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Class Information
Number: 257/723
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > For plural devices
Description: Subject matter wherein a package or housing is provided for more than one electronic device, at least one of the electronic devices being an active solid-state device.


Sub-classes under this class:

Class Number Class Name Patents
257/724 With discrete components 1,270
257/725 With electrical isolation means 285


Patents under this class:

Patent Number Title Of Patent Date Issued
7619315 Stack type semiconductor chip package having different type of chips and fabrication method thereof Nov. 17, 2009
7619313 Multi-chip module and methods Nov. 17, 2009
7619308 Multi-lid semiconductor package Nov. 17, 2009
7619303 Integrated circuit package Nov. 17, 2009
7619296 Circuit board and semiconductor device Nov. 17, 2009
7615870 Semiconductor device, manufacturing method thereof, and connection method of circuit board Nov. 10, 2009
7615856 Integrated antenna type circuit apparatus Nov. 10, 2009
7615855 IC card and method of manufacturing the same Nov. 10, 2009
7615853 Chip-stacked package structure having leadframe with multi-piece bus bar Nov. 10, 2009
7612444 Semiconductor package with flow controller Nov. 3, 2009
7612443 Inter-chip communication Nov. 3, 2009
7612439 Semiconductor package having improved thermal performance Nov. 3, 2009
7608924 Liquid cooled power electronic circuit comprising stacked direct die cooled packages Oct. 27, 2009
7608921 Multi-layer semiconductor package Oct. 27, 2009
7608920 Memory card and method for devising Oct. 27, 2009
7608919 Interconnect packaging systems Oct. 27, 2009
7606042 High capacity thin module system and method Oct. 20, 2009
7606040 Memory module system and method Oct. 20, 2009
7605466 Sealed wafer packaging of microelectromechanical systems Oct. 20, 2009
7605459 Coreless substrate and manufacturing thereof Oct. 20, 2009
7605454 Memory card and method for devising Oct. 20, 2009
7605452 Semiconductor light-emitting device, semiconductor light-emitting module, and method of manufacturing the semiconductor light-emitting module Oct. 20, 2009
7601563 Small form factor molded memory card and a method thereof Oct. 13, 2009
7598617 Stack package utilizing through vias and re-distribution lines Oct. 6, 2009
7598606 Integrated circuit package system with die and package combination Oct. 6, 2009
7598123 Semiconductor component and method of manufacture Oct. 6, 2009
7596850 Method for temporarily inactivating a wireless communication device Oct. 6, 2009
7595550 Flex-based circuit module Sep. 29, 2009
7592704 Etched interposer for integrated circuit devices Sep. 22, 2009
7592702 Via heat sink material Sep. 22, 2009
7592696 Power module having at least two substrates Sep. 22, 2009
7592689 Semiconductor module comprising semiconductor chips and method for producing the same Sep. 22, 2009
7589400 Inverter and vehicle drive unit using the same Sep. 15, 2009
7586179 Wireless semiconductor package for efficient heat dissipation Sep. 8, 2009
7583511 Semiconductor die package with internal bypass capacitors Sep. 1, 2009
7582963 Vertically integrated system-in-a-package Sep. 1, 2009
7579691 Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication Aug. 25, 2009
7579690 Semiconductor package structure Aug. 25, 2009
7579689 Integrated circuit package, and a method for producing an integrated circuit package having two dies with input and output terminals of integrated circuits of the dies directly addressable for Aug. 25, 2009
7579681 Super high density module with integrated wafer level packages Aug. 25, 2009
7579260 Method of dividing an adhesive film bonded to a wafer Aug. 25, 2009
7579214 Semiconductor device and a method of manufacturing the same Aug. 25, 2009
7576440 Semiconductor chip having bond pads and multi-chip package Aug. 18, 2009
7576433 Semiconductor memory device and manufacturing method thereof Aug. 18, 2009
7576432 Using external radiators with electroosmotic pumps for cooling integrated circuits Aug. 18, 2009
7576431 Semiconductor chip package and multichip package Aug. 18, 2009
7573136 Semiconductor device assemblies and packages including multiple semiconductor device components Aug. 11, 2009
7573135 Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film Aug. 11, 2009
7573107 Power module Aug. 11, 2009
7572671 Stacked module systems and methods Aug. 11, 2009



 
 
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