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Class Information
Number: 257/728
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > For high frequency (e.g., microwave) device
Description: Subject matter wherein the active solid-state device provided with a housing or package is a high frequency solid-state electronic device operating at high frequencies, such as microwave frequencies or above.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7073959 |
Optical receiver module with TO-Can structure |
Jul. 11, 2006 |
| 7071542 |
Lead frame decoupling capacitor, semiconductor device packages including the same and methods |
Jul. 4, 2006 |
| 7068521 |
Semiconductor device |
Jun. 27, 2006 |
| 7057279 |
High-frequency circuit block, its manufacturing method, high-frequency module device, and its manufacturing method |
Jun. 6, 2006 |
| 7053484 |
Miniature broadband switched filter bank |
May. 30, 2006 |
| 7053466 |
High-speed signaling interface with broadside dynamic wave coupling |
May. 30, 2006 |
| 7041513 |
Methods for forming semiconductor devices so as to stabilize the same when positioned face-down over test substrates |
May. 9, 2006 |
| 7038321 |
Method of attaching a flip chip device and circuit assembly formed thereby |
May. 2, 2006 |
| 7034396 |
Structure of semiconductor element and its manufacturing process |
Apr. 25, 2006 |
| 7030491 |
Power semiconductor module with deflection-resistant base plate |
Apr. 18, 2006 |
| 7031170 |
Electronic device having a plastic housing and components of a height-structured metallic leadframe and methods for the production of the electronic device |
Apr. 18, 2006 |
| 7030490 |
Structure of multi-tier wire bonding for high frequency integrated circuit |
Apr. 18, 2006 |
| 7026869 |
Broadband amplifier having offset microstrip section in a housing module |
Apr. 11, 2006 |
| 7026664 |
DC-DC converter implemented in a land grid array package |
Apr. 11, 2006 |
| 7023086 |
Semiconductor component arrangement with a reduced oscillation tendency |
Apr. 4, 2006 |
| 7012337 |
Semiconductor device including a photosensitive resin covering at least a portion of a substrate having a via hole |
Mar. 14, 2006 |
| 7009282 |
Packaged integrated circuit providing trace access to high-speed leads |
Mar. 7, 2006 |
| 7005740 |
Thick film millimeter wave transceiver module |
Feb. 28, 2006 |
| 7002249 |
Microelectronic component with reduced parasitic inductance and method of fabricating |
Feb. 21, 2006 |
| 6998708 |
Millimeter wave (MMW) transceiver module with transmitter, receiver and local oscillator frequency multiplier surface mounted chip set |
Feb. 14, 2006 |
| 6998721 |
Stacking and encapsulation of multiple interconnected integrated circuits |
Feb. 14, 2006 |
| 6998709 |
RFIC die-package configuration |
Feb. 14, 2006 |
| 6998710 |
High-frequency device |
Feb. 14, 2006 |
| 6995463 |
Integrated chip package having intermediate substrate and multiple semiconductor chips |
Feb. 7, 2006 |
| 6982494 |
Semiconductor device with signal line having decreased characteristic impedance |
Jan. 3, 2006 |
| 6982483 |
High impedance radio frequency power plastic package |
Jan. 3, 2006 |
| 6979894 |
Integrated chip package having intermediate substrate |
Dec. 27, 2005 |
| 6975189 |
On-chip multilayer metal shielded transmission line |
Dec. 13, 2005 |
| 6975029 |
Antenna-incorporated semiconductor device |
Dec. 13, 2005 |
| 6974724 |
Shielded laminated structure with embedded chips |
Dec. 13, 2005 |
| 6972965 |
Method for integrated high Q inductors in FCGBA packages |
Dec. 6, 2005 |
| 6963131 |
Integrated circuit system with a latent heat storage module |
Nov. 8, 2005 |
| 6953981 |
Semiconductor device with deep substrates contacts |
Oct. 11, 2005 |
| 6953987 |
Composite integrated circuit device having restricted heat conduction |
Oct. 11, 2005 |
| 6943436 |
EMI heatspreader/lid for integrated circuit packages |
Sep. 13, 2005 |
| 6943446 |
Via construction for structural support |
Sep. 13, 2005 |
| 6940164 |
Power module |
Sep. 6, 2005 |
| 6936921 |
High-frequency package |
Aug. 30, 2005 |
| 6933813 |
Interconnection structure with etch stop |
Aug. 23, 2005 |
| 6933599 |
Electromagnetic noise shielding in semiconductor packages using caged interconnect structures |
Aug. 23, 2005 |
| 6933605 |
Semiconductor package |
Aug. 23, 2005 |
| 6933596 |
Ultra wideband BGA |
Aug. 23, 2005 |
| 6930401 |
Electronic device and method of manufacture the same |
Aug. 16, 2005 |
| 6930334 |
High frequency semiconductor device |
Aug. 16, 2005 |
| 6921573 |
High-frequency current suppression body using magnetic loss material exhibiting outstanding complex permeability characteristics |
Jul. 26, 2005 |
| 6919625 |
Surface mount multichip devices |
Jul. 19, 2005 |
| 6917262 |
Integrated microwave filter module with a cover bonded by strips of conductive paste |
Jul. 12, 2005 |
| 6914322 |
Semiconductor device package and method of production and semiconductor device of same |
Jul. 5, 2005 |
| 6911724 |
Integrated chip package having intermediate substrate with capacitor |
Jun. 28, 2005 |
| 6911732 |
Integrated circuit |
Jun. 28, 2005 |
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