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Class Information
Number: 257/717
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer)
Description: Subject matter wherein an insulating element is used to physically separate a cooling means from an active solid-state electronic device or a housing therefor.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6400577 |
Integrated circuit socket assembly having integral shielding members |
Jun. 4, 2002 |
| 6392890 |
Method and device for heat dissipation in an electronics system |
May. 21, 2002 |
| 6392308 |
Semiconductor device having bumper portions integral with a heat sink |
May. 21, 2002 |
| 6384474 |
Housing for receiving a planar power transistor |
May. 7, 2002 |
| 6367544 |
Thermal jacket for reducing condensation and method for making same |
Apr. 9, 2002 |
| 6365964 |
Heat-dissipating assembly for removing heat from a flip chip semiconductor device |
Apr. 2, 2002 |
| 6351386 |
Component shim for mounting a component on a heat spreader |
Feb. 26, 2002 |
| 6351384 |
Device and method for cooling multi-chip modules |
Feb. 26, 2002 |
| 6337512 |
Semiconductor module |
Jan. 8, 2002 |
| 6335863 |
Package for semiconductors, and semiconductor module that employs the package |
Jan. 1, 2002 |
| 6320257 |
Chip packaging technique |
Nov. 20, 2001 |
| 6320270 |
Semiconductor device and method of producing the same |
Nov. 20, 2001 |
| 6313994 |
Extended surface area heat sink |
Nov. 6, 2001 |
| 6304450 |
Inter-circuit encapsulated packaging |
Oct. 16, 2001 |
| 6297550 |
Bondable anodized aluminum heatspreader for semiconductor packages |
Oct. 2, 2001 |
| 6288444 |
Semiconductor device and method of producing the same |
Sep. 11, 2001 |
| 6281592 |
Package structure for semiconductor chip |
Aug. 28, 2001 |
| 6282096 |
Integration of heat conducting apparatus and chip carrier in IC package |
Aug. 28, 2001 |
| 6281575 |
Multi-chip module |
Aug. 28, 2001 |
| 6278182 |
Lead frame type semiconductor package |
Aug. 21, 2001 |
| 6272015 |
Power semiconductor module with insulation shell support for plural separate substrates |
Aug. 7, 2001 |
| 6268239 |
Semiconductor chip cooling structure and manufacturing method thereof |
Jul. 31, 2001 |
| 6262480 |
Package for electronic device having a fully insulated dissipator |
Jul. 17, 2001 |
| 6259156 |
Semiconductor device and method for manufacturing same |
Jul. 10, 2001 |
| 6255726 |
Vertical interconnect process for silicon segments with dielectric isolation |
Jul. 3, 2001 |
| 6245442 |
Metal matrix composite casting and manufacturing method thereof |
Jun. 12, 2001 |
| 6246111 |
Universal lead frame type of quad flat non-lead package of semiconductor |
Jun. 12, 2001 |
| 6246115 |
Semiconductor package having a heat sink with an exposed surface |
Jun. 12, 2001 |
| 6236569 |
Attaching heat sinks to integrated circuits |
May. 22, 2001 |
| 6236568 |
Heat-dissipating structure for integrated circuit package |
May. 22, 2001 |
| 6232151 |
Power electronic module packaging |
May. 15, 2001 |
| 6229705 |
Clip for securing heat sink to electronic device package |
May. 8, 2001 |
| 6225571 |
Heatsink with high thermal conductivity dielectric |
May. 1, 2001 |
| 6222276 |
Through-chip conductors for low inductance chip-to-chip integration and off-chip connections |
Apr. 24, 2001 |
| 6219242 |
Apparatus for cooling a heat producing member |
Apr. 17, 2001 |
| 6219243 |
Heat spreader structures for enhanced heat removal from both sides of chip-on-flex packaged units |
Apr. 17, 2001 |
| 6210520 |
Screen printable thermally curing conductive gel |
Apr. 3, 2001 |
| 6212074 |
Apparatus for dissipating heat from a circuit board having a multilevel surface |
Apr. 3, 2001 |
| 6206997 |
Method for bonding heat sinks to overmolds and device formed thereby |
Mar. 27, 2001 |
| 6208519 |
Thermally enhanced semiconductor package |
Mar. 27, 2001 |
| 6201696 |
Package for semiconductor power device and method for assembling the same |
Mar. 13, 2001 |
| 6198163 |
Thin leadframe-type semiconductor package having heat sink with recess and exposed surface |
Mar. 6, 2001 |
| 6195256 |
Card assembly of power device in plastic package with external heat sink soldered to the internal heat sink |
Feb. 27, 2001 |
| 6188578 |
Integrated circuit package with multiple heat dissipation paths |
Feb. 13, 2001 |
| 6184580 |
Ball grid array package with conductive leads |
Feb. 6, 2001 |
| 6175501 |
Method and arrangement for cooling an electronic assembly |
Jan. 16, 2001 |
| 6172872 |
Heat sink and information processor using it |
Jan. 9, 2001 |
| 6172416 |
Heat sink unit for cooling a plurality of exothermic units, and electronic apparatus comprising the same |
Jan. 9, 2001 |
| 6166446 |
Semiconductor device and fabrication process thereof |
Dec. 26, 2000 |
| 6157539 |
Cooling apparatus for electronic devices |
Dec. 5, 2000 |
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