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Class Information
Number: 257/728
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > For high frequency (e.g., microwave) device
Description: Subject matter wherein the active solid-state device provided with a housing or package is a high frequency solid-state electronic device operating at high frequencies, such as microwave frequencies or above.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 4791473 |
Plastic package for high frequency semiconductor devices |
Dec. 13, 1988 |
| 4788584 |
RF transistor package with capacitor |
Nov. 29, 1988 |
| 4783697 |
Leadless chip carrier for RF power transistors or the like |
Nov. 8, 1988 |
| 4782381 |
Chip carrier |
Nov. 1, 1988 |
| 4739389 |
High-frequency circuit arrangement and semiconductor device for use in such an arrangement |
Apr. 19, 1988 |
| 4736235 |
Ultra-high frequency diode structure whose external connections are provided by two metal beam leads |
Apr. 5, 1988 |
| 4701573 |
Semiconductor chip housing |
Oct. 20, 1987 |
| 4698661 |
Encapsulating box for a power semiconductor with improved input-output insulator |
Oct. 6, 1987 |
| 4661836 |
Fabricating integrated circuits |
Apr. 28, 1987 |
| 4661834 |
Semiconductor structures and manufacturing methods |
Apr. 28, 1987 |
| 4660069 |
Device with captivate chip capacitor devices and method of making the same |
Apr. 21, 1987 |
| 4649416 |
Microwave transistor package |
Mar. 10, 1987 |
| 4612566 |
Microwave transistor mounting structure |
Sep. 16, 1986 |
| 4611882 |
High-frequency circuit device with an annular capacitor on the back of an insulated substrate |
Sep. 16, 1986 |
| 4590617 |
Hermetically sealed planar structure for high frequency device |
May. 20, 1986 |
| 4453176 |
LSI Chip carrier with buried repairable capacitor with low inductance leads |
Jun. 5, 1984 |
| 4427991 |
High frequency semiconductor device |
Jan. 24, 1984 |
| 4425575 |
Base for encapsulating components with coplanar electrodes |
Jan. 10, 1984 |
| 4392152 |
Semiconductor device |
Jul. 5, 1983 |
| 4376287 |
Microwave power circuit with an active device mounted on a heat dissipating substrate |
Mar. 8, 1983 |
| 4359754 |
Semiconductor device |
Nov. 16, 1982 |
| 4340901 |
Lead connecting structure for a semiconductor device |
Jul. 20, 1982 |
| 4339870 |
Series-connected two-terminal semiconductor devices and their fabrication |
Jul. 20, 1982 |
| 4340900 |
Mesa epitaxial diode with oxide passivated junction and plated heat sink |
Jul. 20, 1982 |
| 4319265 |
Monolithically interconnected series-parallel avalanche diodes |
Mar. 9, 1982 |
| 4266239 |
Semiconductor device having improved high frequency characteristics |
May. 5, 1981 |
| 4193083 |
Package for push-pull semiconductor devices |
Mar. 11, 1980 |
| 4183041 |
Self biasing of a field effect transistor mounted in a flip-chip carrier |
Jan. 8, 1980 |
| 4172261 |
Semiconductor device having a highly air-tight package |
Oct. 23, 1979 |
| 4160992 |
Plural semiconductor devices mounted between plural heat sinks |
Jul. 10, 1979 |
| 4152718 |
Semiconductor structure for millimeter waves |
May. 1, 1979 |
| 4127830 |
Microstrip switch wherein diodes are formed in single semiconductor body |
Nov. 28, 1978 |
| 4107728 |
Package for push-pull semiconductor devices |
Aug. 15, 1978 |
| 4092664 |
Carrier for mounting a semiconductor chip |
May. 30, 1978 |
| 4042952 |
R. F. power transistor device with controlled common lead inductance |
Aug. 16, 1977 |
| 4034399 |
Interconnection means for an array of majority carrier microwave devices |
Jul. 5, 1977 |
| RE29218 |
Packaged semiconductor device for microwave use |
May. 10, 1977 |
| 4016643 |
Overlay metallization field effect transistor |
Apr. 12, 1977 |
| 3996603 |
RF power semiconductor package and method of manufacture |
Dec. 7, 1976 |
| 3982271 |
Heat spreader and low parasitic transistor mounting |
Sep. 21, 1976 |
| 3974518 |
Encapsulation for high frequency semiconductor device |
Aug. 10, 1976 |
| 3953878 |
Constant temperature control for transferred electron devices |
Apr. 27, 1976 |
| 3943469 |
Mechanical structure for mounting microwave diode packages |
Mar. 9, 1976 |
| 3943556 |
Method of making a high frequency semiconductor package |
Mar. 9, 1976 |
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