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Class Information
Number: 257/717
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer)
Description: Subject matter wherein an insulating element is used to physically separate a cooling means from an active solid-state electronic device or a housing therefor.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7202559 |
Method of assembling a ball grid array package with patterned stiffener layer |
Apr. 10, 2007 |
| 7200006 |
Compliant thermal interface for electronic equipment |
Apr. 3, 2007 |
| 7196426 |
Multilayered substrate for semiconductor device |
Mar. 27, 2007 |
| 7193316 |
Integrated circuit coolant microchannel with movable portion |
Mar. 20, 2007 |
| 7193328 |
Semiconductor device |
Mar. 20, 2007 |
| 7183642 |
Electronic package with thermally-enhanced lid |
Feb. 27, 2007 |
| 7166912 |
Isolated thermal interface |
Jan. 23, 2007 |
| 7166914 |
Semiconductor package with heat sink |
Jan. 23, 2007 |
| 7151671 |
Power supply |
Dec. 19, 2006 |
| 7145225 |
Interposer configured to reduce the profiles of semiconductor device assemblies and packages including the same and methods |
Dec. 5, 2006 |
| 7142426 |
Heat dissipating device and method for manufacturing it |
Nov. 28, 2006 |
| 7135644 |
Permeable conductive shield having a laminated structure |
Nov. 14, 2006 |
| 7132746 |
Electronic assembly with solder-bonded heat sink |
Nov. 7, 2006 |
| 7133286 |
Method and apparatus for sealing a liquid cooled electronic device |
Nov. 7, 2006 |
| 7129640 |
Integrated circuit device for driving a laser diode with reduced heat transfer and method for fabricating the device |
Oct. 31, 2006 |
| 7115988 |
Bypass capacitor embedded flip chip package lid and stiffener |
Oct. 3, 2006 |
| 7112883 |
Semiconductor device with temperature control mechanism |
Sep. 26, 2006 |
| 7105858 |
Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density |
Sep. 12, 2006 |
| 7106766 |
Optical device, method of manufacturing the same, optical module, optical transmission system |
Sep. 12, 2006 |
| 7102226 |
Device and method for package warp compensation in an integrated heat spreader |
Sep. 5, 2006 |
| 7091603 |
Semiconductor device |
Aug. 15, 2006 |
| 7091604 |
Three dimensional integrated circuits |
Aug. 15, 2006 |
| 7075180 |
Method and apparatus for applying body bias to integrated circuit die |
Jul. 11, 2006 |
| 7067908 |
Semiconductor package having improved adhesiveness and ground bonding |
Jun. 27, 2006 |
| 7064428 |
Wafer-level package structure |
Jun. 20, 2006 |
| 7061022 |
Lateral heat spreading layers for epi-side up ridge waveguide semiconductor lasers |
Jun. 13, 2006 |
| 7061103 |
Chip package structure |
Jun. 13, 2006 |
| 7061079 |
Chip package structure and manufacturing method thereof |
Jun. 13, 2006 |
| 7056566 |
Preappliable phase change thermal interface pad |
Jun. 6, 2006 |
| 7052937 |
Method and structure for providing improved thermal conduction for silicon semiconductor devices |
May. 30, 2006 |
| 7049696 |
IC package with electrically conductive heat-radiating mechanism, connection structure and electronic device |
May. 23, 2006 |
| 7049695 |
Method and device for heat dissipation in semiconductor modules |
May. 23, 2006 |
| 7046155 |
Fault detection system |
May. 16, 2006 |
| 7045890 |
Heat spreader and stiffener having a stiffener extension |
May. 16, 2006 |
| 7042081 |
Semiconductor device having heat dissipation layer |
May. 9, 2006 |
| 7030485 |
Thermal interface structure with integrated liquid cooling and methods |
Apr. 18, 2006 |
| 7030484 |
Lidless chip package effectively having co-planar frame and semiconductor die surfaces |
Apr. 18, 2006 |
| 7031162 |
Method and structure for cooling a dual chip module with one high power chip |
Apr. 18, 2006 |
| 7026719 |
Semiconductor package with a heat spreader |
Apr. 11, 2006 |
| 7022553 |
Compact system module with built-in thermoelectric cooling |
Apr. 4, 2006 |
| 7019395 |
Double-sided cooling type semiconductor module |
Mar. 28, 2006 |
| 7015072 |
Method of manufacturing an enhanced thermal dissipation integrated circuit package |
Mar. 21, 2006 |
| 7015578 |
Semiconductor unit with cooling system |
Mar. 21, 2006 |
| 7009289 |
Fluxless die-to-heat spreader bonding using thermal interface material |
Mar. 7, 2006 |
| 7009284 |
Semiconductor apparatus with heat radiation structure for removing heat from semiconductor element |
Mar. 7, 2006 |
| 7002247 |
Thermal interposer for thermal management of semiconductor devices |
Feb. 21, 2006 |
| 6995463 |
Integrated chip package having intermediate substrate and multiple semiconductor chips |
Feb. 7, 2006 |
| 6992382 |
Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon |
Jan. 31, 2006 |
| 6989592 |
Integrated power module with reduced thermal impedance |
Jan. 24, 2006 |
| 6987317 |
Power delivery using an integrated heat spreader |
Jan. 17, 2006 |
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