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Class Information
Number: 257/725
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > For plural devices > With electrical isolation means
Description: Subject matter wherein means are provided to electrically isolate the plural devices from each other.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459776 |
Stacked die assembly having semiconductor die projecting beyond support |
Dec. 2, 2008 |
| 7456500 |
Light source module and method for production thereof |
Nov. 25, 2008 |
| 7446411 |
Semiconductor structure and method of assembly |
Nov. 4, 2008 |
| 7432593 |
Semiconductor package assembly and method for electrically isolating modules |
Oct. 7, 2008 |
| 7423340 |
Semiconductor package free of substrate and fabrication method thereof |
Sep. 9, 2008 |
| 7414299 |
Semiconductor package assembly and method for electrically isolating modules |
Aug. 19, 2008 |
| 7400038 |
Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication |
Jul. 15, 2008 |
| 7385283 |
Three dimensional integrated circuit and method of making the same |
Jun. 10, 2008 |
| 7382056 |
Integrated passive devices |
Jun. 3, 2008 |
| 7355264 |
Integrated passive devices with high Q inductors |
Apr. 8, 2008 |
| 7345363 |
Semiconductor device with a rewiring level and method for producing the same |
Mar. 18, 2008 |
| 7335986 |
Wafer level chip scale package |
Feb. 26, 2008 |
| 7330702 |
Method and apparatus for inter-chip wireless communication |
Feb. 12, 2008 |
| 7327019 |
Semiconductor device of a charge storage type |
Feb. 5, 2008 |
| 7327022 |
Assembly, contact and coupling interconnection for optoelectronics |
Feb. 5, 2008 |
| 7321164 |
Stack structure with semiconductor chip embedded in carrier |
Jan. 22, 2008 |
| 7315455 |
Surface-mounted electronic component module and method for manufacturing the same |
Jan. 1, 2008 |
| 7304372 |
Semiconductor package |
Dec. 4, 2007 |
| 7298045 |
Stacked semiconductor device |
Nov. 20, 2007 |
| 7282789 |
Back-to-back semiconductor device assemblies |
Oct. 16, 2007 |
| 7276790 |
Methods of forming a multi-chip module having discrete spacers |
Oct. 2, 2007 |
| 7268422 |
Method of making a semiconductor device adapted to remove noise from a signal |
Sep. 11, 2007 |
| 7259450 |
Double-packaged multi-chip semiconductor module |
Aug. 21, 2007 |
| 7242078 |
Surface mount multichip devices |
Jul. 10, 2007 |
| 7242087 |
Flexible printed circuit board |
Jul. 10, 2007 |
| 7230320 |
Electronic circuit device with reduced breaking and cracking |
Jun. 12, 2007 |
| 7230329 |
Semiconductor device, electronic device, electronic equipment, method of manufacturing semiconductor device, and method of manufacturing electronic device |
Jun. 12, 2007 |
| 7227249 |
Three-dimensional stacked semiconductor package with chips on opposite sides of lead |
Jun. 5, 2007 |
| 7227251 |
Semiconductor device and a memory system including a plurality of IC chips in a common package |
Jun. 5, 2007 |
| 7227240 |
Semiconductor device with wire bond inductor and method |
Jun. 5, 2007 |
| 7224053 |
Semiconductor device responsive to different levels of input and output signals and signal processing system using the same |
May. 29, 2007 |
| 7221040 |
Semiconductor package assembly and method for electrically isolating modules |
May. 22, 2007 |
| 7221244 |
Localized enhancement of multilayer substrate thickness for high Q RF components |
May. 22, 2007 |
| 7199469 |
Semiconductor device having stacked semiconductor chips sealed with a resin seal member |
Apr. 3, 2007 |
| 7176566 |
Semiconductor package assembly and method for electrically isolating modules |
Feb. 13, 2007 |
| 7176560 |
Semiconductor device having a chip--chip structure |
Feb. 13, 2007 |
| 7173325 |
Expansion constrained die stack |
Feb. 6, 2007 |
| 7173340 |
Daisy chaining of serial I/O interface on stacking devices |
Feb. 6, 2007 |
| 7166915 |
Multi-chip module system |
Jan. 23, 2007 |
| 7166918 |
Semiconductor package assembly and method for electrically isolating modules |
Jan. 23, 2007 |
| 7157309 |
Manufacture of microelectronic fold packages |
Jan. 2, 2007 |
| 7123107 |
Piezoelectric oscillator, manufacturing method thereof, and electronic device |
Oct. 17, 2006 |
| 7122876 |
Isolation-region configuration for integrated-circuit transistor |
Oct. 17, 2006 |
| 7095113 |
Semiconductor device with interlocking clip |
Aug. 22, 2006 |
| 7088964 |
Single chip radio with integrated antenna |
Aug. 8, 2006 |
| 7053466 |
High-speed signaling interface with broadside dynamic wave coupling |
May. 30, 2006 |
| 7045884 |
Semiconductor device package |
May. 16, 2006 |
| 7042085 |
Method for packaging electronic modules and multiple chip packaging |
May. 9, 2006 |
| 7030455 |
Integrated electromagnetic shielding device |
Apr. 18, 2006 |
| 7026664 |
DC-DC converter implemented in a land grid array package |
Apr. 11, 2006 |
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