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Class Information
Number: 257/722
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > With gas coolant > With fins
Description: Subject matter wherein the cooling means has fins, i.e., long, thin, blade like structures used to dissipate heat to the gas coolant.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7623348 |
Heat sink and cooling apparatus |
Nov. 24, 2009 |
| 7612386 |
High power light emitting diode device |
Nov. 3, 2009 |
| 7613004 |
Heat sink with heat dissipating fins and method of manufacturing heat sink |
Nov. 3, 2009 |
| 7609522 |
Heat sink assembly |
Oct. 27, 2009 |
| 7606028 |
Heat dissipation device having a fan holder for attachment of a fan |
Oct. 20, 2009 |
| 7592695 |
Compound heat sink |
Sep. 22, 2009 |
| 7589967 |
Heat dissipation device |
Sep. 15, 2009 |
| 7588074 |
In the rate of energy transfer across boundaries |
Sep. 15, 2009 |
| 7589417 |
Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same |
Sep. 15, 2009 |
| 7581583 |
Heat dissipating device with adjusting member |
Sep. 1, 2009 |
| 7583501 |
Electronic apparatus |
Sep. 1, 2009 |
| 7572033 |
Light source module with high heat-dissipation efficiency |
Aug. 11, 2009 |
| 7564129 |
Power semiconductor module, and power semiconductor device having the module mounted therein |
Jul. 21, 2009 |
| 7554808 |
Heat sink with thermoelectric module |
Jun. 30, 2009 |
| 7554806 |
Interface module-mounted LSI package |
Jun. 30, 2009 |
| 7550841 |
Methods of forming a diamond micro-channel structure and resulting devices |
Jun. 23, 2009 |
| 7547966 |
Power semiconductor module |
Jun. 16, 2009 |
| 7545647 |
Compliant thermal interface structure utilizing spring elements |
Jun. 9, 2009 |
| 7529448 |
System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards |
May. 5, 2009 |
| 7518233 |
Sealing structure for multi-chip module |
Apr. 14, 2009 |
| 7513298 |
Cooling element for eliminating electromagnetic noise |
Apr. 7, 2009 |
| 7504670 |
Sealing structure for mounting a semiconductor device to a substrate |
Mar. 17, 2009 |
| 7492599 |
Heat sink for LED lamp |
Feb. 17, 2009 |
| 7471514 |
Auxiliary cooling device for memory chips |
Dec. 30, 2008 |
| 7468555 |
Heat dissipation structure of an electronic device |
Dec. 23, 2008 |
| 7461690 |
Optimally shaped spreader plate for electronics cooling assembly |
Dec. 9, 2008 |
| 7463484 |
Heatsink apparatus |
Dec. 9, 2008 |
| 7457491 |
System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards |
Nov. 25, 2008 |
| 7446412 |
Heat sink design using clad metal |
Nov. 4, 2008 |
| 7444041 |
System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards |
Oct. 28, 2008 |
| 7423877 |
Heat dissipation device |
Sep. 9, 2008 |
| 7411290 |
Integrated circuit chip and method for cooling an integrated circuit chip |
Aug. 12, 2008 |
| 7391612 |
Dual impeller push-pull axial fan sink |
Jun. 24, 2008 |
| 7385816 |
Dual impeller push-pull axial fan heat sink |
Jun. 10, 2008 |
| 7385815 |
Dual impeller push-pull axial fan |
Jun. 10, 2008 |
| 7382047 |
Heat dissipation device |
Jun. 3, 2008 |
| 7359195 |
Heatsink |
Apr. 15, 2008 |
| 7359196 |
Dual impeller push-pull axial fan heat sink |
Apr. 15, 2008 |
| 7355856 |
Method and apparatus for increasing natural convection efficiency in long heat sinks |
Apr. 8, 2008 |
| 7342785 |
Cooling device incorporating boiling chamber |
Mar. 11, 2008 |
| 7342306 |
High performance reworkable heatsink and packaging structure with solder release layer |
Mar. 11, 2008 |
| 7330352 |
Interface module-mounted LSI package |
Feb. 12, 2008 |
| 7323776 |
Elevated heat dissipating device |
Jan. 29, 2008 |
| 7324339 |
Dual impeller push-pull axial fan heat sink |
Jan. 29, 2008 |
| 7311140 |
Heat sink assembly with overmolded carbon matrix |
Dec. 25, 2007 |
| 7310226 |
Modularized redundant heat sink for dissipating heat generated from chips |
Dec. 18, 2007 |
| 7304376 |
Microelectronic assemblies with springs |
Dec. 4, 2007 |
| 7304851 |
Heat sink and its fabrication method |
Dec. 4, 2007 |
| 7301769 |
Fan holder |
Nov. 27, 2007 |
| 7289322 |
Heat sink |
Oct. 30, 2007 |
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