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Class Information
Number: 257/717
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer)
Description: Subject matter wherein an insulating element is used to physically separate a cooling means from an active solid-state electronic device or a housing therefor.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 4237086 |
Method for releasably mounting a substrate on a base providing heat transfer and electrical conduction |
Dec. 2, 1980 |
| 4231058 |
Tungsten-titanium-chromium/gold semiconductor metallization |
Oct. 28, 1980 |
| 4218695 |
Semiconductor rectifier housing assembly |
Aug. 19, 1980 |
| 4209799 |
Semiconductor mounting producing efficient heat dissipation |
Jun. 24, 1980 |
| 4183041 |
Self biasing of a field effect transistor mounted in a flip-chip carrier |
Jan. 8, 1980 |
| 4180414 |
Concentrator solar cell array module |
Dec. 25, 1979 |
| 4172261 |
Semiconductor device having a highly air-tight package |
Oct. 23, 1979 |
| 4160992 |
Plural semiconductor devices mounted between plural heat sinks |
Jul. 10, 1979 |
| 4150393 |
High frequency semiconductor package |
Apr. 17, 1979 |
| 4145708 |
Power module with isolated substrates cooled by integral heat-energy-removal means |
Mar. 20, 1979 |
| 4141136 |
Method of fabricating semiconductor devices with a low thermal resistance and devices obtained by the method |
Feb. 27, 1979 |
| 4132856 |
Process of forming a plastic encapsulated molded film carrier CML package and the package formed thereby |
Jan. 2, 1979 |
| 4124864 |
Plastic encapsulated semiconductor devices |
Nov. 7, 1978 |
| 4117508 |
Pressurizable semiconductor pellet assembly |
Sep. 26, 1978 |
| 4103321 |
Composite electric circuit structure of a printed circuit and heat generating discrete electrical component |
Jul. 25, 1978 |
| 4081825 |
Conduction-cooled circuit package |
Mar. 28, 1978 |
| 4079410 |
Semiconductor rectifier device with improved cooling arrangement |
Mar. 14, 1978 |
| 4074342 |
Electrical package for LSI devices and assembly process therefor |
Feb. 14, 1978 |
| 4067041 |
Semiconductor device package and method of making same |
Jan. 3, 1978 |
| 4047197 |
Housing and lead structure for a series connected semiconductor rectifier arrangement |
Sep. 6, 1977 |
| 4000509 |
High density air cooled wafer package having improved thermal dissipation |
Dec. 28, 1976 |
| 3996603 |
RF power semiconductor package and method of manufacture |
Dec. 7, 1976 |
| 3943556 |
Method of making a high frequency semiconductor package |
Mar. 9, 1976 |
| 3936866 |
Heat conductive mounting and connection of semiconductor chips in micro-circuitry on a substrate |
Feb. 3, 1976 |
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