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Class Information
Number: 257/717
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer)
Description: Subject matter wherein an insulating element is used to physically separate a cooling means from an active solid-state electronic device or a housing therefor.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5880524 |
Heat pipe lid for electronic packages |
Mar. 9, 1999 |
| 5877553 |
Metallic electronic component packaging arrangement |
Mar. 2, 1999 |
| 5864176 |
Electro-mechnical subassembly having a greatly reduced thermal resistance between two mating faces by including a film of liquid, that evaporates without leaving any residue, between the faces |
Jan. 26, 1999 |
| 5852324 |
Plastic body surface-mounting semiconductor power device having dimensional characteristics optimized for use of standard shipping and testing modes |
Dec. 22, 1998 |
| 5844310 |
Heat spreader semiconductor device with heat spreader and method for producing same |
Dec. 1, 1998 |
| 5838543 |
Radio frequency power amplification module |
Nov. 17, 1998 |
| 5834840 |
Net-shape ceramic processing for electronic devices and packages |
Nov. 10, 1998 |
| 5835350 |
Encapsulated, board-mountable power supply and method of manufacture therefor |
Nov. 10, 1998 |
| 5831826 |
Heat transfer apparatus suitable for use in a circuit board assembly |
Nov. 3, 1998 |
| 5828551 |
Heat sink apparatus for an electronic component |
Oct. 27, 1998 |
| 5824404 |
Hybrid composite articles and missile components, and their fabrication |
Oct. 20, 1998 |
| 5825625 |
Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink |
Oct. 20, 1998 |
| 5821612 |
Heat radiative electronic component |
Oct. 13, 1998 |
| 5819402 |
Method for cooling of chips using blind holes with customized depth |
Oct. 13, 1998 |
| 5814883 |
Packaged semiconductor chip |
Sep. 29, 1998 |
| 5811877 |
Semiconductor device structure |
Sep. 22, 1998 |
| 5812374 |
Electrical circuit cooling device |
Sep. 22, 1998 |
| 5808868 |
Electronic module with power components |
Sep. 15, 1998 |
| 5808359 |
Semiconductor device having a heat sink with bumpers for protecting outer leads |
Sep. 15, 1998 |
| 5801923 |
Mounting multichip and single chip modules on printed wiring boards |
Sep. 1, 1998 |
| 5793106 |
Semiconductor device |
Aug. 11, 1998 |
| 5792677 |
Embedded metal planes for thermal management |
Aug. 11, 1998 |
| 5793107 |
Polysilicon pillar heat sinks for semiconductor on insulator circuits |
Aug. 11, 1998 |
| 5790381 |
Integrated circuit package assembly |
Aug. 4, 1998 |
| 5786634 |
Semiconductor device |
Jul. 28, 1998 |
| 5783466 |
Semiconductor device and method of manufacturing the same |
Jul. 21, 1998 |
| 5783854 |
Thermally isolated integrated circuit |
Jul. 21, 1998 |
| 5780927 |
Semiconductor device with long lifetime |
Jul. 14, 1998 |
| 5781412 |
Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer having a filler of controlled particle size |
Jul. 14, 1998 |
| 5773883 |
Semiconductor device and semiconductor module |
Jun. 30, 1998 |
| 5767573 |
Semiconductor device |
Jun. 16, 1998 |
| 5767578 |
Surface mount and flip chip technology with diamond film passivation for total integated circuit isolation |
Jun. 16, 1998 |
| 5767579 |
Semiconductor device having an electrical connection between a control electrode and a resistive layer |
Jun. 16, 1998 |
| 5760473 |
Semiconductor package having a eutectic bonding layer |
Jun. 2, 1998 |
| 5751059 |
Pyroelectric sensor |
May. 12, 1998 |
| 5751060 |
Electronic package |
May. 12, 1998 |
| 5747876 |
Semiconductor device and semiconductor module |
May. 5, 1998 |
| 5744863 |
Chip carrier modules with heat sinks attached by flexible-epoxy |
Apr. 28, 1998 |
| 5736786 |
Power module with silicon dice oriented for improved reliability |
Apr. 7, 1998 |
| 5731632 |
Semiconductor device having a plastic package |
Mar. 24, 1998 |
| 5726494 |
Semiconductor device having a plated heat sink |
Mar. 10, 1998 |
| 5726493 |
Semiconductor device and semiconductor device unit having ball-grid-array type package structure |
Mar. 10, 1998 |
| 5721455 |
Semiconductor device having a thermal resistance detector in the heat radiating path |
Feb. 24, 1998 |
| 5719444 |
Packaging and cooling system for power semi-conductor |
Feb. 17, 1998 |
| 5719433 |
Semiconductor component with integrated heat sink |
Feb. 17, 1998 |
| 5714794 |
Electrostatic protective device |
Feb. 3, 1998 |
| 5710459 |
Integrated circuit package provided with multiple heat-conducting paths for enhancing heat dissipation and wrapping around cap for improving integrity and reliability |
Jan. 20, 1998 |
| 5708959 |
Substrate for semiconductor apparatus |
Jan. 13, 1998 |
| 5706171 |
Flat plate cooling using a thermal paste retainer |
Jan. 6, 1998 |
| 5705850 |
Semiconductor module |
Jan. 6, 1998 |
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