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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Physics
Class Information
Number: 257/719
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > Heat dissipating element held in place by clamping or spring means > Pressed against semiconductor element
Description: Subject matter wherein the heat dissipating element and the active device are in press contact with each other.


Patents under this class:

Patent Number Title Of Patent Date Issued
7619893 Heat spreader for electronic modules Nov. 17, 2009
7616444 Gimballed attachment for multiple heat exchangers Nov. 10, 2009
7613005 Mounting device for mounting heat sink onto electronic component Nov. 3, 2009
7612992 Cooling device for memory chips Nov. 3, 2009
7612446 Structures to enhance cooling of computer memory modules Nov. 3, 2009
7609522 Heat sink assembly Oct. 27, 2009
7606036 Heat dissipation device Oct. 20, 2009
7606033 Mounting a heat sink in thermal contact with an electronic component Oct. 20, 2009
7606031 Heat dissipating device Oct. 20, 2009
7606030 Heat dissipation device Oct. 20, 2009
7595993 Mounting structure with heat sink for electronic component and female securing member for same Sep. 29, 2009
7593228 Technique for forming a thermally conductive interface with patterned metal foil Sep. 22, 2009
7592698 Power semiconductor modules having a cooling component and method for producing them Sep. 22, 2009
7592688 Semiconductor package Sep. 22, 2009
7589972 Electrical connector with clip mechanism Sep. 15, 2009
7589967 Heat dissipation device Sep. 15, 2009
7589418 Pressure contact power semiconductor module Sep. 15, 2009
7583505 Processor apparatus Sep. 1, 2009
7583504 Cooling assembly Sep. 1, 2009
7580265 Heat sink, circuit board, and electronic apparatus Aug. 25, 2009
7576989 Heat sink assembly having supporting clip Aug. 18, 2009
7576987 Clip for heat dissipation device Aug. 18, 2009
7569928 Assembly structure of electronic element and heat sink Aug. 4, 2009
7564689 Clip for heat sink Jul. 21, 2009
7564687 Heat dissipation device having a fixing base Jul. 21, 2009
7564129 Power semiconductor module, and power semiconductor device having the module mounted therein Jul. 21, 2009
7558067 Retaining tool for a heat sink Jul. 7, 2009
7558066 System and method for cooling a module Jul. 7, 2009
7557442 Power semiconductor arrangement Jul. 7, 2009
7554810 Mounting apparatus for securing heat dissipation module to circuit board Jun. 30, 2009
7554809 Heatsink assembly structure Jun. 30, 2009
7551438 Information processing blade and information processing apparatus using the same Jun. 23, 2009
7549790 Measuring apparatus for thermal resistance of heat dissipating device Jun. 23, 2009
7529090 Heat dissipation device May. 5, 2009
7525187 Apparatus and method for connecting components Apr. 28, 2009
7522421 Split core circuit module Apr. 21, 2009
7522420 Clip module and heat-dissipation device having the same Apr. 21, 2009
7518875 Securing heat sinks to a device under test Apr. 14, 2009
7518235 Method and structure to provide balanced mechanical loading of devices in compressively loaded environments Apr. 14, 2009
7518233 Sealing structure for multi-chip module Apr. 14, 2009
7515426 Heat dissipating device for an integrated circuit chip Apr. 7, 2009
7511362 Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument Mar. 31, 2009
7508674 Fixture for attaching a heat sink to a heat generating device Mar. 24, 2009
7508667 Heat sink backplate module, circuit board, and electronic apparatus having the same Mar. 24, 2009
7508067 Semiconductor insulation structure Mar. 24, 2009
7505274 Heat sink fastening device and assembling process thereof Mar. 17, 2009
7505271 Heat sink mount Mar. 17, 2009
7504670 Sealing structure for mounting a semiconductor device to a substrate Mar. 17, 2009
7499280 Heat dissipating device Mar. 3, 2009
7498673 Heatplates for heatsink attachment for semiconductor chips Mar. 3, 2009



 
 
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