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Class Information
Number: 257/717
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer)
Description: Subject matter wherein an insulating element is used to physically separate a cooling means from an active solid-state electronic device or a housing therefor.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6984887 |
Heatsink arrangement for semiconductor device |
Jan. 10, 2006 |
| 6982481 |
System for dissipating heat and shielding electromagnetic radiation produced by an electronic device |
Jan. 3, 2006 |
| 6979894 |
Integrated chip package having intermediate substrate |
Dec. 27, 2005 |
| 6979899 |
System and method for high performance heat sink for multiple chip devices |
Dec. 27, 2005 |
| 6977818 |
Heat dissipating device for an integrated circuit chip |
Dec. 20, 2005 |
| 6975028 |
Thermal apparatus for engaging electronic device |
Dec. 13, 2005 |
| 6975513 |
Construction for high density power module package |
Dec. 13, 2005 |
| 6975027 |
Multi-chip electronic package and cooling system |
Dec. 13, 2005 |
| 6969907 |
Cooling structure for multichip module |
Nov. 29, 2005 |
| 6967403 |
Package structure with a heat spreader and manufacturing method thereof |
Nov. 22, 2005 |
| 6963131 |
Integrated circuit system with a latent heat storage module |
Nov. 8, 2005 |
| 6958536 |
Microelectronic packages having rail along portion of lid periphery |
Oct. 25, 2005 |
| 6956282 |
Stabilizer/spacer for semiconductor device |
Oct. 18, 2005 |
| 6949824 |
Internal package heat dissipator |
Sep. 27, 2005 |
| 6949838 |
Integrated circuit device |
Sep. 27, 2005 |
| 6949823 |
Method and apparatus for high electrical and thermal performance ball grid array package |
Sep. 27, 2005 |
| 6947285 |
Thermal interface material |
Sep. 20, 2005 |
| 6946730 |
Semiconductor device having heat conducting plate |
Sep. 20, 2005 |
| 6946729 |
Wafer level package structure with a heat slug |
Sep. 20, 2005 |
| 6936919 |
Heatsink-substrate-spacer structure for an integrated-circuit package |
Aug. 30, 2005 |
| 6933602 |
Semiconductor package having a thermally and electrically connected heatspreader |
Aug. 23, 2005 |
| 6928380 |
Thermal measurements of electronic devices during operation |
Aug. 9, 2005 |
| 6924559 |
Electronic device with heat conductive encasing device |
Aug. 2, 2005 |
| 6921973 |
Electronic module having compliant spacer |
Jul. 26, 2005 |
| 6921974 |
Packaged device with thermal enhancement and method of packaging |
Jul. 26, 2005 |
| 6919231 |
Methods of forming channels on an integrated circuit die and die cooling systems including such channels |
Jul. 19, 2005 |
| 6919624 |
Semiconductor device with exposed electrodes |
Jul. 19, 2005 |
| 6919630 |
Semiconductor package with heat spreader |
Jul. 19, 2005 |
| 6920052 |
Dynamic isolating mount for processor packages |
Jul. 19, 2005 |
| 6916122 |
Modular heat sinks |
Jul. 12, 2005 |
| 6917099 |
Die carrier with fluid chamber |
Jul. 12, 2005 |
| 6914325 |
Power semiconductor module |
Jul. 5, 2005 |
| 6911724 |
Integrated chip package having intermediate substrate with capacitor |
Jun. 28, 2005 |
| 6909169 |
Grounded embedded flip chip RF integrated circuit |
Jun. 21, 2005 |
| 6903457 |
Power semiconductor device |
Jun. 7, 2005 |
| 6900501 |
Silicon on insulator device with improved heat removal |
May. 31, 2005 |
| 6894376 |
Leadless microelectronic package and a method to maximize the die size in the package |
May. 17, 2005 |
| 6890618 |
Method and apparatus for retaining a thermally conductive pin in a thermal spreader plate |
May. 10, 2005 |
| 6891259 |
Semiconductor package having dam and method for fabricating the same |
May. 10, 2005 |
| 6882042 |
Thermally and electrically enhanced ball grid array packaging |
Apr. 19, 2005 |
| 6873043 |
Electronic assembly having electrically-isolated heat-conductive structure |
Mar. 29, 2005 |
| 6870736 |
Heat sink and package surface design |
Mar. 22, 2005 |
| 6867493 |
Structure and method for fabrication of a leadless multi-die carrier |
Mar. 15, 2005 |
| 6864572 |
Base for heat sink |
Mar. 8, 2005 |
| 6861750 |
Ball grid array package with multiple interposers |
Mar. 1, 2005 |
| 6856016 |
Method and apparatus using nanotubes for cooling and grounding die |
Feb. 15, 2005 |
| 6853059 |
Semiconductor package having improved adhesiveness and ground bonding |
Feb. 8, 2005 |
| 6853070 |
Die-down ball grid array package with die-attached heat spreader and method for making the same |
Feb. 8, 2005 |
| 6853071 |
Electronic device having dewing prevention structure and dewing prevention structure of electronic device |
Feb. 8, 2005 |
| 6849942 |
Semiconductor package with heat sink attached to substrate |
Feb. 1, 2005 |
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