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Class Information
Number: 257/728
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > For high frequency (e.g., microwave) device
Description: Subject matter wherein the active solid-state device provided with a housing or package is a high frequency solid-state electronic device operating at high frequencies, such as microwave frequencies or above.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6608363 |
Transformer comprising stacked inductors |
Aug. 19, 2003 |
| 6605871 |
RF circuit chip and RF circuit device including the RF circuit chip |
Aug. 12, 2003 |
| 6603193 |
Semiconductor package |
Aug. 5, 2003 |
| 6586786 |
High frequency switch and mobile communication equipment |
Jul. 1, 2003 |
| 6573597 |
Cross-over for quasi-coaxial transmission lines fabricated on a substrate |
Jun. 3, 2003 |
| 6570199 |
Semiconductor device and method of manufacturing the same |
May. 27, 2003 |
| 6570469 |
Multilayer ceramic device including two ceramic layers with multilayer circuit patterns that can support semiconductor and saw chips |
May. 27, 2003 |
| 6566601 |
High frequency semiconductor device housing package and mounting structure for mounting the same |
May. 20, 2003 |
| 6559530 |
Method of integrating MEMS device with low-resistivity silicon substrates |
May. 6, 2003 |
| 6555907 |
High-frequency integrated circuit and high-frequency circuit device using the same |
Apr. 29, 2003 |
| 6549105 |
Millimeter wave module and radio apparatus |
Apr. 15, 2003 |
| 6548896 |
Method of reducing shear stresses on IC chips and structure formed thereby |
Apr. 15, 2003 |
| 6548893 |
Apparatus and method for hermetically sealing and EMI shielding integrated circuits for high speed electronic packages |
Apr. 15, 2003 |
| 6534725 |
High-frequency circuit board and semiconductor device using the high-frequency circuit board |
Mar. 18, 2003 |
| 6531782 |
Method of placing die to minimize die-to-die routing complexity on a substrate |
Mar. 11, 2003 |
| 6531772 |
Electronic system including memory module with redundant memory capability |
Mar. 11, 2003 |
| 6531775 |
High-frequency module |
Mar. 11, 2003 |
| 6528875 |
Vacuum sealed package for semiconductor chip |
Mar. 4, 2003 |
| 6521992 |
Semiconductor apparatus |
Feb. 18, 2003 |
| 6509641 |
High-frequency signal amplification device |
Jan. 21, 2003 |
| 6509644 |
Grid array package with reduced power and ground impedance under high frequency |
Jan. 21, 2003 |
| 6507047 |
Power transistors for radio frequencies |
Jan. 14, 2003 |
| 6507110 |
Microwave device and method for making same |
Jan. 14, 2003 |
| 6507111 |
High-frequency circuit and its module for communication devices |
Jan. 14, 2003 |
| 6501181 |
Arrangement relating to electronic circuitry |
Dec. 31, 2002 |
| 6501156 |
Lead frame which includes a die pad, a support lead, and inner leads |
Dec. 31, 2002 |
| 6498551 |
Millimeter wave module (MMW) for microwave monolithic integrated circuit (MMIC) |
Dec. 24, 2002 |
| 6495915 |
Flip chip package of monolithic microwave integrated circuit |
Dec. 17, 2002 |
| 6489671 |
Semiconductor integrated circuit having three-dimensional interconnection lines |
Dec. 3, 2002 |
| 6489850 |
Crosstalk suppression in differential AC coupled multichannel IC amplifiers |
Dec. 3, 2002 |
| 6489679 |
High-frequency package |
Dec. 3, 2002 |
| 6489680 |
Semiconductor device |
Dec. 3, 2002 |
| 6483188 |
Rf integrated circuit layout |
Nov. 19, 2002 |
| 6483406 |
High-frequency module using slot coupling |
Nov. 19, 2002 |
| 6483175 |
Wiring board and semiconductor device using the same |
Nov. 19, 2002 |
| 6483182 |
Integrated-circuit case |
Nov. 19, 2002 |
| 6483186 |
High power monolithic microwave integrated circuit package |
Nov. 19, 2002 |
| 6476463 |
Microwave integrated circuit multi-chip-module |
Nov. 5, 2002 |
| 6472748 |
System and method for providing MMIC seal |
Oct. 29, 2002 |
| 6467152 |
Method of fabricating a microwave microstrip/waveguide transition structure |
Oct. 22, 2002 |
| 6466113 |
Multi-layer RF printed circuit architecture with low-inductance interconnection and low thermal resistance for wide-lead power devices |
Oct. 15, 2002 |
| 6465883 |
Capsule for at least one high power transistor chip for high frequencies |
Oct. 15, 2002 |
| 6465276 |
Power semiconductor package and method for making the same |
Oct. 15, 2002 |
| 6462413 |
LDMOS transistor heatsink package assembly and manufacturing method |
Oct. 8, 2002 |
| 6455932 |
Ceramic package for semiconductor device |
Sep. 24, 2002 |
| 6452267 |
Selective flip chip underfill processing for high speed signal isolation |
Sep. 17, 2002 |
| 6441697 |
Ultra-low-loss feedthrough for microwave circuit package |
Aug. 27, 2002 |
| 6437899 |
Opto-electric conversion semiconductor device |
Aug. 20, 2002 |
| 6437420 |
Semiconductor elements for semiconductor device |
Aug. 20, 2002 |
| 6433423 |
Method and an arrangement relating to chip carriers |
Aug. 13, 2002 |
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