| |
 |
|
Class Information
Number: 257/728
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > For high frequency (e.g., microwave) device
Description: Subject matter wherein the active solid-state device provided with a housing or package is a high frequency solid-state electronic device operating at high frequencies, such as microwave frequencies or above.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5694300 |
Electromagnetically channelized microwave integrated circuit |
Dec. 2, 1997 |
| 5689138 |
Integrated microwave semiconductor device with active and passive components |
Nov. 18, 1997 |
| 5677570 |
Semiconductor integrated circuit devices for high-speed or high frequency |
Oct. 14, 1997 |
| 5675184 |
Integrated circuit device |
Oct. 7, 1997 |
| 5668408 |
Pin grid array solution for microwave multi-chip modules |
Sep. 16, 1997 |
| 5663095 |
Method of making a micro-dimensional coupling conductor |
Sep. 2, 1997 |
| 5661343 |
Power hybrid integrated circuit apparatus |
Aug. 26, 1997 |
| 5652696 |
Mechanically captivated integrated circuit chip |
Jul. 29, 1997 |
| 5650760 |
Microwave enclosure |
Jul. 22, 1997 |
| 5637922 |
Wireless radio frequency power semiconductor devices using high density interconnect |
Jun. 10, 1997 |
| 5635762 |
Flip chip semiconductor device with dual purpose metallized ground conductor |
Jun. 3, 1997 |
| 5633517 |
Semiconductor device constituting multi-stage power amplifier |
May. 27, 1997 |
| 5631809 |
Semiconductor device for ultrahigh frequency band and semiconductor apparatus including the semiconductor device |
May. 20, 1997 |
| 5614743 |
Microwave integrated circuit (MIC) having a reactance element formed on a groove |
Mar. 25, 1997 |
| 5612556 |
Monolithic integration of microwave silicon devices and low loss transmission lines |
Mar. 18, 1997 |
| 5608263 |
Micromachined self packaged circuits for high-frequency applications |
Mar. 4, 1997 |
| 5602421 |
Microwave monolithic integrated circuit package with improved RF ports |
Feb. 11, 1997 |
| 5598032 |
Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module |
Jan. 28, 1997 |
| 5596171 |
Package for a high frequency semiconductor device and methods for fabricating and connecting the same to an external circuit |
Jan. 21, 1997 |
| 5592022 |
Fabricating a semiconductor with an insulative coating |
Jan. 7, 1997 |
| 5574313 |
Hermetically sealed microwave integrated circuit package with ground plane fused to package frame |
Nov. 12, 1996 |
| 5574314 |
Packaged semiconductor device including shielded inner walls |
Nov. 12, 1996 |
| 5559363 |
Off-chip impedance matching utilizing a dielectric element and high density interconnect technology |
Sep. 24, 1996 |
| 5559360 |
Inductor for high frequency circuits |
Sep. 24, 1996 |
| 5557144 |
Plastic packages for microwave frequency applications |
Sep. 17, 1996 |
| 5545924 |
Three dimensional package for monolithic microwave/millimeterwave integrated circuits |
Aug. 13, 1996 |
| 5536906 |
Package for integrated circuits |
Jul. 16, 1996 |
| 5536971 |
Semiconductor device having a hollow around a gate electrode and a method for producing the same |
Jul. 16, 1996 |
| 5532658 |
Mounting structure for electronic component |
Jul. 2, 1996 |
| 5532514 |
High frequency semiconductor device |
Jul. 2, 1996 |
| 5532506 |
Integrated circuit adapted for improved thermal impedance |
Jul. 2, 1996 |
| 5528074 |
Microwave semiconductor device and integrated circuit including microwave semiconductor devices |
Jun. 18, 1996 |
| 5522132 |
Microwave surface mount package |
Jun. 4, 1996 |
| 5521431 |
Semiconductor device with lead frame of molded container |
May. 28, 1996 |
| 5521420 |
Fabricating a semiconductor with an insulative coating |
May. 28, 1996 |
| 5519233 |
Microchip capacitor and thin film resistor as circuit elements in internal impedance matching circuit of microwave transistor |
May. 21, 1996 |
| 5512781 |
Semiconductor package device for super high-frequency band |
Apr. 30, 1996 |
| 5510758 |
Multilayer microstrip wiring board with a semiconductor device mounted thereon via bumps |
Apr. 23, 1996 |
| 5500556 |
Packaging structure for microwave circuit |
Mar. 19, 1996 |
| 5485036 |
Local ground plane for high frequency circuits |
Jan. 16, 1996 |
| 5477085 |
Bonding structure of dielectric substrates for impedance matching circuits on a packaging substrate involved in microwave integrated circuits |
Dec. 19, 1995 |
| 5465008 |
Ceramic microelectronics package |
Nov. 7, 1995 |
| 5463248 |
Semiconductor package using an aluminum nitride substrate |
Oct. 31, 1995 |
| 5457340 |
Leadframe with power and ground planes |
Oct. 10, 1995 |
| 5455453 |
Plastic package type semiconductor device having a rolled metal substrate |
Oct. 3, 1995 |
| 5451818 |
Millimeter wave ceramic package |
Sep. 19, 1995 |
| 5449953 |
Monolithic microwave integrated circuit on high resistivity silicon |
Sep. 12, 1995 |
| 5438305 |
High frequency module including a flexible substrate |
Aug. 1, 1995 |
| 5426319 |
High-frequency semiconductor device including microstrip transmission line |
Jun. 20, 1995 |
| 5422615 |
High frequency circuit device |
Jun. 6, 1995 |
|
|
|
