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Class Information
Number: 257/725
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > For plural devices > With electrical isolation means
Description: Subject matter wherein means are provided to electrically isolate the plural devices from each other.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7622811 |
Semiconductor assembly with component attached on die back side |
Nov. 24, 2009 |
| 7622805 |
Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof |
Nov. 24, 2009 |
| 7592688 |
Semiconductor package |
Sep. 22, 2009 |
| 7589395 |
Multiple-dice packages using elements between dice to control application of underfill material to reduce void formation |
Sep. 15, 2009 |
| 7576440 |
Semiconductor chip having bond pads and multi-chip package |
Aug. 18, 2009 |
| 7569922 |
Semiconductor device having a bonding wire and method for manufacturing the same |
Aug. 4, 2009 |
| 7564128 |
Fully testable surface mount die package configured for two-sided cooling |
Jul. 21, 2009 |
| 7557434 |
Power electronic package having two substrates with multiple electronic components |
Jul. 7, 2009 |
| 7547978 |
Underfill and encapsulation of semiconductor assemblies with materials having differing properties |
Jun. 16, 2009 |
| 7541682 |
Semiconductor chip having bond pads |
Jun. 2, 2009 |
| 7531890 |
Multi-chip package (MCP) with a conductive bar and method for manufacturing the same |
May. 12, 2009 |
| 7524703 |
Integrated circuit stacking system and method |
Apr. 28, 2009 |
| 7521763 |
Dual stress STI |
Apr. 21, 2009 |
| 7514774 |
Stacked multi-chip package with EMI shielding |
Apr. 7, 2009 |
| 7511374 |
Microelectronic imaging units having covered image sensors |
Mar. 31, 2009 |
| 7504670 |
Sealing structure for mounting a semiconductor device to a substrate |
Mar. 17, 2009 |
| 7495336 |
Array capacitors for broadband decoupling applications |
Feb. 24, 2009 |
| 7468547 |
RF-coupled digital isolator |
Dec. 23, 2008 |
| 7466021 |
Memory packages having stair step interconnection layers |
Dec. 16, 2008 |
| 7462935 |
Structure and method for forming a capacitively coupled chip-to-chip signaling interface |
Dec. 9, 2008 |
| 7459776 |
Stacked die assembly having semiconductor die projecting beyond support |
Dec. 2, 2008 |
| 7456500 |
Light source module and method for production thereof |
Nov. 25, 2008 |
| 7446411 |
Semiconductor structure and method of assembly |
Nov. 4, 2008 |
| 7432593 |
Semiconductor package assembly and method for electrically isolating modules |
Oct. 7, 2008 |
| 7423340 |
Semiconductor package free of substrate and fabrication method thereof |
Sep. 9, 2008 |
| 7414299 |
Semiconductor package assembly and method for electrically isolating modules |
Aug. 19, 2008 |
| 7400038 |
Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication |
Jul. 15, 2008 |
| 7385283 |
Three dimensional integrated circuit and method of making the same |
Jun. 10, 2008 |
| 7382056 |
Integrated passive devices |
Jun. 3, 2008 |
| 7355264 |
Integrated passive devices with high Q inductors |
Apr. 8, 2008 |
| 7345363 |
Semiconductor device with a rewiring level and method for producing the same |
Mar. 18, 2008 |
| 7335986 |
Wafer level chip scale package |
Feb. 26, 2008 |
| 7330702 |
Method and apparatus for inter-chip wireless communication |
Feb. 12, 2008 |
| 7327022 |
Assembly, contact and coupling interconnection for optoelectronics |
Feb. 5, 2008 |
| 7327019 |
Semiconductor device of a charge storage type |
Feb. 5, 2008 |
| 7321164 |
Stack structure with semiconductor chip embedded in carrier |
Jan. 22, 2008 |
| 7315455 |
Surface-mounted electronic component module and method for manufacturing the same |
Jan. 1, 2008 |
| 7304372 |
Semiconductor package |
Dec. 4, 2007 |
| 7298045 |
Stacked semiconductor device |
Nov. 20, 2007 |
| 7282789 |
Back-to-back semiconductor device assemblies |
Oct. 16, 2007 |
| 7276790 |
Methods of forming a multi-chip module having discrete spacers |
Oct. 2, 2007 |
| 7268422 |
Method of making a semiconductor device adapted to remove noise from a signal |
Sep. 11, 2007 |
| 7259450 |
Double-packaged multi-chip semiconductor module |
Aug. 21, 2007 |
| 7242087 |
Flexible printed circuit board |
Jul. 10, 2007 |
| 7242078 |
Surface mount multichip devices |
Jul. 10, 2007 |
| 7230320 |
Electronic circuit device with reduced breaking and cracking |
Jun. 12, 2007 |
| 7230329 |
Semiconductor device, electronic device, electronic equipment, method of manufacturing semiconductor device, and method of manufacturing electronic device |
Jun. 12, 2007 |
| 7227240 |
Semiconductor device with wire bond inductor and method |
Jun. 5, 2007 |
| 7227249 |
Three-dimensional stacked semiconductor package with chips on opposite sides of lead |
Jun. 5, 2007 |
| 7227251 |
Semiconductor device and a memory system including a plurality of IC chips in a common package |
Jun. 5, 2007 |
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