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Class Information
Number: 257/717
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer)
Description: Subject matter wherein an insulating element is used to physically separate a cooling means from an active solid-state electronic device or a housing therefor.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5699609 |
Method of making power substrate assembly |
Dec. 23, 1997 |
| 5698899 |
Semiconductor device with first and second sealing resins |
Dec. 16, 1997 |
| 5698866 |
Uniform illuminator for phototherapy |
Dec. 16, 1997 |
| 5698897 |
Semiconductor device having a plated heat sink |
Dec. 16, 1997 |
| 5667870 |
Plastic article with interrupted interior threads for securing a threaded heat sink to a heat generating member |
Sep. 16, 1997 |
| 5666003 |
Packaged semiconductor device incorporating heat sink plate |
Sep. 9, 1997 |
| RE35573 |
Heat sink clip assembly |
Jul. 29, 1997 |
| 5650662 |
Direct bonded heat spreader |
Jul. 22, 1997 |
| 5648889 |
Attachment device for semiconductor circuit elements |
Jul. 15, 1997 |
| 5646445 |
Semiconductor device having electrodes embedded in an insulating case |
Jul. 8, 1997 |
| 5629561 |
Semiconductor package with integral heat dissipator |
May. 13, 1997 |
| 5629562 |
Conductive contact structure for two conductors |
May. 13, 1997 |
| 5623395 |
Integrated circuit package assembly |
Apr. 22, 1997 |
| 5621243 |
Semiconductor device having thermal stress resistance structure |
Apr. 15, 1997 |
| 5619070 |
Semiconductor device which radiates heat and applies substrate potential from rear surface of semiconductor chip |
Apr. 8, 1997 |
| 5616958 |
Electronic package |
Apr. 1, 1997 |
| 5606487 |
Electronic device for offsetting adverse effects of a plurality of chips which repetitively produce large pulses of heat |
Feb. 25, 1997 |
| 5596223 |
Semiconductor device and method of selecting the same |
Jan. 21, 1997 |
| 5592736 |
Fabricating an interconnect for testing unpackaged semiconductor dice having raised bond pads |
Jan. 14, 1997 |
| 5576578 |
High voltage insulating disk |
Nov. 19, 1996 |
| 5561324 |
Semiconductor chip mounting sector |
Oct. 1, 1996 |
| 5552637 |
Semiconductor device |
Sep. 3, 1996 |
| 5552636 |
Discrete transitor assembly |
Sep. 3, 1996 |
| 5539253 |
Resin-sealed semiconductor device |
Jul. 23, 1996 |
| 5530658 |
System and method for packing heat producing devices in an array to prevent local overheating |
Jun. 25, 1996 |
| 5525428 |
Substrate for semiconductor apparatus |
Jun. 11, 1996 |
| 5510649 |
Ceramic semiconductor package having varying conductive bonds |
Apr. 23, 1996 |
| 5508560 |
Semiconductor module |
Apr. 16, 1996 |
| 5495889 |
Cooling device for power electronic components |
Mar. 5, 1996 |
| 5495126 |
Polycrystalline diamond heat sink having major surfaces electrically insulated from each other |
Feb. 27, 1996 |
| 5488255 |
Cooling device for semiconductor packages, having flexible film heat expulsion means |
Jan. 30, 1996 |
| 5479029 |
Sub-mount type device for emitting light |
Dec. 26, 1995 |
| 5475263 |
Thick film hybrid multilayer circuit |
Dec. 12, 1995 |
| 5473192 |
Unitary silicon die module |
Dec. 5, 1995 |
| 5463251 |
Power semiconductor package having improved durability |
Oct. 31, 1995 |
| 5455457 |
Package for semiconductor elements having thermal dissipation means |
Oct. 3, 1995 |
| 5455453 |
Plastic package type semiconductor device having a rolled metal substrate |
Oct. 3, 1995 |
| 5440169 |
Resin-packaged semiconductor device with flow prevention dimples |
Aug. 8, 1995 |
| 5440172 |
Integral heat sink interface |
Aug. 8, 1995 |
| 5436793 |
Apparatus for containing and cooling an integrated circuit device having a thermally insulative positioning member |
Jul. 25, 1995 |
| 5436502 |
Semiconductor component and method for the manufacturing thereof |
Jul. 25, 1995 |
| 5402004 |
Heat transfer module for ultra high density and silicon on silicon packaging applications |
Mar. 28, 1995 |
| 5402006 |
Semiconductor device with enhanced adhesion between heat spreader and leads and plastic mold compound |
Mar. 28, 1995 |
| 5397919 |
Heat sink assembly for solid state devices |
Mar. 14, 1995 |
| 5384286 |
Process for encapsulating a semiconductor chip, leadframe and heatsink |
Jan. 24, 1995 |
| 5352926 |
Flip chip package and method of making |
Oct. 4, 1994 |
| 5345107 |
Cooling apparatus for electronic device |
Sep. 6, 1994 |
| 5343076 |
Semiconductor device with an airtight space formed internally within a hollow package |
Aug. 30, 1994 |
| 5334872 |
Encapsulated semiconductor device having a hanging heat spreading plate electrically insulated from the die pad |
Aug. 2, 1994 |
| 5317194 |
Resin-sealed semiconductor device having intermediate silicon thermal dissipation means and embedded heat sink |
May. 31, 1994 |
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