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Class Information
Number: 257/728
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > For high frequency (e.g., microwave) device
Description: Subject matter wherein the active solid-state device provided with a housing or package is a high frequency solid-state electronic device operating at high frequencies, such as microwave frequencies or above.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6429043 |
Semiconductor circuitry device and method for manufacturing the same |
Aug. 6, 2002 |
| 6424233 |
Complex electronic component with a first multilayer filter having a cavity in which a second filter is mounted |
Jul. 23, 2002 |
| 6424027 |
Low pass filter integral with semiconductor package |
Jul. 23, 2002 |
| 6400576 |
Sub-package bypass capacitor mounting for an array packaged integrated circuit |
Jun. 4, 2002 |
| 6396116 |
Integrated circuit packaging for optical sensor devices |
May. 28, 2002 |
| 6396127 |
Semiconductor package |
May. 28, 2002 |
| 6396144 |
Mounting structure of semiconductor device, and communication apparatus using the same |
May. 28, 2002 |
| 6392298 |
Functional lid for RF power package |
May. 21, 2002 |
| 6384479 |
Semiconductor integrated circuit device |
May. 7, 2002 |
| 6384701 |
Microwave and millimeter wave device mounted on a semiconductive substrate and comprised of different kinds of functional blocks |
May. 7, 2002 |
| 6380623 |
Microcircuit assembly having dual-path grounding and negative self-bias |
Apr. 30, 2002 |
| 6377141 |
Distributed constant filter, method of manufacturing same, and distributed constant filter circuit module |
Apr. 23, 2002 |
| RE37637 |
Smart cards having thin die |
Apr. 9, 2002 |
| 6366467 |
Dual-socket interposer and method of fabrication therefor |
Apr. 2, 2002 |
| 6365961 |
High-frequency input/output feedthrough and package for housing high-frequency semiconductor element using same |
Apr. 2, 2002 |
| 6365977 |
Insulating interposer between two electronic components and process thereof |
Apr. 2, 2002 |
| 6366770 |
High-frequency semiconductor device and radio transmitter/receiver device |
Apr. 2, 2002 |
| 6362525 |
Circuit structure including a passive element formed within a grid array substrate and method for making the same |
Mar. 26, 2002 |
| 6362078 |
Dynamic threshold voltage device and methods for fabricating dynamic threshold voltage devices |
Mar. 26, 2002 |
| 6359331 |
High power switching module |
Mar. 19, 2002 |
| 6356453 |
Electronic package having flip chip integrated circuit and passive chip component |
Mar. 12, 2002 |
| 6356173 |
High-frequency module coupled via aperture in a ground plane |
Mar. 12, 2002 |
| 6355981 |
Wafer fabrication of inside-wrapped contacts for electronic devices |
Mar. 12, 2002 |
| 6351033 |
Multifunction lead frame and integrated circuit package incorporating the same |
Feb. 26, 2002 |
| 6346744 |
Integrated RF M.times.N switch matrix |
Feb. 12, 2002 |
| 6344689 |
Optical semiconductor device for surface mounting |
Feb. 5, 2002 |
| 6335669 |
RF circuit module |
Jan. 1, 2002 |
| 6333856 |
Arrangement for mounting chips in multilayer printed circuit boards |
Dec. 25, 2001 |
| 6333552 |
Millimeter wave semiconductor device |
Dec. 25, 2001 |
| 6329712 |
High density flip chip memory arrays |
Dec. 11, 2001 |
| 6329715 |
Passive electronic parts, IC parts, and wafer |
Dec. 11, 2001 |
| 6310394 |
Reduced parasitic capacitance semiconductor devices |
Oct. 30, 2001 |
| 6307450 |
Millimeter wave module and radio apparatus |
Oct. 23, 2001 |
| 6294827 |
Hybrid microwave-frequency integrated circuit |
Sep. 25, 2001 |
| 6294966 |
Interconnection device |
Sep. 25, 2001 |
| 6292374 |
Assembly having a back plate with inserts |
Sep. 18, 2001 |
| 6281574 |
High power microwave transistor amplifier |
Aug. 28, 2001 |
| 6271538 |
High-frequency detecting elements and high-frequency heater using the same |
Aug. 7, 2001 |
| 6265774 |
Millimeter wave adjustable cavity package |
Jul. 24, 2001 |
| 6261868 |
Semiconductor component and method for manufacturing the semiconductor component |
Jul. 17, 2001 |
| 6255730 |
Integrated low cost thick film RF module |
Jul. 3, 2001 |
| 6232660 |
High-frequency semiconductor device provided with peripheral bumps on chip periphery that surround high-frequency semiconductor chip |
May. 15, 2001 |
| 6225878 |
Millimeter wave module and radio apparatus |
May. 1, 2001 |
| 6225696 |
Advanced RF electronics package |
May. 1, 2001 |
| 6215377 |
Low cost wideband RF port structure for microwave circuit packages using coplanar waveguide and BGA I/O format |
Apr. 10, 2001 |
| 6211565 |
Apparatus for preventing electrostatic discharge in an integrated circuit |
Apr. 3, 2001 |
| 6204556 |
Structure for and method of mounting image taking element on substrate |
Mar. 20, 2001 |
| 6204555 |
Microwave-frequency hybrid integrated circuit |
Mar. 20, 2001 |
| 6198635 |
Interconnect layout pattern for integrated circuit packages and the like |
Mar. 6, 2001 |
| 6194774 |
Inductor including bonding wires |
Feb. 27, 2001 |
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