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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Physics
Class Information
Number: 257/723
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > For plural devices
Description: Subject matter wherein a package or housing is provided for more than one electronic device, at least one of the electronic devices being an active solid-state device.


Sub-classes under this class:

Class Number Class Name Patents
257/724 With discrete components 1,182
257/725 With electrical isolation means 267


Patents under this class:

Patent Number Title Of Patent Date Issued
7459777 Semiconductor package containing multi-layered semiconductor chips Dec. 2, 2008
7459776 Stacked die assembly having semiconductor die projecting beyond support Dec. 2, 2008
7459765 Semiconductor apparatus with decoupling capacitor Dec. 2, 2008
7453159 Semiconductor chip having bond pads Nov. 18, 2008
7453147 Semiconductor device, its manufacturing method, and radio communication device Nov. 18, 2008
7453146 High power MCM package with improved planarity and heat dissipation Nov. 18, 2008
7449778 Power semiconductor module as H-bridge circuit and method for producing the same Nov. 11, 2008
7449777 Circuit arrangement comprising a power component and a drive circuit integrated in two semiconductor bodies Nov. 11, 2008
7449774 Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same Nov. 11, 2008
7449726 Power semiconductor apparatus Nov. 11, 2008
7447038 Module Nov. 4, 2008
7446420 Through silicon via chip stack package capable of facilitating chip selection during device operation Nov. 4, 2008
7446413 Circuit apparatus and method for operating the same Nov. 4, 2008
7446404 Three-dimensional package and method of making the same Nov. 4, 2008
7446389 Semiconductor die package with internal bypass capacitors Nov. 4, 2008
7446383 Electronic device mountable onto a substrate using surface mount techniques, and method Nov. 4, 2008
7443681 Heat dissipator for display apparatus and plasma display apparatus including the heat dissipator Oct. 28, 2008
7443042 Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit Oct. 28, 2008
7443037 Stacked integrated circuit package system with connection protection Oct. 28, 2008
7443011 System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices Oct. 28, 2008
7439620 Integrated circuit package-in-package system Oct. 21, 2008
7439619 Electronic package structure and the packaging process thereof Oct. 21, 2008
7439615 Semiconductor component comprising an integrated semiconductor chip and a chip housing, and electronic device Oct. 21, 2008
7432593 Semiconductor package assembly and method for electrically isolating modules Oct. 7, 2008
7429794 Multi-chip packaged integrated circuit device for transmitting signals from one chip to another chip Sep. 30, 2008
7429793 Semiconductor device having an electronic circuit disposed therein Sep. 30, 2008
7429783 Image sensor package Sep. 30, 2008
7429781 Memory package Sep. 30, 2008
7427810 Semiconductor device including semiconductor element mounted on another semiconductor element Sep. 23, 2008
7425763 Electronic circuit package Sep. 16, 2008
7425758 Metal core foldover package structures Sep. 16, 2008
7423339 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice Sep. 9, 2008
7423335 Sensor module package structure and method of the same Sep. 9, 2008
7420814 Package stack and manufacturing method thereof Sep. 2, 2008
7420281 Stacked chip semiconductor device Sep. 2, 2008
7420269 Stacked integrated circuit package-in-package system Sep. 2, 2008
7417198 Radiofrequency power semiconductor module with cavity housing, and method for producing it Aug. 26, 2008
7413929 Integrated chip package structure using organic substrate and method of manufacturing the same Aug. 19, 2008
7411291 Component with sensitive component structures and method for the production thereof Aug. 12, 2008
7411287 Staggered wirebonding configuration Aug. 12, 2008
7411282 LSI package provided with interface module, and transmission line header employed in the package Aug. 12, 2008
7409200 Module integration integrated circuits Aug. 5, 2008
7405486 Circuit device Jul. 29, 2008
7405475 Method and system of tape automated bonding Jul. 29, 2008
7402896 Integrated circuit (IC) carrier assembly incorporating serpentine suspension Jul. 22, 2008
7402442 Physically highly secure multi-chip assembly Jul. 22, 2008
7400047 Integrated circuit with stacked-die configuration utilizing substrate conduction Jul. 15, 2008
7400037 Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP Jul. 15, 2008
7400032 Module assembly for stacked BGA packages Jul. 15, 2008
7397132 Semiconductor device Jul. 8, 2008



 
 
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