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Class Information
Number: 257/723
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > For plural devices
Description: Subject matter wherein a package or housing is provided for more than one electronic device, at least one of the electronic devices being an active solid-state device.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459777 |
Semiconductor package containing multi-layered semiconductor chips |
Dec. 2, 2008 |
| 7459776 |
Stacked die assembly having semiconductor die projecting beyond support |
Dec. 2, 2008 |
| 7459765 |
Semiconductor apparatus with decoupling capacitor |
Dec. 2, 2008 |
| 7453159 |
Semiconductor chip having bond pads |
Nov. 18, 2008 |
| 7453147 |
Semiconductor device, its manufacturing method, and radio communication device |
Nov. 18, 2008 |
| 7453146 |
High power MCM package with improved planarity and heat dissipation |
Nov. 18, 2008 |
| 7449778 |
Power semiconductor module as H-bridge circuit and method for producing the same |
Nov. 11, 2008 |
| 7449777 |
Circuit arrangement comprising a power component and a drive circuit integrated in two semiconductor bodies |
Nov. 11, 2008 |
| 7449774 |
Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same |
Nov. 11, 2008 |
| 7449726 |
Power semiconductor apparatus |
Nov. 11, 2008 |
| 7447038 |
Module |
Nov. 4, 2008 |
| 7446420 |
Through silicon via chip stack package capable of facilitating chip selection during device operation |
Nov. 4, 2008 |
| 7446413 |
Circuit apparatus and method for operating the same |
Nov. 4, 2008 |
| 7446404 |
Three-dimensional package and method of making the same |
Nov. 4, 2008 |
| 7446389 |
Semiconductor die package with internal bypass capacitors |
Nov. 4, 2008 |
| 7446383 |
Electronic device mountable onto a substrate using surface mount techniques, and method |
Nov. 4, 2008 |
| 7443681 |
Heat dissipator for display apparatus and plasma display apparatus including the heat dissipator |
Oct. 28, 2008 |
| 7443042 |
Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit |
Oct. 28, 2008 |
| 7443037 |
Stacked integrated circuit package system with connection protection |
Oct. 28, 2008 |
| 7443011 |
System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices |
Oct. 28, 2008 |
| 7439620 |
Integrated circuit package-in-package system |
Oct. 21, 2008 |
| 7439619 |
Electronic package structure and the packaging process thereof |
Oct. 21, 2008 |
| 7439615 |
Semiconductor component comprising an integrated semiconductor chip and a chip housing, and electronic device |
Oct. 21, 2008 |
| 7432593 |
Semiconductor package assembly and method for electrically isolating modules |
Oct. 7, 2008 |
| 7429794 |
Multi-chip packaged integrated circuit device for transmitting signals from one chip to another chip |
Sep. 30, 2008 |
| 7429793 |
Semiconductor device having an electronic circuit disposed therein |
Sep. 30, 2008 |
| 7429783 |
Image sensor package |
Sep. 30, 2008 |
| 7429781 |
Memory package |
Sep. 30, 2008 |
| 7427810 |
Semiconductor device including semiconductor element mounted on another semiconductor element |
Sep. 23, 2008 |
| 7425763 |
Electronic circuit package |
Sep. 16, 2008 |
| 7425758 |
Metal core foldover package structures |
Sep. 16, 2008 |
| 7423339 |
Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
Sep. 9, 2008 |
| 7423335 |
Sensor module package structure and method of the same |
Sep. 9, 2008 |
| 7420814 |
Package stack and manufacturing method thereof |
Sep. 2, 2008 |
| 7420281 |
Stacked chip semiconductor device |
Sep. 2, 2008 |
| 7420269 |
Stacked integrated circuit package-in-package system |
Sep. 2, 2008 |
| 7417198 |
Radiofrequency power semiconductor module with cavity housing, and method for producing it |
Aug. 26, 2008 |
| 7413929 |
Integrated chip package structure using organic substrate and method of manufacturing the same |
Aug. 19, 2008 |
| 7411291 |
Component with sensitive component structures and method for the production thereof |
Aug. 12, 2008 |
| 7411287 |
Staggered wirebonding configuration |
Aug. 12, 2008 |
| 7411282 |
LSI package provided with interface module, and transmission line header employed in the package |
Aug. 12, 2008 |
| 7409200 |
Module integration integrated circuits |
Aug. 5, 2008 |
| 7405486 |
Circuit device |
Jul. 29, 2008 |
| 7405475 |
Method and system of tape automated bonding |
Jul. 29, 2008 |
| 7402896 |
Integrated circuit (IC) carrier assembly incorporating serpentine suspension |
Jul. 22, 2008 |
| 7402442 |
Physically highly secure multi-chip assembly |
Jul. 22, 2008 |
| 7400047 |
Integrated circuit with stacked-die configuration utilizing substrate conduction |
Jul. 15, 2008 |
| 7400037 |
Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP |
Jul. 15, 2008 |
| 7400032 |
Module assembly for stacked BGA packages |
Jul. 15, 2008 |
| 7397132 |
Semiconductor device |
Jul. 8, 2008 |
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