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Class Information
Number: 257/728
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > For high frequency (e.g., microwave) device
Description: Subject matter wherein the active solid-state device provided with a housing or package is a high frequency solid-state electronic device operating at high frequencies, such as microwave frequencies or above.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6911733 |
Semiconductor device and electronic device |
Jun. 28, 2005 |
| 6911734 |
Semiconductor device and electronic device |
Jun. 28, 2005 |
| 6909170 |
Semiconductor assembly with package using cup-shaped lead-frame |
Jun. 21, 2005 |
| 6906259 |
High frequency module |
Jun. 14, 2005 |
| 6900537 |
High power silicon carbide and silicon semiconductor device package |
May. 31, 2005 |
| 6897559 |
Silicon-based thin film forming apparatus, silicon-based thin film forming method and semiconductor element |
May. 24, 2005 |
| 6897552 |
Semiconductor device wherein chips are stacked to have a fine pitch structure |
May. 24, 2005 |
| 6891267 |
Semiconductor switching circuit device |
May. 10, 2005 |
| 6888241 |
Electronic multipurpose seal with passive transponder |
May. 3, 2005 |
| 6876062 |
Seal ring and die corner stress relief pattern design to protect against moisture and metallic impurities |
Apr. 5, 2005 |
| 6876076 |
Multilayer semiconductor device for transmitting microwave signals and associated methods |
Apr. 5, 2005 |
| 6873044 |
Microwave monolithic integrated circuit package |
Mar. 29, 2005 |
| 6870261 |
Discrete circuit component having an up-right circuit die with lateral electrical connections |
Mar. 22, 2005 |
| 6861731 |
Module and electronic device |
Mar. 1, 2005 |
| 6861743 |
Integrated circuit carrier socket |
Mar. 1, 2005 |
| 6853062 |
Single substrate hydrogen and microwave absorber for integrated microwave assembly and method of manufacturing same |
Feb. 8, 2005 |
| 6853063 |
Semiconductor device and communication terminal using thereof |
Feb. 8, 2005 |
| 6853072 |
Semiconductor switching circuit device and manufacturing method thereof |
Feb. 8, 2005 |
| 6853073 |
Microwave electronic devices comprising a metal enclosure |
Feb. 8, 2005 |
| 6853287 |
Coil for use on a substrate |
Feb. 8, 2005 |
| 6847115 |
Packaged semiconductor device for radio frequency shielding |
Jan. 25, 2005 |
| 6847275 |
High-frequency circuit board unit, high frequency module using the same unit, electronic apparatus using the same module, and manufacturing method for the high-frequency circuit board unit |
Jan. 25, 2005 |
| 6844221 |
Method of manufacturing a wire bond-less electronic component for use with an external circuit |
Jan. 18, 2005 |
| 6841852 |
Integrated circuit package for semiconductor devices with improved electric resistance and inductance |
Jan. 11, 2005 |
| 6842144 |
High gain integrated antenna and devices therefrom |
Jan. 11, 2005 |
| 6838377 |
High frequency circuit chip and method of producing the same |
Jan. 4, 2005 |
| 6838748 |
Semiconductor element with electromagnetic shielding layer on back/side face(s) thereof |
Jan. 4, 2005 |
| 6835004 |
Opto-electronic component packaging |
Dec. 28, 2004 |
| 6835968 |
High frequency switch, two-band type high frequency switch, three-band type high frequency switch, and mobile communication equipment |
Dec. 28, 2004 |
| 6833619 |
Thin profile semiconductor package which reduces warpage and damage during laser markings |
Dec. 21, 2004 |
| 6825559 |
Group III nitride based flip-chip intergrated circuit and method for fabricating |
Nov. 30, 2004 |
| 6822880 |
Multilayer thin film hydrogen getter and internal signal EMI shield for complex three dimensional electronic package components |
Nov. 23, 2004 |
| 6822326 |
Wafer bonding hermetic encapsulation |
Nov. 23, 2004 |
| 6822162 |
Microcircuit housing with sloped gasket |
Nov. 23, 2004 |
| 6822325 |
Isolating temperature sensitive components from heat sources in integrated circuits |
Nov. 23, 2004 |
| 6819191 |
Piezoelectric oscillator unit |
Nov. 16, 2004 |
| 6818979 |
High-frequency semiconductor device |
Nov. 16, 2004 |
| 6818985 |
Embedded antenna and semiconductor die on a substrate in a laminate package |
Nov. 16, 2004 |
| 6815810 |
High-frequency semiconductor device |
Nov. 9, 2004 |
| 6812553 |
Electrically isolated and thermally conductive double-sided pre-packaged component |
Nov. 2, 2004 |
| 6809418 |
Integrated circuit package structure |
Oct. 26, 2004 |
| 6806569 |
Multi-frequency power delivery system |
Oct. 19, 2004 |
| 6807063 |
High-frequency integrated circuit module |
Oct. 19, 2004 |
| 6800920 |
RF passive circuit and RF amplifier with via-holes |
Oct. 5, 2004 |
| 6800935 |
Switching circuit with improved signal blocking effect in off mode |
Oct. 5, 2004 |
| 6798061 |
Multiple semiconductor chip (multi-chip) module for use in power applications |
Sep. 28, 2004 |
| 6790694 |
High frequency semiconductor module, high frequency semiconductor device and manufacturing method for the same |
Sep. 14, 2004 |
| 6784765 |
Multilayer ceramic device |
Aug. 31, 2004 |
| 6781488 |
Connected construction of a high-frequency package and a wiring board |
Aug. 24, 2004 |
| 6777792 |
Semiconductor device and package with high heat radiation effect |
Aug. 17, 2004 |
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