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Class Information
Number: 257/723
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > For plural devices
Description: Subject matter wherein a package or housing is provided for more than one electronic device, at least one of the electronic devices being an active solid-state device.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619315 |
Stack type semiconductor chip package having different type of chips and fabrication method thereof |
Nov. 17, 2009 |
| 7619313 |
Multi-chip module and methods |
Nov. 17, 2009 |
| 7619308 |
Multi-lid semiconductor package |
Nov. 17, 2009 |
| 7619303 |
Integrated circuit package |
Nov. 17, 2009 |
| 7619296 |
Circuit board and semiconductor device |
Nov. 17, 2009 |
| 7615870 |
Semiconductor device, manufacturing method thereof, and connection method of circuit board |
Nov. 10, 2009 |
| 7615856 |
Integrated antenna type circuit apparatus |
Nov. 10, 2009 |
| 7615855 |
IC card and method of manufacturing the same |
Nov. 10, 2009 |
| 7615853 |
Chip-stacked package structure having leadframe with multi-piece bus bar |
Nov. 10, 2009 |
| 7612444 |
Semiconductor package with flow controller |
Nov. 3, 2009 |
| 7612443 |
Inter-chip communication |
Nov. 3, 2009 |
| 7612439 |
Semiconductor package having improved thermal performance |
Nov. 3, 2009 |
| 7608924 |
Liquid cooled power electronic circuit comprising stacked direct die cooled packages |
Oct. 27, 2009 |
| 7608921 |
Multi-layer semiconductor package |
Oct. 27, 2009 |
| 7608920 |
Memory card and method for devising |
Oct. 27, 2009 |
| 7608919 |
Interconnect packaging systems |
Oct. 27, 2009 |
| 7606042 |
High capacity thin module system and method |
Oct. 20, 2009 |
| 7606040 |
Memory module system and method |
Oct. 20, 2009 |
| 7605466 |
Sealed wafer packaging of microelectromechanical systems |
Oct. 20, 2009 |
| 7605459 |
Coreless substrate and manufacturing thereof |
Oct. 20, 2009 |
| 7605454 |
Memory card and method for devising |
Oct. 20, 2009 |
| 7605452 |
Semiconductor light-emitting device, semiconductor light-emitting module, and method of manufacturing the semiconductor light-emitting module |
Oct. 20, 2009 |
| 7601563 |
Small form factor molded memory card and a method thereof |
Oct. 13, 2009 |
| 7598617 |
Stack package utilizing through vias and re-distribution lines |
Oct. 6, 2009 |
| 7598606 |
Integrated circuit package system with die and package combination |
Oct. 6, 2009 |
| 7598123 |
Semiconductor component and method of manufacture |
Oct. 6, 2009 |
| 7596850 |
Method for temporarily inactivating a wireless communication device |
Oct. 6, 2009 |
| 7595550 |
Flex-based circuit module |
Sep. 29, 2009 |
| 7592704 |
Etched interposer for integrated circuit devices |
Sep. 22, 2009 |
| 7592702 |
Via heat sink material |
Sep. 22, 2009 |
| 7592696 |
Power module having at least two substrates |
Sep. 22, 2009 |
| 7592689 |
Semiconductor module comprising semiconductor chips and method for producing the same |
Sep. 22, 2009 |
| 7589400 |
Inverter and vehicle drive unit using the same |
Sep. 15, 2009 |
| 7586179 |
Wireless semiconductor package for efficient heat dissipation |
Sep. 8, 2009 |
| 7583511 |
Semiconductor die package with internal bypass capacitors |
Sep. 1, 2009 |
| 7582963 |
Vertically integrated system-in-a-package |
Sep. 1, 2009 |
| 7579691 |
Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication |
Aug. 25, 2009 |
| 7579690 |
Semiconductor package structure |
Aug. 25, 2009 |
| 7579689 |
Integrated circuit package, and a method for producing an integrated circuit package having two dies with input and output terminals of integrated circuits of the dies directly addressable for |
Aug. 25, 2009 |
| 7579681 |
Super high density module with integrated wafer level packages |
Aug. 25, 2009 |
| 7579260 |
Method of dividing an adhesive film bonded to a wafer |
Aug. 25, 2009 |
| 7579214 |
Semiconductor device and a method of manufacturing the same |
Aug. 25, 2009 |
| 7576440 |
Semiconductor chip having bond pads and multi-chip package |
Aug. 18, 2009 |
| 7576433 |
Semiconductor memory device and manufacturing method thereof |
Aug. 18, 2009 |
| 7576432 |
Using external radiators with electroosmotic pumps for cooling integrated circuits |
Aug. 18, 2009 |
| 7576431 |
Semiconductor chip package and multichip package |
Aug. 18, 2009 |
| 7573136 |
Semiconductor device assemblies and packages including multiple semiconductor device components |
Aug. 11, 2009 |
| 7573135 |
Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film |
Aug. 11, 2009 |
| 7573107 |
Power module |
Aug. 11, 2009 |
| 7572671 |
Stacked module systems and methods |
Aug. 11, 2009 |
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