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Class Information
Number: 257/728
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > For high frequency (e.g., microwave) device
Description: Subject matter wherein the active solid-state device provided with a housing or package is a high frequency solid-state electronic device operating at high frequencies, such as microwave frequencies or above.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7247937 |
Mounting pad structure for wire-bonding type lead frame packages |
Jul. 24, 2007 |
| 7239028 |
Semiconductor device with signal line having decreased characteristic impedance |
Jul. 3, 2007 |
| 7239010 |
Semiconductor device |
Jul. 3, 2007 |
| 7239851 |
High frequency module |
Jul. 3, 2007 |
| 7230314 |
Semiconductor device and method of forming a semiconductor device |
Jun. 12, 2007 |
| 7230320 |
Electronic circuit device with reduced breaking and cracking |
Jun. 12, 2007 |
| 7227251 |
Semiconductor device and a memory system including a plurality of IC chips in a common package |
Jun. 5, 2007 |
| 7227198 |
Half-bridge package |
Jun. 5, 2007 |
| 7227240 |
Semiconductor device with wire bond inductor and method |
Jun. 5, 2007 |
| 7227249 |
Three-dimensional stacked semiconductor package with chips on opposite sides of lead |
Jun. 5, 2007 |
| 7224062 |
Chip package with embedded panel-shaped component |
May. 29, 2007 |
| 7224053 |
Semiconductor device responsive to different levels of input and output signals and signal processing system using the same |
May. 29, 2007 |
| 7221244 |
Localized enhancement of multilayer substrate thickness for high Q RF components |
May. 22, 2007 |
| 7211887 |
connection arrangement for micro lead frame plastic packages |
May. 1, 2007 |
| 7199469 |
Semiconductor device having stacked semiconductor chips sealed with a resin seal member |
Apr. 3, 2007 |
| 7196419 |
Transport speed monitoring apparatus and semiconductor processing system utilizing the same |
Mar. 27, 2007 |
| 7190070 |
Modular power semiconductor module |
Mar. 13, 2007 |
| 7190083 |
High frequency integrated circuit using capacitive bonding |
Mar. 13, 2007 |
| 7173340 |
Daisy chaining of serial I/O interface on stacking devices |
Feb. 6, 2007 |
| 7172958 |
High-frequency wiring structure and method for producing the same |
Feb. 6, 2007 |
| 7170166 |
Integrated circuit ground system |
Jan. 30, 2007 |
| 7170155 |
MEMS RF switch module including a vertical via |
Jan. 30, 2007 |
| 7166877 |
High frequency via |
Jan. 23, 2007 |
| 7164200 |
Techniques for reducing bowing in power transistor devices |
Jan. 16, 2007 |
| 7161244 |
Microwave device for dissipating or attenuating power |
Jan. 9, 2007 |
| 7161241 |
Multi-layer board |
Jan. 9, 2007 |
| 7157794 |
Semiconductor device that suppresses variations in high frequency characteristics of circuit elements |
Jan. 2, 2007 |
| 7151311 |
Mold resin-sealed power semiconductor device having insulating resin layer fixed on bottom surface of heat sink and metal layer on the resin layer |
Dec. 19, 2006 |
| 7148554 |
Discrete electronic component arrangement including anchoring, thermally conductive pad |
Dec. 12, 2006 |
| 7148578 |
Semiconductor multi-chip package |
Dec. 12, 2006 |
| 7141876 |
Semiconductor device |
Nov. 28, 2006 |
| 7135754 |
Chip type solid electrolytic capacitor having a small size and a simple structure |
Nov. 14, 2006 |
| 7135777 |
Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof |
Nov. 14, 2006 |
| 7132737 |
Package for electronic component and method of manufacturing piezoelectric device |
Nov. 7, 2006 |
| 7132748 |
Semiconductor apparatus |
Nov. 7, 2006 |
| 7129583 |
Multi-chip package structure |
Oct. 31, 2006 |
| 7129571 |
Semiconductor chip package having decoupling capacitor and manufacturing method thereof |
Oct. 31, 2006 |
| 7125744 |
High-frequency module and method for manufacturing the same |
Oct. 24, 2006 |
| 7122892 |
Multi-chip integrated circuit module for high-frequency operation |
Oct. 17, 2006 |
| 7115988 |
Bypass capacitor embedded flip chip package lid and stiffener |
Oct. 3, 2006 |
| 7112885 |
System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards |
Sep. 26, 2006 |
| 7109531 |
High frequency switch, two-band type high frequency switch, three-band type high frequency switch, and mobile communication equipment |
Sep. 19, 2006 |
| 7105924 |
Integrated circuit housing |
Sep. 12, 2006 |
| 7098530 |
Package for a high-frequency electronic device |
Aug. 29, 2006 |
| 7095098 |
Electrically isolated and thermally conductive double-sided pre-packaged component |
Aug. 22, 2006 |
| 7095114 |
Semiconductor device with via hole group generating high frequency electromagnetic bonding, manufacturing method thereof, and monolithic microwave integrated circuit |
Aug. 22, 2006 |
| 7091588 |
Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation |
Aug. 15, 2006 |
| 7091582 |
Electronic package with snap-on perimeter wall |
Aug. 15, 2006 |
| 7087993 |
Chip package and electrical connection structure between chip and substrate |
Aug. 8, 2006 |
| 7081661 |
High-frequency module and method for manufacturing the same |
Jul. 25, 2006 |
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