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Browse by Category: Main > Physics
Class Information
Number: 257/724
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > For plural devices > With discrete components
Description: Subject matter wherein at least some of the electronic components are in the form of an individual device per semiconductor chip, as contrasted to a single integrated circuit containing plural semiconductor devices. The discrete components may be active solid-state devices or passive components such as resistors, capacitors, or inductors.










Patents under this class:

Patent Number Title Of Patent Date Issued
8710663 Method of manufacturing semiconductor device and semiconductor device Apr. 29, 2014
8710655 Die packages and systems having the die packages Apr. 29, 2014
8710653 Chip on chip semiconductor device including an underfill layer having a resin containing an amine-based curing agent Apr. 29, 2014
8704384 Stacked die assembly Apr. 22, 2014
8704365 Integrated circuit packaging system having a cavity Apr. 22, 2014
8704351 Stacked microelectronic assemblies Apr. 22, 2014
8703540 Chip-scale semiconductor die packaging method Apr. 22, 2014
8692385 Device for connecting nano-objects to external electrical systems, and method for producing said device Apr. 8, 2014
8692368 Integrated voltage regulator method with embedded passive device(s) Apr. 8, 2014
8685792 Integrated circuit package system with interposer Apr. 1, 2014
8680674 Methods and structures for reducing heat exposure of thermally sensitive semiconductor devices Mar. 25, 2014
8680652 Stack package Mar. 25, 2014
8674497 Stacked half-bridge package with a current carrying layer Mar. 18, 2014
8669648 Power semiconductor module Mar. 11, 2014
8659148 Tileable sensor array Feb. 25, 2014
8653660 Semiconductor device and package Feb. 18, 2014
8653655 Semiconductor device and manufacturing method thereof Feb. 18, 2014
8653654 Integrated circuit packaging system with a stackable package and method of manufacture thereof Feb. 18, 2014
8653652 Semiconductor device, power semiconductor module and power conversion device equipped with power semiconductor module Feb. 18, 2014
8643167 Semiconductor package with through silicon vias and method for making the same Feb. 4, 2014
8637997 Semiconductor device and method of manufacturing the same Jan. 28, 2014
8633579 Multi-chip package and method of manufacturing the same Jan. 21, 2014
8624390 Packaging an electronic device Jan. 7, 2014
8624369 Balance filter packaging chip having balun mounted therein and manufacturing method thereof Jan. 7, 2014
8624286 Semiconductor device Jan. 7, 2014
8624241 Semiconductor chip, stack-type semiconductor package Jan. 7, 2014
8619003 Semiconductor device with wireless communication Dec. 31, 2013
8618654 Structures embedded within core material and methods of manufacturing thereof Dec. 31, 2013
8618646 Layered chip package and method of manufacturing same Dec. 31, 2013
8610277 Bridge type pad structure of a semiconductor device Dec. 17, 2013
8610264 Compliant interconnects in wafers Dec. 17, 2013
8606387 Adaptive and automatic determination of system parameters Dec. 10, 2013
8604615 Semiconductor device including a stack of semiconductor chips, underfill material and molding material Dec. 10, 2013
8604611 Semiconductor device assembly utilizing a DBC substrate Dec. 10, 2013
8604610 Flexible power module semiconductor packages Dec. 10, 2013
8604608 Semiconductor module Dec. 10, 2013
8604595 Multi-chip electronic package with reduced stress Dec. 10, 2013
8598709 Method and system for routing electrical connections of semiconductor chips Dec. 3, 2013
8598694 Chip-package having a cavity and a manufacturing method thereof Dec. 3, 2013
8593817 Power semiconductor module and method for operating a power semiconductor module Nov. 26, 2013
8592974 Package configurations for low EMI circuits Nov. 26, 2013
8592973 Integrated circuit packaging system with package-on-package stacking and method of manufacture thereof Nov. 26, 2013
8592969 Semiconductor device with protective screen Nov. 26, 2013
8592310 Methods of manufacturing a semiconductor device Nov. 26, 2013
8590136 Method of fabricating a dual single-crystal backplate microphone Nov. 26, 2013
8587117 Stacked semiconductor chips having circuit element provided with each of the semiconductor chips Nov. 19, 2013
8581395 Hybrid integrated circuit device and electronic device Nov. 12, 2013
8581394 Semiconductor package module and electric circuit assembly with the same Nov. 12, 2013
8569884 Multiple die in a face down package Oct. 29, 2013
8569882 Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereof Oct. 29, 2013











 
 
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