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Class Information
Number: 257/717
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer)
Description: Subject matter wherein an insulating element is used to physically separate a cooling means from an active solid-state electronic device or a housing therefor.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6849943 |
Power module package for high frequency switching system |
Feb. 1, 2005 |
| 6849935 |
Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board |
Feb. 1, 2005 |
| 6849940 |
Integrated circuit package for the transfer of heat generated by the inte circuit and method of fabricating same |
Feb. 1, 2005 |
| 6847114 |
Micro-scale interconnect device with internal heat spreader and method for fabricating same |
Jan. 25, 2005 |
| 6847113 |
Electronic apparatus with plate-like member having plural recesses containing heat accumulating material |
Jan. 25, 2005 |
| 6842341 |
Electrical circuit apparatus and method for assembling same |
Jan. 11, 2005 |
| 6836014 |
Optical testing of integrated circuits with temperature control |
Dec. 28, 2004 |
| 6831352 |
Semiconductor package for high frequency performance |
Dec. 14, 2004 |
| 6831358 |
Heat-dissipative coating |
Dec. 14, 2004 |
| 6828673 |
Heat sink assembly |
Dec. 7, 2004 |
| 6828676 |
Semiconductor device manufacturing method, semiconductor device, and semiconductor device unit |
Dec. 7, 2004 |
| 6825556 |
Integrated circuit package design with non-orthogonal die cut out |
Nov. 30, 2004 |
| 6822325 |
Isolating temperature sensitive components from heat sources in integrated circuits |
Nov. 23, 2004 |
| 6822331 |
Method of mounting a circuit component and joint structure therefor |
Nov. 23, 2004 |
| 6809937 |
Method and apparatus for shock and vibration isolation of a circuit component |
Oct. 26, 2004 |
| 6800931 |
Heat-dissipating device of a semiconductor device and fabrication method for same |
Oct. 5, 2004 |
| 6787870 |
Semiconductor component with integrated circuit, cooling body, and temperature sensor |
Sep. 7, 2004 |
| 6784538 |
Heat transfer structure for a semiconductor device utilizing a bismuth glass layer |
Aug. 31, 2004 |
| 6780678 |
Cooling of optoelectronic elements |
Aug. 24, 2004 |
| 6777792 |
Semiconductor device and package with high heat radiation effect |
Aug. 17, 2004 |
| 6778390 |
High-performance heat sink for printed circuit boards |
Aug. 17, 2004 |
| 6770967 |
Remote thermal vias for densely packed electrical assemblage |
Aug. 3, 2004 |
| 6770968 |
Method for bonding heat sinks to overmolds and device formed thereby |
Aug. 3, 2004 |
| 6768193 |
Heat transfer structure for a semiconductor device utilizing a bismuth glass layer |
Jul. 27, 2004 |
| 6757170 |
Heat sink and package surface design |
Jun. 29, 2004 |
| 6756684 |
Flip-chip ball grid array semiconductor package with heat-dissipating device and method for fabricating the same |
Jun. 29, 2004 |
| 6753602 |
Semiconductor package with heat-dissipating structure and method of making the same |
Jun. 22, 2004 |
| 6753603 |
Electronic equipment having insulating heat dissipation plate |
Jun. 22, 2004 |
| 6750551 |
Direct BGA attachment without solder reflow |
Jun. 15, 2004 |
| 6747347 |
Multi-chip electronic package and cooling system |
Jun. 8, 2004 |
| 6743972 |
Heat dissipating IC devices |
Jun. 1, 2004 |
| 6744136 |
Sealed liquid cooled electronic device |
Jun. 1, 2004 |
| 6744132 |
Module with adhesively attached heat sink |
Jun. 1, 2004 |
| 6740972 |
Electronic device having fibrous interface |
May. 25, 2004 |
| 6734552 |
Enhanced thermal dissipation integrated circuit package |
May. 11, 2004 |
| 6730998 |
Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including same |
May. 4, 2004 |
| 6727422 |
Heat sink/heat spreader structures and methods of manufacture |
Apr. 27, 2004 |
| 6723926 |
Mounting configuration of electric and/or electronic components on a printed circuit board |
Apr. 20, 2004 |
| 6720581 |
Mounting plate for a laser chip in a semiconductor laser device |
Apr. 13, 2004 |
| 6720650 |
Semiconductor device having heat spreader attached thereto and method of manufacturing the same |
Apr. 13, 2004 |
| 6713409 |
Semiconductor manufacturing using modular substrates |
Mar. 30, 2004 |
| 6713862 |
Low temperature co-fired ceramic-metal packaging technology |
Mar. 30, 2004 |
| 6713851 |
Lead over chip semiconductor device including a heat sink for heat dissipation |
Mar. 30, 2004 |
| 6707138 |
Semiconductor device including metal strap electrically coupled between semiconductor die and metal leadframe |
Mar. 16, 2004 |
| 6690087 |
Power semiconductor module ceramic substrate with upper and lower plates attached to a metal base |
Feb. 10, 2004 |
| 6667548 |
Diamond heat spreading and cooling technique for integrated circuits |
Dec. 23, 2003 |
| 6667546 |
Ball grid array semiconductor package and substrate without power ring or ground ring |
Dec. 23, 2003 |
| 6664649 |
Lead-on-chip type of semiconductor package with embedded heat sink |
Dec. 16, 2003 |
| 6645612 |
High solids hBN slurry, hBN paste, spherical hBN powder, and methods of making and using them |
Nov. 11, 2003 |
| 6646341 |
Heat sink apparatus utilizing the heat sink shroud to dissipate heat |
Nov. 11, 2003 |
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