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Class Information
Number: 257/718
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > Heat dissipating element held in place by clamping or spring means
Description: Subject matter wherein an element for dissipating heat is held in place by means to clamp it to the device or vice versa, or by a spring to position the device and heat dissipating element in thermal contact with each other.










Sub-classes under this class:

Class Number Class Name Patents
257/719 Pressed against semiconductor element 1,231


Patents under this class:

Patent Number Title Of Patent Date Issued
8704363 Interface plate between integrated circuits Apr. 22, 2014
8684572 LED connector assembly Apr. 1, 2014
8681497 Board coolant jacket jig system and method of separating board coolant jacket Mar. 25, 2014
8679900 Integrated circuit packaging system with heat conduction and method of manufacture thereof Mar. 25, 2014
8674509 Integrated circuit die assembly with heat spreader Mar. 18, 2014
8659130 Power module and power module manufacturing method Feb. 25, 2014
8653651 Semiconductor apparatus and method for manufacturing the same Feb. 18, 2014
8648461 Semiconductor device Feb. 11, 2014
8643170 Method of assembling semiconductor device including insulating substrate and heat sink Feb. 4, 2014
8637981 Dual compartment semiconductor package with temperature sensor Jan. 28, 2014
8634195 Heatsink with substance embedded to suppress electromagnetic interference Jan. 21, 2014
8629555 Fixture for semiconductor device and assembly of semiconductor device Jan. 14, 2014
8593825 Apparatus and method for vertically-structured passive components Nov. 26, 2013
8593821 Lightweight audio system for automotive applications and method Nov. 26, 2013
8581393 Thermally conductive LED assembly Nov. 12, 2013
8564955 Coupling heat sink to integrated circuit chip with thermal interface material Oct. 22, 2013
8514579 Power semiconductor module including substrates spaced from each other Aug. 20, 2013
8514576 Dual sided system in a package Aug. 20, 2013
8498118 Mounting assembly for heat dissipating device Jul. 30, 2013
8497581 Semiconductor device and manufacturing method thereof Jul. 30, 2013
8492911 Stacked interconnect heat sink Jul. 23, 2013
8482923 Heat sink clip with wire clip Jul. 9, 2013
8422233 Motherboard system having heat dissipating device Apr. 16, 2013
8421235 Semiconductor device with heat spreaders Apr. 16, 2013
8421221 Integrated circuit heat spreader stacking system Apr. 16, 2013
8410602 Cooling system for semiconductor devices Apr. 2, 2013
8399296 Airgap micro-spring interconnect with bonded underfill seal Mar. 19, 2013
8390999 Cooling a computing device Mar. 5, 2013
8390113 Thermoelectric conversion module Mar. 5, 2013
8368207 Pressure-contact power semiconductor module and method for producing the same Feb. 5, 2013
8338944 Semiconductor device, semiconductor module, radiating fin and fitting portions Dec. 25, 2012
8319336 Reduction of etch microloading for through silicon vias Nov. 27, 2012
8299601 Power semiconductor module and manufacturing method thereof Oct. 30, 2012
8283777 Compressive ring structure for flip chip packaging Oct. 9, 2012
8283769 Modular low stress package technology Oct. 9, 2012
8279608 Heatsink device directly contacting a heat source to achieve a quick dissipation effect Oct. 2, 2012
8276655 Heat conducting apparatus Oct. 2, 2012
8269248 Light emitting assemblies and portions thereof Sep. 18, 2012
8213180 Electromagnetic interference shield with integrated heat sink Jul. 3, 2012
8193553 Semiconductor high-power light-emitting module with heat isolation Jun. 5, 2012
8193043 High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same Jun. 5, 2012
8189324 Power electronic assembly with slotted heatsink May. 29, 2012
8188587 Semiconductor die package including lead with end portion May. 29, 2012
8184439 Semiconductor module May. 22, 2012
8183574 Thermal isolation of electronic devices in submount used for LEDs lighting applications May. 22, 2012
8174112 Integrated circuit device with low capacitance and high thermal conductivity interface May. 8, 2012
8164904 Electronic component module Apr. 24, 2012
8154119 Compliant spring interposer for wafer level three dimensional (3D) integration and method of manufacturing Apr. 10, 2012
8149574 Cooling fan housing assembly Apr. 3, 2012
8139360 Multi-specification fixing module and motherboard with multi-specification fixing module Mar. 20, 2012











 
 
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