| |
 |
|
Class Information
Number: 257/724
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > For plural devices > With discrete components
Description: Subject matter wherein at least some of the electronic components are in the form of an individual device per semiconductor chip, as contrasted to a single integrated circuit containing plural semiconductor devices. The discrete components may be active solid-state devices or passive components such as resistors, capacitors, or inductors.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619308 |
Multi-lid semiconductor package |
Nov. 17, 2009 |
| 7619296 |
Circuit board and semiconductor device |
Nov. 17, 2009 |
| 7618896 |
Semiconductor die package including multiple dies and a common node structure |
Nov. 17, 2009 |
| 7612439 |
Semiconductor package having improved thermal performance |
Nov. 3, 2009 |
| 7608925 |
Relay board with bonding pads connected by wirings |
Oct. 27, 2009 |
| 7606049 |
Module thermal management system and method |
Oct. 20, 2009 |
| 7605683 |
Monolithic electronic component |
Oct. 20, 2009 |
| 7603771 |
Method of manufacturing a combined multilayer circuit board having embedded chips |
Oct. 20, 2009 |
| 7602614 |
Electronic module and method for the production thereof |
Oct. 13, 2009 |
| 7602039 |
Programmable capacitor associated with an input/output pad |
Oct. 13, 2009 |
| 7602028 |
NAND flash memory devices having 3-dimensionally arranged memory cells and methods of fabricating the same |
Oct. 13, 2009 |
| 7601563 |
Small form factor molded memory card and a method thereof |
Oct. 13, 2009 |
| 7596850 |
Method for temporarily inactivating a wireless communication device |
Oct. 6, 2009 |
| 7592702 |
Via heat sink material |
Sep. 22, 2009 |
| 7592689 |
Semiconductor module comprising semiconductor chips and method for producing the same |
Sep. 22, 2009 |
| 7592688 |
Semiconductor package |
Sep. 22, 2009 |
| 7589409 |
Stacked packages and microelectronic assemblies incorporating the same |
Sep. 15, 2009 |
| 7589395 |
Multiple-dice packages using elements between dice to control application of underfill material to reduce void formation |
Sep. 15, 2009 |
| 7586192 |
Routing configuration for high frequency signals in an integrated circuit package |
Sep. 8, 2009 |
| 7586188 |
Chip package and coreless package substrate thereof |
Sep. 8, 2009 |
| 7583511 |
Semiconductor die package with internal bypass capacitors |
Sep. 1, 2009 |
| 7582963 |
Vertically integrated system-in-a-package |
Sep. 1, 2009 |
| 7579691 |
Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication |
Aug. 25, 2009 |
| 7579687 |
Circuit module turbulence enhancement systems and methods |
Aug. 25, 2009 |
| 7576440 |
Semiconductor chip having bond pads and multi-chip package |
Aug. 18, 2009 |
| 7576419 |
Semiconductor device |
Aug. 18, 2009 |
| 7573119 |
Semiconductor device |
Aug. 11, 2009 |
| 7569932 |
Rotary chip attach |
Aug. 4, 2009 |
| 7569918 |
Semiconductor package-on-package system including integrated passive components |
Aug. 4, 2009 |
| 7569423 |
Wafer-level-chip-scale package and method of fabrication |
Aug. 4, 2009 |
| 7566960 |
Interposing structure |
Jul. 28, 2009 |
| 7564141 |
Apparatus and method for preventing configurable system-on-a-chip integrated circuits from becoming I/O limited |
Jul. 21, 2009 |
| 7564126 |
Integrated circuit package |
Jul. 21, 2009 |
| 7564121 |
Semiconductor device having shield structure |
Jul. 21, 2009 |
| 7557434 |
Power electronic package having two substrates with multiple electronic components |
Jul. 7, 2009 |
| 7554195 |
Engine with cable direct to outboard memory |
Jun. 30, 2009 |
| 7553699 |
Method of fabricating microelectronic devices |
Jun. 30, 2009 |
| 7550833 |
Semiconductor device having a second semiconductor construction mounted on a first semiconductor construction and a manufacturing method thereof |
Jun. 23, 2009 |
| 7550832 |
Stackable semiconductor package |
Jun. 23, 2009 |
| 7550321 |
Substrate having a functionally gradient coefficient of thermal expansion |
Jun. 23, 2009 |
| 7547978 |
Underfill and encapsulation of semiconductor assemblies with materials having differing properties |
Jun. 16, 2009 |
| 7545029 |
Stack microelectronic assemblies |
Jun. 9, 2009 |
| 7541682 |
Semiconductor chip having bond pads |
Jun. 2, 2009 |
| 7541662 |
Packaging chip having inductor therein |
Jun. 2, 2009 |
| 7539034 |
Memory configured on a common substrate |
May. 26, 2009 |
| 7538417 |
Semiconductor device with signal line having decreased characteristic impedance |
May. 26, 2009 |
| 7537962 |
Method of fabricating a shielded stacked integrated circuit package system |
May. 26, 2009 |
| 7535727 |
Light source module |
May. 19, 2009 |
| 7535088 |
Secure-digital (SD) flash card with slanted asymmetric circuit board |
May. 19, 2009 |
| 7528484 |
Multi-concentric pad arrangements for integrated circuit pads |
May. 5, 2009 |
|
|
|
