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Class Information
Number: 257/728
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > For high frequency (e.g., microwave) device
Description: Subject matter wherein the active solid-state device provided with a housing or package is a high frequency solid-state electronic device operating at high frequencies, such as microwave frequencies or above.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7622811 |
Semiconductor assembly with component attached on die back side |
Nov. 24, 2009 |
| 7619567 |
Integrated phased array antenna |
Nov. 17, 2009 |
| 7615863 |
Multi-dimensional wafer-level integrated antenna sensor micro packaging |
Nov. 10, 2009 |
| 7608924 |
Liquid cooled power electronic circuit comprising stacked direct die cooled packages |
Oct. 27, 2009 |
| 7605450 |
High frequency arrangement |
Oct. 20, 2009 |
| 7605462 |
Universal substrate for a semiconductor device having selectively activated fuses |
Oct. 20, 2009 |
| 7595549 |
Surface mount semiconductor device |
Sep. 29, 2009 |
| 7589419 |
Side connectors for RFID chip |
Sep. 15, 2009 |
| 7586193 |
Mm-wave antenna using conventional IC packaging |
Sep. 8, 2009 |
| 7586192 |
Routing configuration for high frequency signals in an integrated circuit package |
Sep. 8, 2009 |
| 7582951 |
Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages |
Sep. 1, 2009 |
| 7576440 |
Semiconductor chip having bond pads and multi-chip package |
Aug. 18, 2009 |
| 7576401 |
Direct glass attached on die optical module |
Aug. 18, 2009 |
| 7573359 |
Reducing crosstalk in electronic devices having microstrip lines covered by a flexible insulating material and a metallic backing plate |
Aug. 11, 2009 |
| 7569920 |
Electronic component having at least one vertical semiconductor power transistor |
Aug. 4, 2009 |
| 7569933 |
Housing for accommodating microwave devices having an insulating cup member |
Aug. 4, 2009 |
| 7550839 |
Integrated circuit package and system interface |
Jun. 23, 2009 |
| 7547977 |
Semiconductor chip having bond pads |
Jun. 16, 2009 |
| 7545036 |
Semiconductor device that suppresses variations in high frequency characteristics of circuit elements |
Jun. 9, 2009 |
| 7538417 |
Semiconductor device with signal line having decreased characteristic impedance |
May. 26, 2009 |
| 7534320 |
Lamination press pad |
May. 19, 2009 |
| 7535100 |
Wafer bonding of thinned electronic materials and circuits to high performance substrates |
May. 19, 2009 |
| 7535094 |
Substrate structure, a method and an arrangement for producing such substrate structure |
May. 19, 2009 |
| 7529448 |
System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards |
May. 5, 2009 |
| 7518223 |
Semiconductor devices and semiconductor device assemblies including a nonconfluent spacer layer |
Apr. 14, 2009 |
| 7518229 |
Versatile Si-based packaging with integrated passive components for mmWave applications |
Apr. 14, 2009 |
| 7514774 |
Stacked multi-chip package with EMI shielding |
Apr. 7, 2009 |
| 7504670 |
Sealing structure for mounting a semiconductor device to a substrate |
Mar. 17, 2009 |
| 7504721 |
Apparatus and methods for packaging dielectric resonator antennas with integrated circuit chips |
Mar. 17, 2009 |
| 7495336 |
Array capacitors for broadband decoupling applications |
Feb. 24, 2009 |
| 7479696 |
Integrated BST microwave tunable devices fabricated on SOI substrate |
Jan. 20, 2009 |
| 7470977 |
Modular board device, high frequency module, and method of manufacturing same |
Dec. 30, 2008 |
| 7470968 |
T-coil apparatus and method for compensating capacitance |
Dec. 30, 2008 |
| 7459776 |
Stacked die assembly having semiconductor die projecting beyond support |
Dec. 2, 2008 |
| 7458054 |
Method for designing integrated circuit package and method for manufacturing same |
Nov. 25, 2008 |
| 7457491 |
System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards |
Nov. 25, 2008 |
| 7456498 |
Integrated circuit package and system interface |
Nov. 25, 2008 |
| 7456491 |
Large area electron emission system for application in mask-based lithography, maskless lithography II and microscopy |
Nov. 25, 2008 |
| 7454300 |
Extracting high frequency impedance in a circuit design using broadband representations |
Nov. 18, 2008 |
| 7453159 |
Semiconductor chip having bond pads |
Nov. 18, 2008 |
| 7444041 |
System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards |
Oct. 28, 2008 |
| 7439621 |
Radio frequency signal processing device |
Oct. 21, 2008 |
| 7439622 |
Semiconductor device |
Oct. 21, 2008 |
| 7411294 |
Display device having misalignment detection pattern for detecting misalignment between conductive layer and insulating layer |
Aug. 12, 2008 |
| 7405477 |
Ball grid array package-to-board interconnect co-design apparatus |
Jul. 29, 2008 |
| 7400032 |
Module assembly for stacked BGA packages |
Jul. 15, 2008 |
| 7391100 |
Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area |
Jun. 24, 2008 |
| 7390699 |
Integrated circuit die connection methods and apparatus |
Jun. 24, 2008 |
| 7388284 |
Integrated circuit package and method of attaching a lid to a substrate of an integrated circuit |
Jun. 17, 2008 |
| 7385283 |
Three dimensional integrated circuit and method of making the same |
Jun. 10, 2008 |
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