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Class Information
Number: 257/728
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > For high frequency (e.g., microwave) device
Description: Subject matter wherein the active solid-state device provided with a housing or package is a high frequency solid-state electronic device operating at high frequencies, such as microwave frequencies or above.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6774748 |
RF package with multi-layer substrate having coplanar feed through and connection interface |
Aug. 10, 2004 |
| 6774484 |
High frequency semiconductor device |
Aug. 10, 2004 |
| 6770955 |
Shielded antenna in a semiconductor package |
Aug. 3, 2004 |
| 6770970 |
High-frequency module, method of manufacturing thereof and method of molding resin |
Aug. 3, 2004 |
| 6768194 |
Electrode for electroplating planar structures |
Jul. 27, 2004 |
| 6762937 |
Power module |
Jul. 13, 2004 |
| 6762494 |
Electronic package substrate with an upper dielectric layer covering high speed signal traces |
Jul. 13, 2004 |
| 6759742 |
Interchangeable bond-wire interconnects |
Jul. 6, 2004 |
| 6759743 |
Thick film millimeter wave transceiver module |
Jul. 6, 2004 |
| 6759744 |
Electronic circuit unit suitable for miniaturization |
Jul. 6, 2004 |
| 6756649 |
High speed electron tunneling device and applications |
Jun. 29, 2004 |
| 6753595 |
Substrates for semiconductor devices with shielding for NC contacts |
Jun. 22, 2004 |
| 6753604 |
High frequency circuit module and communication device |
Jun. 22, 2004 |
| 6753615 |
Optical element module |
Jun. 22, 2004 |
| 6740914 |
FET circuit block with reduced self-heating |
May. 25, 2004 |
| 6737732 |
Data carrier with an integrated circuit between two carrier layers |
May. 18, 2004 |
| 6727777 |
Apparatus and method for angled coaxial to planar structure broadband transition |
Apr. 27, 2004 |
| 6728113 |
Method and apparatus for non-conductively interconnecting integrated circuits |
Apr. 27, 2004 |
| 6727585 |
Power device with a plastic molded package and direct bonded substrate |
Apr. 27, 2004 |
| 6717261 |
Integrated semiconductor circuit |
Apr. 6, 2004 |
| 6717260 |
Clip-type lead frame for source mounted die |
Apr. 6, 2004 |
| 6712284 |
High frequency semiconductor device |
Mar. 30, 2004 |
| 6713867 |
Package for microwave components |
Mar. 30, 2004 |
| 6709890 |
Method of manufacturing semiconductor integrated circuit device |
Mar. 23, 2004 |
| 6707161 |
Optical module package of flip chip bonding |
Mar. 16, 2004 |
| 6707159 |
Semiconductor chip and production process therefor |
Mar. 16, 2004 |
| 6700792 |
High-frequency composite component and portable wireless device incorporating the component |
Mar. 2, 2004 |
| 6696755 |
Semiconductor device |
Feb. 24, 2004 |
| 6681483 |
Multi-layer RF printed circuit architecture with low-inductance interconnection and low thermal resistance for wide-lead power devices |
Jan. 27, 2004 |
| 6680533 |
Semiconductor device with suppressed RF interference |
Jan. 20, 2004 |
| 6667192 |
Device and method for making devices comprising at least a chip fixed on a support |
Dec. 23, 2003 |
| 6667549 |
Micro circuits with a sculpted ground plane |
Dec. 23, 2003 |
| 6664624 |
Semiconductor device and manufacturing method thereof |
Dec. 16, 2003 |
| 6664630 |
Semiconductor device |
Dec. 16, 2003 |
| 6654249 |
Circuit arrangement |
Nov. 25, 2003 |
| 6653916 |
Microwave monolithic integrated circuit (MMIC) carrier interface |
Nov. 25, 2003 |
| 6649991 |
Image sensor semiconductor package |
Nov. 18, 2003 |
| 6649978 |
Semiconductor module having multiple semiconductor chips |
Nov. 18, 2003 |
| 6646343 |
Matched impedance bonding technique in high-speed integrated circuits |
Nov. 11, 2003 |
| 6642808 |
High frequency package, wiring board, and high frequency module having a cyclically varying transmission characteristic |
Nov. 4, 2003 |
| 6639322 |
Flip-chip transition interface structure |
Oct. 28, 2003 |
| 6635961 |
Electronic component of a high frequency current suppression type and bonding wire for the same |
Oct. 21, 2003 |
| 6628178 |
Radio frequency module parts including surface acoustic wave elements and manufacturing method thereof |
Sep. 30, 2003 |
| 6627992 |
Millimeter wave (MMW) transceiver module with transmitter, receiver and local oscillator frequency multiplier surface mounted chip set |
Sep. 30, 2003 |
| 6624508 |
High frequency, low cost package for semiconductor devices |
Sep. 23, 2003 |
| 6624454 |
Semiconductor device having a flip-chip construction |
Sep. 23, 2003 |
| 6621161 |
Semiconductor device having a package structure |
Sep. 16, 2003 |
| 6621162 |
High frequency circuit apparatus |
Sep. 16, 2003 |
| 6614103 |
Plastic packaging of LED arrays |
Sep. 2, 2003 |
| 6611051 |
Semiconductor device and communication terminal using thereof |
Aug. 26, 2003 |
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