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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Physics
Class Information
Number: 257/727
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Device held in place by clamping
Description: Subject matter wherein at least one of the plural devices is held in place by clamp means (i.e., by means which press a device into place).










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14

Patent Number Title Of Patent Date Issued
8709870 Method of forming solderable side-surface terminals of quad no-lead frame (QFN) integrated circuit packages Apr. 29, 2014
8710644 Semiconductor unit having a power semiconductor and semiconductor apparatus using the same Apr. 29, 2014
8659130 Power module and power module manufacturing method Feb. 25, 2014
8659150 Semiconductor module Feb. 25, 2014
8659902 Electronic module and electronic assembly comprising such a module Feb. 25, 2014
8637977 Semiconductor device and method of packaging a semiconductor device with a clip Jan. 28, 2014
8637981 Dual compartment semiconductor package with temperature sensor Jan. 28, 2014
8629555 Fixture for semiconductor device and assembly of semiconductor device Jan. 14, 2014
8610265 Compliant core peripheral lead semiconductor test socket Dec. 17, 2013
8564117 Compliant spring interposer for wafer level three dimensional (3D) integration and method of manufacturing Oct. 22, 2013
8519537 3D semiconductor package interposer with die cavity Aug. 27, 2013
8502365 Semiconductor device and power semiconductor device Aug. 6, 2013
8498118 Mounting assembly for heat dissipating device Jul. 30, 2013
8486757 Semiconductor device and method of packaging a semiconductor device with a clip Jul. 16, 2013
8487429 Assembly of multi-chip modules using sacrificial features Jul. 16, 2013
8456836 Spring loaded security slot attachment for portable device security Jun. 4, 2013
8379403 Spacer-connector and circuit board assembly Feb. 19, 2013
8373269 Jigs with controlled spacing for bonding dies onto package substrates Feb. 12, 2013
8373259 Optical connection through single assembly overhang flip chip optics die with micro structure alignment Feb. 12, 2013
8363405 Heat dissipation device Jan. 29, 2013
8338944 Semiconductor device, semiconductor module, radiating fin and fitting portions Dec. 25, 2012
8338955 Single-sided, flat, no lead, integrated circuit package Dec. 25, 2012
8304867 Crack arrest vias for IC devices Nov. 6, 2012
8283777 Compressive ring structure for flip chip packaging Oct. 9, 2012
8274793 Heatsink mounting system Sep. 25, 2012
8274798 Carrier substrate and method for making the same Sep. 25, 2012
8258622 Power device package and semiconductor package mold for fabricating the same Sep. 4, 2012
8238110 Device to shield against interference from electrical appliances Aug. 7, 2012
8238103 Electronic component unit and coupling mechanism Aug. 7, 2012
8232632 Composite contact for fine pitch electrical interconnect assembly Jul. 31, 2012
8223488 Locking assembly for electronic tablet and other devices Jul. 17, 2012
8213180 Electromagnetic interference shield with integrated heat sink Jul. 3, 2012
8193618 Semiconductor die package with clip interconnection Jun. 5, 2012
8188597 Fixture to constrain laminate and method of assembly May. 29, 2012
8154119 Compliant spring interposer for wafer level three dimensional (3D) integration and method of manufacturing Apr. 10, 2012
8139356 Plunger security lock and personal electronic device configured to be secured by the plunger lock Mar. 20, 2012
8134835 Compression clamping of semiconductor components Mar. 13, 2012
8125783 Printed circuit board and electronic apparatus Feb. 28, 2012
8067781 Light emitting structure and securing device thereof Nov. 29, 2011
8067273 Self locking and aligning clip structure for semiconductor die package Nov. 29, 2011
8063485 Electronics package with integrated lugs for cooling attachment Nov. 22, 2011
8044502 Composite contact for fine pitch electrical interconnect assembly Oct. 25, 2011
8026603 Interconnect structure of an integrated circuit and manufacturing method thereof Sep. 27, 2011
8018072 Semiconductor package having a heat spreader with an exposed exterion surface and a top mold gate Sep. 13, 2011
7994637 High-frequency semiconductor device Aug. 9, 2011
7982308 Light-emitting diode packaging structure and light-emitting diode module Jul. 19, 2011
7977698 System and method for surface mountable display Jul. 12, 2011
7961473 Retention module for toolless heat sink installation Jun. 14, 2011
7960828 Carrier frame for electronic components and production method for electronic components Jun. 14, 2011
7955904 Lens support and wirebond protector Jun. 7, 2011

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