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Class Information
Number: 257/720
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > Heat dissipating element has high thermal conductivity insert (e.g., copper slug in aluminum heat sink)
Description: Subject matter wherein the heat dissipating element has a relatively high thermal conductivity vis-a-vis a larger (main) heat sink into which it is inserted (e.g., a copper slug in an aluminum heat sink).
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615862 |
Heat dissipating package structure and method for fabricating the same |
Nov. 10, 2009 |
| 7612446 |
Structures to enhance cooling of computer memory modules |
Nov. 3, 2009 |
| 7612448 |
Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner |
Nov. 3, 2009 |
| 7608923 |
Electronic device with flexible heat spreader |
Oct. 27, 2009 |
| 7608924 |
Liquid cooled power electronic circuit comprising stacked direct die cooled packages |
Oct. 27, 2009 |
| 7602060 |
Heat spreader in a flip chip package |
Oct. 13, 2009 |
| 7595540 |
Semiconductor device and method of manufacturing the same |
Sep. 29, 2009 |
| 7589401 |
Lightweight, hermetically sealed package having auxiliary, selectively contoured, low mass, pseudo wall insert for surface-mounting and dissipating heat from electronic circuit components |
Sep. 15, 2009 |
| 7586191 |
Integrated circuit apparatus with heat spreader |
Sep. 8, 2009 |
| 7582959 |
Driver module structure with flexible circuit board |
Sep. 1, 2009 |
| 7579686 |
Thermal interface material with hotspot heat remover |
Aug. 25, 2009 |
| 7579687 |
Circuit module turbulence enhancement systems and methods |
Aug. 25, 2009 |
| 7573131 |
Die-up integrated circuit package with grounded stiffener |
Aug. 11, 2009 |
| 7564124 |
Semiconductor die package including stacked dice and heat sink structures |
Jul. 21, 2009 |
| 7564129 |
Power semiconductor module, and power semiconductor device having the module mounted therein |
Jul. 21, 2009 |
| 7557442 |
Power semiconductor arrangement |
Jul. 7, 2009 |
| 7557438 |
Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same |
Jul. 7, 2009 |
| 7554179 |
Multi-leadframe semiconductor package and method of manufacture |
Jun. 30, 2009 |
| 7554808 |
Heat sink with thermoelectric module |
Jun. 30, 2009 |
| 7547966 |
Power semiconductor module |
Jun. 16, 2009 |
| 7538422 |
Integrated circuit micro-cooler having multi-layers of tubes of a CNT array |
May. 26, 2009 |
| 7528413 |
Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it |
May. 5, 2009 |
| 7528483 |
Cooling system for a semiconductor device and method of fabricating same |
May. 5, 2009 |
| 7521794 |
Intrinsic thermal enhancement for FBGA package |
Apr. 21, 2009 |
| 7521791 |
Method and apparatus for dissipating heat from an integrated circuit |
Apr. 21, 2009 |
| 7521789 |
Electrical assembly having heat sink protrusions |
Apr. 21, 2009 |
| 7518233 |
Sealing structure for multi-chip module |
Apr. 14, 2009 |
| 7514782 |
Semiconductor device |
Apr. 7, 2009 |
| 7508066 |
Heat dissipating semiconductor package and fabrication method thereof |
Mar. 24, 2009 |
| 7504670 |
Sealing structure for mounting a semiconductor device to a substrate |
Mar. 17, 2009 |
| 7505109 |
Heat dissipation structure of backlight module |
Mar. 17, 2009 |
| 7502398 |
Thermally tuned diode-laser bar package |
Mar. 10, 2009 |
| 7479695 |
Low thermal resistance assembly for flip chip applications |
Jan. 20, 2009 |
| 7476967 |
Composite carbon nanotube thermal interface device |
Jan. 13, 2009 |
| 7464462 |
Method of forming anisotropic heat spreading apparatus for semiconductor devices |
Dec. 16, 2008 |
| 7456052 |
Thermal intermediate apparatus, systems, and methods |
Nov. 25, 2008 |
| 7446412 |
Heat sink design using clad metal |
Nov. 4, 2008 |
| 7446410 |
Circuit module with thermal casing systems |
Nov. 4, 2008 |
| 7446408 |
Semiconductor package with heat sink |
Nov. 4, 2008 |
| 7446407 |
Chip package structure |
Nov. 4, 2008 |
| 7443023 |
High capacity thin module system |
Oct. 28, 2008 |
| 7443683 |
Cooling apparatus for electronic devices |
Oct. 28, 2008 |
| 7439618 |
Integrated circuit thermal management method and apparatus |
Oct. 21, 2008 |
| 7436669 |
3D multi-layer heat conduction diffusion plate |
Oct. 14, 2008 |
| 7429502 |
Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sink |
Sep. 30, 2008 |
| 7427807 |
Chip heat dissipation structure and manufacturing method |
Sep. 23, 2008 |
| 7425762 |
Electronic apparatus |
Sep. 16, 2008 |
| 7416789 |
Refractory metal substrate with improved thermal conductivity |
Aug. 26, 2008 |
| 7405448 |
Semiconductor device having a resistance for equalizing the current distribution |
Jul. 29, 2008 |
| 7400040 |
Thermal interface apparatus, systems, and methods |
Jul. 15, 2008 |
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