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Class Information
Number: 257/720
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > Heat dissipating element has high thermal conductivity insert (e.g., copper slug in aluminum heat sink)
Description: Subject matter wherein the heat dissipating element has a relatively high thermal conductivity vis-a-vis a larger (main) heat sink into which it is inserted (e.g., a copper slug in an aluminum heat sink).
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7456052 |
Thermal intermediate apparatus, systems, and methods |
Nov. 25, 2008 |
| 7446407 |
Chip package structure |
Nov. 4, 2008 |
| 7446408 |
Semiconductor package with heat sink |
Nov. 4, 2008 |
| 7446410 |
Circuit module with thermal casing systems |
Nov. 4, 2008 |
| 7446412 |
Heat sink design using clad metal |
Nov. 4, 2008 |
| 7443023 |
High capacity thin module system |
Oct. 28, 2008 |
| 7443683 |
Cooling apparatus for electronic devices |
Oct. 28, 2008 |
| 7439618 |
Integrated circuit thermal management method and apparatus |
Oct. 21, 2008 |
| 7436669 |
3D multi-layer heat conduction diffusion plate |
Oct. 14, 2008 |
| 7429502 |
Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sink |
Sep. 30, 2008 |
| 7427807 |
Chip heat dissipation structure and manufacturing method |
Sep. 23, 2008 |
| 7425762 |
Electronic apparatus |
Sep. 16, 2008 |
| 7416789 |
Refractory metal substrate with improved thermal conductivity |
Aug. 26, 2008 |
| 7405448 |
Semiconductor device having a resistance for equalizing the current distribution |
Jul. 29, 2008 |
| 7400035 |
Semiconductor device having multilayer printed wiring board |
Jul. 15, 2008 |
| 7400040 |
Thermal interface apparatus, systems, and methods |
Jul. 15, 2008 |
| 7397119 |
Wafer-level diamond spreader |
Jul. 8, 2008 |
| 7391067 |
Hybrid microwave integrated circuit |
Jun. 24, 2008 |
| 7381346 |
Thermal interface material |
Jun. 3, 2008 |
| 7378730 |
Thermal interconnect systems methods of production and uses thereof |
May. 27, 2008 |
| 7375424 |
Wirebonded device packages for semiconductor devices having elongated electrodes |
May. 20, 2008 |
| 7369411 |
Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink |
May. 6, 2008 |
| 7365422 |
Package of leadframe with heatsinks |
Apr. 29, 2008 |
| 7361944 |
Electrical device with a plurality of thin-film device layers |
Apr. 22, 2008 |
| 7358605 |
Heat dissipation structure for electronic device |
Apr. 15, 2008 |
| 7352062 |
Integrated circuit package design |
Apr. 1, 2008 |
| 7342306 |
High performance reworkable heatsink and packaging structure with solder release layer |
Mar. 11, 2008 |
| 7329948 |
Microelectronic devices and methods |
Feb. 12, 2008 |
| 7327018 |
Chip package structure, package substrate and manufacturing method thereof |
Feb. 5, 2008 |
| 7327029 |
Integrated circuit device incorporating metallurigical bond to enhance thermal conduction to a heat sink |
Feb. 5, 2008 |
| 7323776 |
Elevated heat dissipating device |
Jan. 29, 2008 |
| 7321161 |
LED package assembly with datum reference feature |
Jan. 22, 2008 |
| 7319553 |
Optical modulator module package structure |
Jan. 15, 2008 |
| 7316061 |
Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface |
Jan. 8, 2008 |
| 7311140 |
Heat sink assembly with overmolded carbon matrix |
Dec. 25, 2007 |
| 7312525 |
Thermally enhanced package for an integrated circuit |
Dec. 25, 2007 |
| 7312526 |
Semiconductor device and method of manufacturing thereof |
Dec. 25, 2007 |
| 7304372 |
Semiconductor package |
Dec. 4, 2007 |
| 7301232 |
Integrated circuit package with carbon nanotube array heat conductor |
Nov. 27, 2007 |
| 7298044 |
Electronic device with heat dissipation module |
Nov. 20, 2007 |
| 7291913 |
System and method for high performance heat sink for multiple chip devices |
Nov. 6, 2007 |
| 7288840 |
Structure for cooling a surface |
Oct. 30, 2007 |
| 7286359 |
Use of thermally conductive vias to extract heat from microelectronic chips and method of manufacturing |
Oct. 23, 2007 |
| 7279023 |
High thermal conductivity metal matrix composites |
Oct. 9, 2007 |
| 7279796 |
Microelectronic die having a thermoelectric module |
Oct. 9, 2007 |
| 7271034 |
Semiconductor device with a high thermal dissipation efficiency |
Sep. 18, 2007 |
| 7268429 |
Technique for manufacturing an overmolded electronic assembly |
Sep. 11, 2007 |
| 7268425 |
Thermally enhanced electronic flip-chip packaging with external-connector-side die and method |
Sep. 11, 2007 |
| 7265445 |
Integrated circuit package |
Sep. 4, 2007 |
| 7259448 |
Die-up ball grid array package with a heat spreader and method for making the same |
Aug. 21, 2007 |
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