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Class Information
Number: 257/721
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > With gas coolant
Description: Subject matter wherein the cooling means uses a gas to provide the cooling (e.g., by convection).
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7613004 |
Heat sink with heat dissipating fins and method of manufacturing heat sink |
Nov. 3, 2009 |
| 7599414 |
Laser device |
Oct. 6, 2009 |
| 7583501 |
Electronic apparatus |
Sep. 1, 2009 |
| 7560813 |
Chip-based thermo-stack |
Jul. 14, 2009 |
| 7554806 |
Interface module-mounted LSI package |
Jun. 30, 2009 |
| 7551437 |
Cooling mechanism for circuit board |
Jun. 23, 2009 |
| 7549790 |
Measuring apparatus for thermal resistance of heat dissipating device |
Jun. 23, 2009 |
| 7508068 |
Semiconductor module and power conversion device |
Mar. 24, 2009 |
| 7504670 |
Sealing structure for mounting a semiconductor device to a substrate |
Mar. 17, 2009 |
| 7492042 |
Integrated circuit cooling and insulating device and method |
Feb. 17, 2009 |
| 7489034 |
Integrated circuit cooling system and method |
Feb. 10, 2009 |
| 7477516 |
Air cooled computer chip |
Jan. 13, 2009 |
| 7471514 |
Auxiliary cooling device for memory chips |
Dec. 30, 2008 |
| 7468886 |
Method and structure to improve thermal dissipation from semiconductor devices |
Dec. 23, 2008 |
| 7432592 |
Integrated micro-channels for 3D through silicon architectures |
Oct. 7, 2008 |
| 7414847 |
Heat dissipation device |
Aug. 19, 2008 |
| 7359196 |
Dual impeller push-pull axial fan heat sink |
Apr. 15, 2008 |
| 7342306 |
High performance reworkable heatsink and packaging structure with solder release layer |
Mar. 11, 2008 |
| 7339787 |
Heat sink module for dissipating heat from a heat source on a motherboard |
Mar. 4, 2008 |
| 7330352 |
Interface module-mounted LSI package |
Feb. 12, 2008 |
| 7323776 |
Elevated heat dissipating device |
Jan. 29, 2008 |
| 7319590 |
Conductive heat transfer system and method for integrated circuits |
Jan. 15, 2008 |
| 7288840 |
Structure for cooling a surface |
Oct. 30, 2007 |
| 7289322 |
Heat sink |
Oct. 30, 2007 |
| 7280365 |
Multi-processor module with redundant power |
Oct. 9, 2007 |
| 7227257 |
Cooling micro-channels |
Jun. 5, 2007 |
| 7224057 |
Thermal enhance package with universal heat spreader |
May. 29, 2007 |
| 7221566 |
System for cooling a processor while reducing air flow noise |
May. 22, 2007 |
| 7211891 |
Electronic heat pump device, laser component, optical pickup and electronic equipment |
May. 1, 2007 |
| 7206202 |
Electronic apparatus with heat-dissipating structure |
Apr. 17, 2007 |
| 7205654 |
Programmed material consolidation methods for fabricating heat sinks |
Apr. 17, 2007 |
| 7202562 |
Integrated circuit cooling system and method |
Apr. 10, 2007 |
| 7196406 |
ESD protection apparatus for an electrical device |
Mar. 27, 2007 |
| 7154751 |
Interface module-mounted LSI package |
Dec. 26, 2006 |
| 7131487 |
Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers |
Nov. 7, 2006 |
| 7126819 |
Chassis air guide thermal cooling solution |
Oct. 24, 2006 |
| 7123484 |
Multi-layer and multi-direction fan device |
Oct. 17, 2006 |
| 7112883 |
Semiconductor device with temperature control mechanism |
Sep. 26, 2006 |
| 7105858 |
Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density |
Sep. 12, 2006 |
| 7102226 |
Device and method for package warp compensation in an integrated heat spreader |
Sep. 5, 2006 |
| 7091604 |
Three dimensional integrated circuits |
Aug. 15, 2006 |
| 7085134 |
Dual fan heat sink |
Aug. 1, 2006 |
| 7078803 |
Integrated circuit heat dissipation system |
Jul. 18, 2006 |
| 7068515 |
Multi-chip module with stacked redundant power |
Jun. 27, 2006 |
| 7064955 |
Redundant power for processor circuit board |
Jun. 20, 2006 |
| 7061760 |
Memory cooler |
Jun. 13, 2006 |
| 7030482 |
Method and apparatus for protecting a die ESD events |
Apr. 18, 2006 |
| 7028753 |
Apparatus to enhance cooling of electronic device |
Apr. 18, 2006 |
| 7005738 |
Semiconductor package with lid heat spreader |
Feb. 28, 2006 |
| 6979893 |
Packaged microelectromechanical device with lubricant |
Dec. 27, 2005 |
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