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Class Information
Number: 257/724
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > For plural devices > With discrete components
Description: Subject matter wherein at least some of the electronic components are in the form of an individual device per semiconductor chip, as contrasted to a single integrated circuit containing plural semiconductor devices. The discrete components may be active solid-state devices or passive components such as resistors, capacitors, or inductors.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459784 |
High capacity thin module system |
Dec. 2, 2008 |
| 7459776 |
Stacked die assembly having semiconductor die projecting beyond support |
Dec. 2, 2008 |
| 7459765 |
Semiconductor apparatus with decoupling capacitor |
Dec. 2, 2008 |
| 7454637 |
Voltage regulator having reduced droop |
Nov. 18, 2008 |
| 7453146 |
High power MCM package with improved planarity and heat dissipation |
Nov. 18, 2008 |
| 7449778 |
Power semiconductor module as H-bridge circuit and method for producing the same |
Nov. 11, 2008 |
| 7447038 |
Module |
Nov. 4, 2008 |
| 7446639 |
Micro power converter and method of manufacturing same |
Nov. 4, 2008 |
| 7443687 |
Heat sink mounting device and mounting method, and server blade using the same |
Oct. 28, 2008 |
| 7443042 |
Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit |
Oct. 28, 2008 |
| 7443025 |
Thermally improved placement of power-dissipating components onto a circuit board |
Oct. 28, 2008 |
| 7436057 |
Elastomer interposer with voids in a compressive loading system |
Oct. 14, 2008 |
| 7435619 |
Method of fabricating a 3-D package stacking system |
Oct. 14, 2008 |
| 7432593 |
Semiconductor package assembly and method for electrically isolating modules |
Oct. 7, 2008 |
| 7429794 |
Multi-chip packaged integrated circuit device for transmitting signals from one chip to another chip |
Sep. 30, 2008 |
| 7429781 |
Memory package |
Sep. 30, 2008 |
| 7427808 |
Micro-sensor |
Sep. 23, 2008 |
| 7425763 |
Electronic circuit package |
Sep. 16, 2008 |
| 7425760 |
Multi-chip module structure with power delivery using flexible cables |
Sep. 16, 2008 |
| 7423341 |
Plastic overmolded packages with mechanically decoupled lid attach attachment |
Sep. 9, 2008 |
| 7417299 |
Direct connection multi-chip semiconductor element structure |
Aug. 26, 2008 |
| 7414312 |
Memory-module board layout for use with memory chips of different data widths |
Aug. 19, 2008 |
| 7414299 |
Semiconductor package assembly and method for electrically isolating modules |
Aug. 19, 2008 |
| 7413929 |
Integrated chip package structure using organic substrate and method of manufacturing the same |
Aug. 19, 2008 |
| 7411293 |
Flash memory card |
Aug. 12, 2008 |
| 7411292 |
Flash memory card |
Aug. 12, 2008 |
| 7408255 |
Assembly for stacked BGA packages |
Aug. 5, 2008 |
| 7405476 |
Asymmetric alignment of substrate interconnect to semiconductor die |
Jul. 29, 2008 |
| 7405475 |
Method and system of tape automated bonding |
Jul. 29, 2008 |
| 7405467 |
Power module package structure |
Jul. 29, 2008 |
| 7405448 |
Semiconductor device having a resistance for equalizing the current distribution |
Jul. 29, 2008 |
| 7400038 |
Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication |
Jul. 15, 2008 |
| 7394160 |
Printed wires arrangement for in-line memory (IMM) module |
Jul. 1, 2008 |
| 7391110 |
Apparatus for providing capacitive decoupling between on-die power and ground conductors |
Jun. 24, 2008 |
| 7391100 |
Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area |
Jun. 24, 2008 |
| 7390699 |
Integrated circuit die connection methods and apparatus |
Jun. 24, 2008 |
| 7388287 |
Semiconductor package |
Jun. 17, 2008 |
| 7385296 |
Sensor device having stopper for limitting displacement |
Jun. 10, 2008 |
| 7385286 |
Semiconductor module |
Jun. 10, 2008 |
| 7385283 |
Three dimensional integrated circuit and method of making the same |
Jun. 10, 2008 |
| 7385278 |
Strobe light control circuit and IGBT device |
Jun. 10, 2008 |
| 7378733 |
Composite flip-chip package with encased components and method of fabricating same |
May. 27, 2008 |
| 7375421 |
High density multilayer circuit module |
May. 20, 2008 |
| 7372702 |
Heat spreader |
May. 13, 2008 |
| 7372139 |
Semiconductor chip package |
May. 13, 2008 |
| 7371608 |
Method of fabricating a stacked die having a recess in a die BGA package |
May. 13, 2008 |
| 7366629 |
High frequency module board device |
Apr. 29, 2008 |
| 7365428 |
Array capacitor with resistive structure |
Apr. 29, 2008 |
| 7361987 |
Circuit device with at least partial packaging and method for forming |
Apr. 22, 2008 |
| 7358115 |
Method of fabricating a semiconductor assembly including chip scale package and second substrate with exposed substrate surfaces on upper and lower sides |
Apr. 15, 2008 |
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