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Class Information
Number: 257/725
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > For plural devices > With electrical isolation means
Description: Subject matter wherein means are provided to electrically isolate the plural devices from each other.

Sub-classes under this class:

Class Number Class Name Patents
257/726 Devices held in place by clamping 307

Patents under this class:
1 2 3 4 5 6 7 8

Patent Number Title Of Patent Date Issued
8704364 Reducing stress in multi-die integrated circuit structures Apr. 22, 2014
8704384 Stacked die assembly Apr. 22, 2014
8669656 Interconnect having ultra high speed signal transmission/reception Mar. 11, 2014
8659149 Semiconductor structure with galvanic isolation Feb. 25, 2014
8643167 Semiconductor package with through silicon vias and method for making the same Feb. 4, 2014
8624375 Semiconductor package for selecting semiconductor chip from a chip stack Jan. 7, 2014
8618654 Structures embedded within core material and methods of manufacturing thereof Dec. 31, 2013
8610255 Light emitting device package Dec. 17, 2013
8592973 Integrated circuit packaging system with package-on-package stacking and method of manufacture thereof Nov. 26, 2013
8558380 Stack package and method for manufacturing the same Oct. 15, 2013
8558374 Electronic package with thermal interposer and method of making same Oct. 15, 2013
8546938 Stacked package including spacers and method of manufacturing the same Oct. 1, 2013
8513794 Stacked assembly including plurality of stacked microelectronic elements Aug. 20, 2013
8492889 Semiconductor package Jul. 23, 2013
8436429 Stacked power semiconductor device using dual lead frame and manufacturing method May. 7, 2013
8432030 Power electronic package having two substrates with multiple semiconductor chips and electronic components Apr. 30, 2013
8427844 Widebody coil isolators Apr. 23, 2013
8421211 Wafer level semiconductor package and fabrication method thereof Apr. 16, 2013
8415783 Apparatus and methodology for testing stacked die Apr. 9, 2013
8390114 Semiconductor package Mar. 5, 2013
8373259 Optical connection through single assembly overhang flip chip optics die with micro structure alignment Feb. 12, 2013
8335077 Insulating aperture in printed circuit boards Dec. 18, 2012
8330261 Method to manufacture a silicon wafer electronic component protected against the attacks and such a component Dec. 11, 2012
8330252 Integrated circuit device and method for the production thereof Dec. 11, 2012
8304873 Manufacturing method for display device and display device Nov. 6, 2012
8304899 Element wafer and method for manufacturing the same Nov. 6, 2012
8268673 Stacked electronic component and manufacturing method thereof Sep. 18, 2012
8269343 Semiconductor device including a pressure-contact section Sep. 18, 2012
8253244 Semiconductor package having memory devices stacked on logic device Aug. 28, 2012
8253241 Electronic module Aug. 28, 2012
8253235 Semiconductor packaging substrate improving capability of electrostatic dissipation Aug. 28, 2012
8253226 Electronic parts, and method for arranging shielding case and chip parts Aug. 28, 2012
8231056 System for and method of protecting an integrated circuit from over currents Jul. 31, 2012
8193624 Semiconductor device having improved contact interface reliability and method therefor Jun. 5, 2012
8183574 Thermal isolation of electronic devices in submount used for LEDs lighting applications May. 22, 2012
8179679 Airflow guides using silicon walls/creating channels for heat control May. 15, 2012
8154881 Radiation-shielded semiconductor assembly Apr. 10, 2012
8148814 Semiconductor integrated circuit device comprising a plurality of semiconductor chips mounted to stack for transmitting a signal between the semiconductor chips Apr. 3, 2012
8143719 Vented die and package Mar. 27, 2012
8143720 Semiconductor module with micro-buffers Mar. 27, 2012
8134233 Method and apparatus for providing electrically isolated closely spaced features on a printed circuit board Mar. 13, 2012
8093983 Narrowbody coil isolator Jan. 10, 2012
8080865 RF-coupled digital isolator Dec. 20, 2011
8049331 Structure and method for forming a capacitively coupled chip-to-chip signaling interface Nov. 1, 2011
8030134 Stacked semiconductor package having adhesive/spacer structure and insulation Oct. 4, 2011
8030764 High temperature operating package and circuit design Oct. 4, 2011
8004089 Semiconductor device having wiring line and manufacturing method thereof Aug. 23, 2011
7999369 Power electronic package having two substrates with multiple semiconductor chips and electronic components Aug. 16, 2011
7989269 Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof Aug. 2, 2011
7977232 Semiconductor wafer including cracking stopper structure and method of forming the same Jul. 12, 2011

1 2 3 4 5 6 7 8

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