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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Physics
Class Information
Number: 257/720
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > Heat dissipating element has high thermal conductivity insert (e.g., copper slug in aluminum heat sink)
Description: Subject matter wherein the heat dissipating element has a relatively high thermal conductivity vis-a-vis a larger (main) heat sink into which it is inserted (e.g., a copper slug in an aluminum heat sink).










Patents under this class:
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Patent Number Title Of Patent Date Issued
8710644 Semiconductor unit having a power semiconductor and semiconductor apparatus using the same Apr. 29, 2014
8704346 Semiconductor package and radiation lead frame Apr. 22, 2014
8680673 Integrated heat pillar for hot region cooling in an integrated circuit Mar. 25, 2014
8681500 Integrated circuit nanotube-based subsrate Mar. 25, 2014
8674509 Integrated circuit die assembly with heat spreader Mar. 18, 2014
8674499 Heat radiation component and semiconductor package including same Mar. 18, 2014
8673691 Method for manufacturing a semiconductor device Mar. 18, 2014
8659146 Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing Feb. 25, 2014
8643171 Power semiconductor device Feb. 4, 2014
8633060 Semiconductor device production method and semiconductor device Jan. 21, 2014
8633597 Thermal vias in an integrated circuit package with an embedded die Jan. 21, 2014
8623707 Method of fabricating a semiconductor package with integrated substrate thermal slug Jan. 7, 2014
8624388 Package carrier and manufacturing method thereof Jan. 7, 2014
8618585 Semiconductor apparatus including cooling base with projections Dec. 31, 2013
8611091 Thermal module for solar inverter Dec. 17, 2013
8597986 System in package and method of fabricating same Dec. 3, 2013
8587115 Heat dissipation substrate and manufacturing method thereof Nov. 19, 2013
8587110 Semiconductor module having a semiconductor chip stack and method Nov. 19, 2013
8587016 Light emitting device package having light emitting device on inclined side surface and lighting system including the same Nov. 19, 2013
8581393 Thermally conductive LED assembly Nov. 12, 2013
8564956 Apparatus and methods for thermal management of light emitting diodes Oct. 22, 2013
8564120 Heat dissipation in temperature critical device areas of semiconductor devices by heat pipes connecting to the substrate backside Oct. 22, 2013
8564112 Semiconductor device Oct. 22, 2013
8545987 Thermal interface material with thin transfer film or metallization Oct. 1, 2013
8546924 Package structures for integrating thermoelectric components with stacking chips Oct. 1, 2013
8531014 Method and system for minimizing carrier stress of a semiconductor device Sep. 10, 2013
8531026 Diamond particle mololayer heat spreaders and associated methods Sep. 10, 2013
8525317 Integrated chip package having intermediate substrate with capacitor Sep. 3, 2013
8518749 Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die Aug. 27, 2013
8519409 Light emitting diode components integrated with thermoelectric devices Aug. 27, 2013
8519506 Thermally conductive substrate for galvanic isolation Aug. 27, 2013
8508040 In-situ foam materials as integrated heat spreader (IHS) sealant Aug. 13, 2013
8507940 Heat dissipation by through silicon plugs Aug. 13, 2013
8505613 Die having a via filled with a heat-dissipating material Aug. 13, 2013
8492911 Stacked interconnect heat sink Jul. 23, 2013
8488312 Systems and methods for thermal management for telecommunications enclosures using heat pipes Jul. 16, 2013
8476756 Semiconductor device and heat sink with 3-dimensional thermal conductivity Jul. 2, 2013
8477502 Electronic module Jul. 2, 2013
8466486 Thermal management system for multiple heat source devices Jun. 18, 2013
8450853 Semiconductor device and a method of manufacturing the same, and an electronic device May. 28, 2013
8450845 Semiconductor device May. 28, 2013
8450837 Circuit device having an improved heat dissipitation, and the method of manufacturing the same May. 28, 2013
8421219 Semiconductor component having adhesive squeeze-out prevention configuration and method of manufacturing the same Apr. 16, 2013
8421235 Semiconductor device with heat spreaders Apr. 16, 2013
8415788 System and method for dissipating heat from semiconductor devices Apr. 9, 2013
8410608 Interconnect structure device Apr. 2, 2013
8404960 Method for heat dissipation on semiconductor device Mar. 26, 2013
8405214 Semiconductor package structure with common gold plated metal conductor on die and substrate Mar. 26, 2013
8394675 Manufacturing light emitting diode (LED) packages Mar. 12, 2013
8385070 Portable electronic device Feb. 26, 2013

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