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Class Information
Number: 257/728
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > For high frequency (e.g., microwave) device
Description: Subject matter wherein the active solid-state device provided with a housing or package is a high frequency solid-state electronic device operating at high frequencies, such as microwave frequencies or above.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17

Patent Number Title Of Patent Date Issued
8710655 Die packages and systems having the die packages Apr. 29, 2014
8704384 Stacked die assembly Apr. 22, 2014
8653649 Device housing package and mounting structure Feb. 18, 2014
8643176 Power semiconductor chip having two metal layers on one face Feb. 4, 2014
8643492 Encapsulated RFID tags and methods of making same Feb. 4, 2014
8618656 Flexible semiconductor package apparatus having a responsive bendable conductive wire member and a manufacturing the same Dec. 31, 2013
8618655 Carrier-free semiconductor package Dec. 31, 2013
8619003 Semiconductor device with wireless communication Dec. 31, 2013
8610255 Light emitting device package Dec. 17, 2013
8604615 Semiconductor device including a stack of semiconductor chips, underfill material and molding material Dec. 10, 2013
8606193 RF transceiver IC having internal loopback conductor for IP2 self test Dec. 10, 2013
8598694 Chip-package having a cavity and a manufacturing method thereof Dec. 3, 2013
8598709 Method and system for routing electrical connections of semiconductor chips Dec. 3, 2013
8592960 Leadframe package with integrated partial waveguide interface Nov. 26, 2013
8592957 Semiconductor device having shield layer and chip-side power supply terminal capacitively coupled therein Nov. 26, 2013
8587088 Side-mounted controller and methods for making the same Nov. 19, 2013
8569881 Semiconductor device Oct. 29, 2013
8569884 Multiple die in a face down package Oct. 29, 2013
8558380 Stack package and method for manufacturing the same Oct. 15, 2013
8546927 RFIC chip mounting structure Oct. 1, 2013
8546939 RF module including control IC without the aid of a relay pad Oct. 1, 2013
8531037 Semiconductor chip having power supply line with minimized voltage drop Sep. 10, 2013
8517275 Semiconductor device Aug. 27, 2013
8519537 3D semiconductor package interposer with die cavity Aug. 27, 2013
8508023 System and method for lowering contact resistance of the radio frequency (RF) shield to ground Aug. 13, 2013
8508045 Package 3D interconnection and method of making same Aug. 13, 2013
8508048 Semiconductor device utilizing a package on package structure and manufacturing method thereof Aug. 13, 2013
8508412 Semiconductor package and semiconductor device Aug. 13, 2013
8502377 Package substrate for bump on trace interconnection Aug. 6, 2013
8487430 Multi-layer high-speed integrated circuit ball grid array package and process Jul. 16, 2013
8476757 Flip chip interconnect method and design for GaAs MMIC applications Jul. 2, 2013
8471377 Semiconductor device and semiconductor circuit substrate Jun. 25, 2013
8471382 Package and high frequency terminal structure for the same Jun. 25, 2013
8450846 Method and system for communicating via flip-chip die and package waveguides May. 28, 2013
8450837 Circuit device having an improved heat dissipitation, and the method of manufacturing the same May. 28, 2013
8441115 Semiconductor device with exposed thermal conductivity part May. 14, 2013
8436450 Differential internally matched wire-bond interface May. 7, 2013
8436466 Method and system for intra-chip waveguide communication May. 7, 2013
8432022 Shielded embedded electronic component substrate fabrication method and structure Apr. 30, 2013
8426980 Chip-to-chip multi-signaling communication system with common conductive layer Apr. 23, 2013
8415803 Method and system for routing electrical connections of semiconductor chips Apr. 9, 2013
8410601 RF package Apr. 2, 2013
8399992 Package-on-package type semiconductor package Mar. 19, 2013
8395256 Packaging for low-cost, high-performance microwave and millimeter wave modules Mar. 12, 2013
8390109 Chip package with plank stack of semiconductor dies Mar. 5, 2013
8378470 Semiconductor device that performs signal transmission using induction coupling, method of said manufacturing semiconductor device, and lead frame thereof Feb. 19, 2013
8378482 Wiring board Feb. 19, 2013
8378473 Semiconductor device having semiconductor chip within multilayer substrate Feb. 19, 2013
8373280 Manufacturing fixture for a ramp-stack chip package using solder for coupling a ramp component Feb. 12, 2013
8368216 Semiconductor package Feb. 5, 2013

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