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Class Information
Number: 257/722
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > With gas coolant > With fins
Description: Subject matter wherein the cooling means has fins, i.e., long, thin, blade like structures used to dissipate heat to the gas coolant.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7457491 |
System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards |
Nov. 25, 2008 |
| 7446412 |
Heat sink design using clad metal |
Nov. 4, 2008 |
| 7444041 |
System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards |
Oct. 28, 2008 |
| 7423877 |
Heat dissipation device |
Sep. 9, 2008 |
| 7411290 |
Integrated circuit chip and method for cooling an integrated circuit chip |
Aug. 12, 2008 |
| 7391612 |
Dual impeller push-pull axial fan sink |
Jun. 24, 2008 |
| 7385815 |
Dual impeller push-pull axial fan |
Jun. 10, 2008 |
| 7385816 |
Dual impeller push-pull axial fan heat sink |
Jun. 10, 2008 |
| 7382047 |
Heat dissipation device |
Jun. 3, 2008 |
| 7359195 |
Heatsink |
Apr. 15, 2008 |
| 7359196 |
Dual impeller push-pull axial fan heat sink |
Apr. 15, 2008 |
| 7355856 |
Method and apparatus for increasing natural convection efficiency in long heat sinks |
Apr. 8, 2008 |
| 7342306 |
High performance reworkable heatsink and packaging structure with solder release layer |
Mar. 11, 2008 |
| 7342785 |
Cooling device incorporating boiling chamber |
Mar. 11, 2008 |
| 7330352 |
Interface module-mounted LSI package |
Feb. 12, 2008 |
| 7323776 |
Elevated heat dissipating device |
Jan. 29, 2008 |
| 7324339 |
Dual impeller push-pull axial fan heat sink |
Jan. 29, 2008 |
| 7311140 |
Heat sink assembly with overmolded carbon matrix |
Dec. 25, 2007 |
| 7310226 |
Modularized redundant heat sink for dissipating heat generated from chips |
Dec. 18, 2007 |
| 7304851 |
Heat sink and its fabrication method |
Dec. 4, 2007 |
| 7304376 |
Microelectronic assemblies with springs |
Dec. 4, 2007 |
| 7301769 |
Fan holder |
Nov. 27, 2007 |
| 7289322 |
Heat sink |
Oct. 30, 2007 |
| 7288805 |
Double gate isolation |
Oct. 30, 2007 |
| 7286361 |
Heatsink |
Oct. 23, 2007 |
| 7271034 |
Semiconductor device with a high thermal dissipation efficiency |
Sep. 18, 2007 |
| 7269013 |
Heat dissipation device having phase-changeable medium therein |
Sep. 11, 2007 |
| 7256491 |
Thermal interconnect systems methods of production and uses thereof |
Aug. 14, 2007 |
| 7252167 |
Electrical apparatus, cooling system therefor, and electric vehicle |
Aug. 7, 2007 |
| 7251136 |
Heat dissipation device having a ventilating duct |
Jul. 31, 2007 |
| 7251134 |
Extended fin array |
Jul. 31, 2007 |
| 7245492 |
Heat-dissipating module and structure thereof |
Jul. 17, 2007 |
| 7235889 |
Integrated heatspreader for use in wire bonded ball grid array semiconductor packages |
Jun. 26, 2007 |
| 7236368 |
Integral molded heat sinks on DC-DC converters and power supplies |
Jun. 26, 2007 |
| 7233065 |
Semiconductor device having capacitors for reducing power source noise |
Jun. 19, 2007 |
| 7230287 |
Chevron CMOS trigate structure |
Jun. 12, 2007 |
| 7227752 |
Heat dissipation device |
Jun. 5, 2007 |
| 7224057 |
Thermal enhance package with universal heat spreader |
May. 29, 2007 |
| 7221567 |
Heat sink fan |
May. 22, 2007 |
| 7221566 |
System for cooling a processor while reducing air flow noise |
May. 22, 2007 |
| 7218522 |
Heat dissipating device |
May. 15, 2007 |
| 7211891 |
Electronic heat pump device, laser component, optical pickup and electronic equipment |
May. 1, 2007 |
| 7196904 |
IC package with an implanted heat-dissipation fin |
Mar. 27, 2007 |
| 7180740 |
Method and apparatus for side-type heat dissipation |
Feb. 20, 2007 |
| 7172017 |
Heat sink |
Feb. 6, 2007 |
| 7164582 |
Cooling system with submerged fan |
Jan. 16, 2007 |
| 7161804 |
Housing structure of electronic device and heat radiation method therefor |
Jan. 9, 2007 |
| 7154751 |
Interface module-mounted LSI package |
Dec. 26, 2006 |
| 7149083 |
Heat dissipation structure |
Dec. 12, 2006 |
| 7145224 |
Semiconductor device |
Dec. 5, 2006 |
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