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Class Information
Number: 257/728
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > For high frequency (e.g., microwave) device
Description: Subject matter wherein the active solid-state device provided with a housing or package is a high frequency solid-state electronic device operating at high frequencies, such as microwave frequencies or above.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7411294 |
Display device having misalignment detection pattern for detecting misalignment between conductive layer and insulating layer |
Aug. 12, 2008 |
| 7405477 |
Ball grid array package-to-board interconnect co-design apparatus |
Jul. 29, 2008 |
| 7400032 |
Module assembly for stacked BGA packages |
Jul. 15, 2008 |
| 7391100 |
Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area |
Jun. 24, 2008 |
| 7390699 |
Integrated circuit die connection methods and apparatus |
Jun. 24, 2008 |
| 7388284 |
Integrated circuit package and method of attaching a lid to a substrate of an integrated circuit |
Jun. 17, 2008 |
| 7386413 |
Switched length matched transmission path instrument |
Jun. 10, 2008 |
| 7385283 |
Three dimensional integrated circuit and method of making the same |
Jun. 10, 2008 |
| 7372139 |
Semiconductor chip package |
May. 13, 2008 |
| 7372149 |
High frequency semiconductor apparatus, transmitting apparatus and receiving apparatus |
May. 13, 2008 |
| 7365423 |
Redistributed solder pads using etched lead frame |
Apr. 29, 2008 |
| 7362491 |
Heated glass panels and methods for making electrical contact with electro-conductive films |
Apr. 22, 2008 |
| 7355270 |
Semiconductor chip with coil antenna and communication system |
Apr. 8, 2008 |
| 7355272 |
Semiconductor device with stacked semiconductor chips of the same type |
Apr. 8, 2008 |
| 7355264 |
Integrated passive devices with high Q inductors |
Apr. 8, 2008 |
| 7348680 |
Electronic device and use thereof |
Mar. 25, 2008 |
| 7348597 |
Apparatus for performing high frequency electronic package testing |
Mar. 25, 2008 |
| 7342300 |
Integrated circuit incorporating wire bond inductance |
Mar. 11, 2008 |
| 7342303 |
Semiconductor device having RF shielding and method therefor |
Mar. 11, 2008 |
| 7342308 |
Component stacking for integrated circuit electronic package |
Mar. 11, 2008 |
| 7339269 |
High frequency IC package, high frequency unit using high frequency IC package, and manufacturing method thereof |
Mar. 4, 2008 |
| 7332806 |
Thin, thermally enhanced molded package with leadframe having protruding region |
Feb. 19, 2008 |
| 7329950 |
RFIC die and package |
Feb. 12, 2008 |
| 7327024 |
Power module, and phase leg assembly |
Feb. 5, 2008 |
| 7319272 |
Ball assignment system |
Jan. 15, 2008 |
| 7315069 |
Integrated multi-purpose getter for radio-frequency (RF) circuit modules |
Jan. 1, 2008 |
| 7312528 |
Semiconductor device having antenna connection electrodes |
Dec. 25, 2007 |
| 7307293 |
Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths |
Dec. 11, 2007 |
| 7307341 |
Integrated packaged having magnetic components |
Dec. 11, 2007 |
| 7304374 |
Wireless coupling of semiconductor dies |
Dec. 4, 2007 |
| 7294928 |
Components, methods and assemblies for stacked packages |
Nov. 13, 2007 |
| 7294904 |
Integrated circuit package with improved return loss |
Nov. 13, 2007 |
| 7291926 |
Multi-chip package structure |
Nov. 6, 2007 |
| 7291904 |
Downsized package for electric wave device |
Nov. 6, 2007 |
| 7262498 |
Assembly with a ring and bonding pads formed of a same material on a substrate |
Aug. 28, 2007 |
| 7262444 |
Power semiconductor packaging method and structure |
Aug. 28, 2007 |
| 7259460 |
Wire bonding on thinned portions of a lead-frame configured for use in a micro-array integrated circuit package |
Aug. 21, 2007 |
| 7259417 |
Direct digitally tunable microwave oscillators and filters |
Aug. 21, 2007 |
| 7253517 |
Method and apparatus for combining multiple integrated circuits |
Aug. 7, 2007 |
| 7253513 |
High-frequency switch device and electronic device using the same |
Aug. 7, 2007 |
| 7247937 |
Mounting pad structure for wire-bonding type lead frame packages |
Jul. 24, 2007 |
| 7239010 |
Semiconductor device |
Jul. 3, 2007 |
| 7239028 |
Semiconductor device with signal line having decreased characteristic impedance |
Jul. 3, 2007 |
| 7239851 |
High frequency module |
Jul. 3, 2007 |
| 7230314 |
Semiconductor device and method of forming a semiconductor device |
Jun. 12, 2007 |
| 7230320 |
Electronic circuit device with reduced breaking and cracking |
Jun. 12, 2007 |
| 7227198 |
Half-bridge package |
Jun. 5, 2007 |
| 7227240 |
Semiconductor device with wire bond inductor and method |
Jun. 5, 2007 |
| 7227249 |
Three-dimensional stacked semiconductor package with chips on opposite sides of lead |
Jun. 5, 2007 |
| 7227251 |
Semiconductor device and a memory system including a plurality of IC chips in a common package |
Jun. 5, 2007 |
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