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Browse by Category: Main > Physics
Class Information
Number: 257/723
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > For plural devices
Description: Subject matter wherein a package or housing is provided for more than one electronic device, at least one of the electronic devices being an active solid-state device.










Sub-classes under this class:

Class Number Class Name Patents
257/724 With discrete components 1,723
257/725 With electrical isolation means 375


Patents under this class:

Patent Number Title Of Patent Date Issued
8710677 Multi-chip package with a supporting member and method of manufacturing the same Apr. 29, 2014
8710655 Die packages and systems having the die packages Apr. 29, 2014
8710653 Chip on chip semiconductor device including an underfill layer having a resin containing an amine-based curing agent Apr. 29, 2014
8710644 Semiconductor unit having a power semiconductor and semiconductor apparatus using the same Apr. 29, 2014
8709868 Sensor packages and method of packaging dies of differing sizes Apr. 29, 2014
8704384 Stacked die assembly Apr. 22, 2014
8704364 Reducing stress in multi-die integrated circuit structures Apr. 22, 2014
8704349 Integrated circuit package system with exposed interconnects Apr. 22, 2014
8693209 Wiring board and method for manufacturing the same Apr. 8, 2014
8687668 Multi-wavelength semiconductor laser device Apr. 1, 2014
8686571 Bonding layer structure and method for wafer to wafer bonding Apr. 1, 2014
8686559 Semiconductor chip stacking for redundancy and yield improvement Apr. 1, 2014
8686547 Stack die structure for stress reduction and facilitation of electromagnetic shielding Apr. 1, 2014
8685792 Integrated circuit package system with interposer Apr. 1, 2014
8680686 Method and system for thin multi chip stack package with film on wire and copper wire Mar. 25, 2014
8680664 Structure for encapsulating an electronic device Mar. 25, 2014
8669664 Stacked die package for MEMS resonator system Mar. 11, 2014
8669656 Interconnect having ultra high speed signal transmission/reception Mar. 11, 2014
8665596 Power switching circuitry Mar. 4, 2014
8664754 High power semiconductor package with multiple conductive clips Mar. 4, 2014
8664666 Semiconductor device and process for fabricating the same Mar. 4, 2014
8664044 Method of fabricating land grid array semiconductor package Mar. 4, 2014
8659148 Tileable sensor array Feb. 25, 2014
8659137 Stacked semiconductor device and manufacturing method thereof Feb. 25, 2014
8658882 Contactless power generation Feb. 25, 2014
8653655 Semiconductor device and manufacturing method thereof Feb. 18, 2014
8653654 Integrated circuit packaging system with a stackable package and method of manufacture thereof Feb. 18, 2014
8653653 High density three dimensional semiconductor die package Feb. 18, 2014
8653645 Semiconductor device comprising stacked LSI having circuit blocks connected by power supply and signal line through vias Feb. 18, 2014
8648463 Assembly of multi-chip modules with proximity connectors using reflowable features Feb. 11, 2014
8648455 Semiconductor device and method of manufacturing the same Feb. 11, 2014
8648341 Methods and apparatus for testing pads on wafers Feb. 11, 2014
8647926 Method of fabricating semiconductor plastic package including a core board, build-up insulation layer, printed circuit, and semiconductor chip Feb. 11, 2014
8643179 Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package Feb. 4, 2014
8643175 Multi-channel package and electronic system including the same Feb. 4, 2014
8638000 Micromechanical method and corresponding assembly for bonding semiconductor substrates and correspondingly bonded semiconductor chip Jan. 28, 2014
8637995 Bonded semiconductor structures including two or more processed semiconductor structures carried by a common substrate Jan. 28, 2014
8637985 Anti-tamper wrapper interconnect method and a device Jan. 28, 2014
8637981 Dual compartment semiconductor package with temperature sensor Jan. 28, 2014
8637978 System-in-a-package based flash memory card Jan. 28, 2014
8633580 Integrated void fill for through silicon via Jan. 21, 2014
8629562 Techniques for modular chip fabrication Jan. 14, 2014
8624378 Chip-housing module and a method for forming a chip-housing module Jan. 7, 2014
8624376 Package-on-package structure without through assembly vias Jan. 7, 2014
8624360 Cooling channels in 3DIC stacks Jan. 7, 2014
8624286 Semiconductor device Jan. 7, 2014
8623700 Inter-chip communication Jan. 7, 2014
8619003 Semiconductor device with wireless communication Dec. 31, 2013
8618673 Package structures Dec. 31, 2013
8618654 Structures embedded within core material and methods of manufacturing thereof Dec. 31, 2013











 
 
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