency (e.g., microwave) device
Description: Subject matter wherein the active solid-state device provided with a housing or package is a high frequency solid-state electronic device operating at high frequencies, such as microwave frequencies or above.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6191467 |
Semiconductor device and method for fabricating the same |
Feb. 20, 2001 |
| 6184578 |
Graphite composite heat pipe |
Feb. 6, 2001 |
| 6175287 |
Direct backside interconnect for multiple chip assemblies |
Jan. 16, 2001 |
| 6172305 |
Multilayer circuit board |
Jan. 9, 2001 |
| 6166436 |
High frequency semiconductor device |
Dec. 26, 2000 |
| 6163069 |
Semiconductor device having pads for connecting a semiconducting element to a mother board |
Dec. 19, 2000 |
| 6162653 |
Lead frame attachment for optoelectronic device |
Dec. 19, 2000 |
| 6157076 |
Hermetic thin pack semiconductor device |
Dec. 5, 2000 |
| 6140698 |
Package for microwave and mm-wave integrated circuits |
Oct. 31, 2000 |
| 6137165 |
Hybrid package including a power MOSFET die and a control and protection circuit die with a smaller sense MOSFET |
Oct. 24, 2000 |
| 6130478 |
Polymer stud grid array for microwave circuit arrangements |
Oct. 10, 2000 |
| RE36907 |
Leadframe with power and ground planes |
Oct. 10, 2000 |
| 6124636 |
MMIC package |
Sep. 26, 2000 |
| 6124631 |
Micro sensor and method for making same |
Sep. 26, 2000 |
| 6118357 |
Wireless MMIC chip packaging for microwave and millimeterwave frequencies |
Sep. 12, 2000 |
| 6107684 |
Semiconductor device having a signal pin with multiple connections |
Aug. 22, 2000 |
| 6101099 |
Method and device for connecting electrical components to printed circuit boards |
Aug. 8, 2000 |
| 6100583 |
Semiconductor device containing semiconductor element in package |
Aug. 8, 2000 |
| 6093957 |
Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof |
Jul. 25, 2000 |
| 6093962 |
High frequency shielding case of semiconductor laser |
Jul. 25, 2000 |
| 6094114 |
Slotline-to-slotline mounted flip chip |
Jul. 25, 2000 |
| 6087721 |
Semiconductor device with a high-frequency bipolar transistor on an insulating substrate |
Jul. 11, 2000 |
| 6081006 |
Reduced size field effect transistor |
Jun. 27, 2000 |
| 6081030 |
Semiconductor device having separated exchange means |
Jun. 27, 2000 |
| 6075995 |
Amplifier module with two power amplifiers for dual band cellular phones |
Jun. 13, 2000 |
| 6075427 |
MCM with high Q overlapping resonator |
Jun. 13, 2000 |
| 6075423 |
Controlling signal trace characteristic impedance via a conductive epoxy layer |
Jun. 13, 2000 |
| 6072238 |
Semiconductor component |
Jun. 6, 2000 |
| 6069404 |
Arrangement for the reduction of noise in microwave transistors and method for the manufacture thereof |
May. 30, 2000 |
| 6064286 |
Millimeter wave module with an interconnect from an interior cavity |
May. 16, 2000 |
| 6057599 |
Hybrid high-power microwave-frequency integrated circuit |
May. 2, 2000 |
| 6057600 |
Structure for mounting a high-frequency package |
May. 2, 2000 |
| 6058022 |
Upgradeable PCB with adaptable RFI suppression structures |
May. 2, 2000 |
| 6057594 |
High power dissipating tape ball grid array package |
May. 2, 2000 |
| 6054766 |
Package for enclosing microoptical and/or microelectronic devices so as to minimize the leakage of microwave electromagnetic radiation |
Apr. 25, 2000 |
| 6049127 |
Hermetically sealed tungsten-copper composite package container for packaging of microwave devices |
Apr. 11, 2000 |
| 6049126 |
Semiconductor package and amplifier employing the same |
Apr. 11, 2000 |
| 6046501 |
RF-driven semiconductor device |
Apr. 4, 2000 |
| 6033982 |
Scaled interconnect anodization for high frequency applications |
Mar. 7, 2000 |
| 6031279 |
Power semiconductor component |
Feb. 29, 2000 |
| 6028497 |
RF pin grid array |
Feb. 22, 2000 |
| 6028348 |
Low thermal impedance integrated circuit |
Feb. 22, 2000 |
| 6025651 |
Semiconductor package structures using epoxy molding compound pads and a method for fabricating the epoxy molding compound pads |
Feb. 15, 2000 |
| 6023080 |
Input/output connection structure of a semiconductor device |
Feb. 8, 2000 |
| 6020636 |
Kilowatt power transistor |
Feb. 1, 2000 |
| 6002147 |
Hybrid microwave-frequency integrated circuit |
Dec. 14, 1999 |
| 6002375 |
Multi-substrate radio-frequency circuit |
Dec. 14, 1999 |
| 5990757 |
Gallium arsenide monolithic microwave integrated circuits employing thermally bumped devices |
Nov. 23, 1999 |
| 5986331 |
Microwave monolithic integrated circuit with coplaner waveguide having silicon-on-insulator composite substrate |
Nov. 16, 1999 |
| 5982032 |
Electronic device having FETs on a low dielectric constant GaAs base member and passive elements on a high dielectric constant base member |
Nov. 9, 1999 |
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