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Class Information
Number: 257/717
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer)
Description: Subject matter wherein an insulating element is used to physically separate a cooling means from an active solid-state electronic device or a housing therefor.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6627981 |
Resin-packaged semiconductor device |
Sep. 30, 2003 |
| 6627997 |
Semiconductor module and method of mounting |
Sep. 30, 2003 |
| 6624523 |
Structure and package of a heat spreader substrate |
Sep. 23, 2003 |
| 6616999 |
Preapplicable phase change thermal interface pad |
Sep. 9, 2003 |
| 6614107 |
Thin-film heat sink and method of manufacturing same |
Sep. 2, 2003 |
| 6611057 |
Semiconductor device attaining both high speed processing and sufficient cooling capacity |
Aug. 26, 2003 |
| 6608379 |
Enhanced chip scale package for flip chips |
Aug. 19, 2003 |
| 6607942 |
Method of fabricating as grooved heat spreader for stress reduction in an IC package |
Aug. 19, 2003 |
| 6597063 |
Package for semiconductor power device and method for assembling the same |
Jul. 22, 2003 |
| 6596565 |
Chip on board and heat sink attachment methods |
Jul. 22, 2003 |
| 6590281 |
Crack-preventive semiconductor package |
Jul. 8, 2003 |
| 6586835 |
Compact system module with built-in thermoelectric cooling |
Jul. 1, 2003 |
| 6586834 |
Die-up tape ball grid array package |
Jul. 1, 2003 |
| 6586845 |
Semiconductor device module and a part thereof |
Jul. 1, 2003 |
| 6576497 |
Chip-type electronic component |
Jun. 10, 2003 |
| 6573596 |
Non-rectangular thermo module wafer cooling device using the same |
Jun. 3, 2003 |
| 6574106 |
Mounting structure of semiconductor device |
Jun. 3, 2003 |
| 6574107 |
Stacked intelligent power module package |
Jun. 3, 2003 |
| 6555200 |
Method of making semiconductor devices, semiconductor device, circuit board, and electronic apparatus |
Apr. 29, 2003 |
| 6545351 |
Underside heat slug for ball grid array packages |
Apr. 8, 2003 |
| 6541854 |
Super low profile package with high efficiency of heat dissipation |
Apr. 1, 2003 |
| 6542371 |
High thermal conductivity heat transfer pad |
Apr. 1, 2003 |
| 6538308 |
Semiconductor apparatus with heat radiation structure for removing heat from semiconductor element |
Mar. 25, 2003 |
| 6534861 |
Ball grid substrate for lead-on-chip semiconductor package |
Mar. 18, 2003 |
| 6531770 |
Electronic part unit attached to a circuit board and including a cover member covering the electronic part |
Mar. 11, 2003 |
| 6528878 |
Device for sealing and cooling multi-chip modules |
Mar. 4, 2003 |
| 6521982 |
Packaging high power integrated circuit devices |
Feb. 18, 2003 |
| 6519154 |
Thermal bus design to cool a microelectronic die |
Feb. 11, 2003 |
| 6515859 |
Heat sink alignment |
Feb. 4, 2003 |
| 6507101 |
Lossy RF shield for integrated circuits |
Jan. 14, 2003 |
| 6501171 |
Flip chip package with improved cap design and process for making thereof |
Dec. 31, 2002 |
| 6498390 |
Integrated circuit package that includes a thermally conductive tape which attaches a thermal element to a plastic housing |
Dec. 24, 2002 |
| 6495913 |
Semiconductor clamped-stack assembly |
Dec. 17, 2002 |
| 6492724 |
Structure for reinforcing a semiconductor device to prevent cracking |
Dec. 10, 2002 |
| 6492739 |
Semiconductor device having bumper portions integral with a heat sink |
Dec. 10, 2002 |
| 6483186 |
High power monolithic microwave integrated circuit package |
Nov. 19, 2002 |
| 6479889 |
Semiconductor device package, and fabrication method thereof |
Nov. 12, 2002 |
| 6476483 |
Method and apparatus for cooling a silicon on insulator device |
Nov. 5, 2002 |
| 6472743 |
Semiconductor package with heat dissipating structure |
Oct. 29, 2002 |
| 6469380 |
Resin sealed semiconductor device utilizing a clad material heat sink |
Oct. 22, 2002 |
| 6466426 |
Method and apparatus for thermal control of a semiconductor substrate |
Oct. 15, 2002 |
| 6462410 |
Integrated circuit component temperature gradient reducer |
Oct. 8, 2002 |
| 6455930 |
Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology |
Sep. 24, 2002 |
| 6449154 |
Heat sink assembly retainer device |
Sep. 10, 2002 |
| 6444498 |
Method of making semiconductor package with heat spreader |
Sep. 3, 2002 |
| 6434006 |
Semiconductor device having heat radiating member |
Aug. 13, 2002 |
| 6433420 |
Semiconductor package with heat sink having air vent |
Aug. 13, 2002 |
| 6407924 |
Enhanced thermal path mechanical tolerance system |
Jun. 18, 2002 |
| 6404048 |
Heat dissipating microelectronic package |
Jun. 11, 2002 |
| 6400011 |
Semiconductor laser module |
Jun. 4, 2002 |
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