| |
 |
|
Class Information
Number: 257/717
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer)
Description: Subject matter wherein an insulating element is used to physically separate a cooling means from an active solid-state electronic device or a housing therefor.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6157538 |
Heat dissipation apparatus and method |
Dec. 5, 2000 |
| 6147869 |
Adaptable planar module |
Nov. 14, 2000 |
| 6130477 |
Thin enhanced TAB BGA package having improved heat dissipation |
Oct. 10, 2000 |
| 6125039 |
Hybrid module |
Sep. 26, 2000 |
| 6111316 |
Electronic component encapsulated in a glass tube |
Aug. 29, 2000 |
| 6111750 |
Electronic apparatus |
Aug. 29, 2000 |
| 6093960 |
Semiconductor package having a heat spreader capable of preventing being soldered and enhancing adhesion and electrical performance |
Jul. 25, 2000 |
| 6087682 |
High power semiconductor module device |
Jul. 11, 2000 |
| 6088226 |
Multiple-component clamp and related method for attaching multiple heat-generating components to a heatsink |
Jul. 11, 2000 |
| 6084775 |
Heatsink and package structures with fusible release layer |
Jul. 4, 2000 |
| 6078501 |
Power semiconductor module |
Jun. 20, 2000 |
| 6075287 |
Integrated, multi-chip, thermally conductive packaging device and methodology |
Jun. 13, 2000 |
| 6064115 |
Semiconductor device provided with a heat sink |
May. 16, 2000 |
| 6061237 |
Computer with an improved cooling system and a method for cooling a computer |
May. 9, 2000 |
| 6057223 |
Passivated copper conductive layers for microelectronic applications |
May. 2, 2000 |
| 6046907 |
Heat conductor |
Apr. 4, 2000 |
| 6046906 |
Vent chimney heat sink design for an electrical assembly |
Apr. 4, 2000 |
| 6037659 |
Composite thermal interface pad |
Mar. 14, 2000 |
| 6034430 |
Integrated thermal coupling for a heat generating device |
Mar. 7, 2000 |
| 6028348 |
Low thermal impedance integrated circuit |
Feb. 22, 2000 |
| 6022616 |
Adhesive composition with small particle size for microelectronic devices |
Feb. 8, 2000 |
| 6023098 |
Semiconductor device having terminals for heat radiation |
Feb. 8, 2000 |
| 6016006 |
Thermal grease insertion and retention |
Jan. 18, 2000 |
| 6014314 |
Package structure of a multi-chip module |
Jan. 11, 2000 |
| 5990554 |
Semiconductor package having isolated heatsink bonding pads |
Nov. 23, 1999 |
| 5986885 |
Semiconductor package with internal heatsink and assembly method |
Nov. 16, 1999 |
| 5982635 |
Signal adaptor board for a pin grid array |
Nov. 9, 1999 |
| 5968606 |
Screen printable UV curable conductive material composition |
Oct. 19, 1999 |
| 5969414 |
Semiconductor package with molded plastic body |
Oct. 19, 1999 |
| 5959352 |
Chip arrangement and method of producing the same |
Sep. 28, 1999 |
| 5952728 |
Thermoelectric conversion module having channels filled with semiconducting material and insulating fillers |
Sep. 14, 1999 |
| 5940271 |
Stiffener with integrated heat sink attachment |
Aug. 17, 1999 |
| 5936353 |
High-density solid-state lighting array for machine vision applications |
Aug. 10, 1999 |
| 5933324 |
Apparatus for dissipating heat from a conductive layer in a circuit board |
Aug. 3, 1999 |
| 5930114 |
Heat sink mounting assembly for surface mount electronic device packages |
Jul. 27, 1999 |
| 5930115 |
Apparatus, method and system for thermal management of a semiconductor device |
Jul. 27, 1999 |
| 5926372 |
Power block assembly and method of making same |
Jul. 20, 1999 |
| 5925929 |
Cooling apparatus for electronic elements |
Jul. 20, 1999 |
| 5926373 |
Encapsulated, board-mountable power supply and method of manufacture |
Jul. 20, 1999 |
| 5923084 |
Semiconductor device for heat discharge |
Jul. 13, 1999 |
| 5909056 |
High performance heat spreader for flip chip packages |
Jun. 1, 1999 |
| 5905636 |
Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device |
May. 18, 1999 |
| 5903436 |
Emulative lid/heatspreader for processor die attached to an organic substrate |
May. 11, 1999 |
| 5902120 |
Process for producing spatially patterned components |
May. 11, 1999 |
| 5903434 |
CPU heat sink clamping device |
May. 11, 1999 |
| 5898571 |
Apparatus and method for clip-on attachment of heat sinks to encapsulated semiconductor packages |
Apr. 27, 1999 |
| 5895973 |
Electronic component assembly for maintaining component alignment during soldering |
Apr. 20, 1999 |
| 5892279 |
Packaging for electronic power devices and applications using the packaging |
Apr. 6, 1999 |
| 5889319 |
RF power package with a dual ground |
Mar. 30, 1999 |
| 5886400 |
Semiconductor device having an insulating layer and method for making |
Mar. 23, 1999 |
|
|
|
