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Class Information
Number: 257/717
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer)
Description: Subject matter wherein an insulating element is used to physically separate a cooling means from an active solid-state electronic device or a housing therefor.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 4807018 |
Method and package for dissipating heat generated by an integrated circuit chip |
Feb. 21, 1989 |
| 4803590 |
Electric switching device |
Feb. 7, 1989 |
| 4788584 |
RF transistor package with capacitor |
Nov. 29, 1988 |
| 4783428 |
Method of producing a thermogenetic semiconductor device |
Nov. 8, 1988 |
| 4771366 |
Ceramic card assembly having enhanced power distribution and cooling |
Sep. 13, 1988 |
| 4764804 |
Semiconductor device and process for producing the same |
Aug. 16, 1988 |
| 4750089 |
Circuit board with a chip carrier and mounting structure connected to the chip carrier |
Jun. 7, 1988 |
| 4750030 |
Resin-molded semiconductor device having heat radiating plate embedded in the resin |
Jun. 7, 1988 |
| 4748538 |
Semiconductor module |
May. 31, 1988 |
| 4745456 |
Heat sink clip assembly |
May. 17, 1988 |
| 4731693 |
Connection apparatus for integrated circuit |
Mar. 15, 1988 |
| 4707726 |
Heat sink mounting arrangement for a semiconductor |
Nov. 17, 1987 |
| 4689583 |
Dual diode module with heat sink, for use in a cavity power combiner |
Aug. 25, 1987 |
| 4688077 |
Semiconductor device having radiator |
Aug. 18, 1987 |
| 4685987 |
Method of preparing interfacings of heat sinks with electrical devices |
Aug. 11, 1987 |
| 4672422 |
Semiconductor rectifier unit |
Jun. 9, 1987 |
| 4661835 |
Semiconductor structure and method of its manufacture |
Apr. 28, 1987 |
| 4654754 |
Thermal link |
Mar. 31, 1987 |
| 4646203 |
Mounting structure for semiconductor devices |
Feb. 24, 1987 |
| 4646129 |
Hermetic power chip packages |
Feb. 24, 1987 |
| 4642716 |
Magnetic transducer head assembly with support system therefor |
Feb. 10, 1987 |
| 4631819 |
Low stress, tolerance free method for mounting power devices |
Dec. 30, 1986 |
| 4631573 |
Cooled stack of electrically isolated semiconductors |
Dec. 23, 1986 |
| 4628406 |
Method of packaging integrated circuit chips, and integrated circuit package |
Dec. 9, 1986 |
| 4617729 |
Process for manufacturing miniaturized electronic power circuits |
Oct. 21, 1986 |
| 4583283 |
Electrically isolated semiconductor power device |
Apr. 22, 1986 |
| 4574299 |
Thyristor packaging system |
Mar. 4, 1986 |
| 4574162 |
Compact circuit package with improved construction for clamping to enhance heat transfer |
Mar. 4, 1986 |
| 4571612 |
Corrosion-protected electrical circuit component |
Feb. 18, 1986 |
| 4542401 |
Semiconductor device with sprayed metal layer |
Sep. 17, 1985 |
| 4538168 |
High power semiconductor package |
Aug. 27, 1985 |
| 4538169 |
Integrated alternator bridge heat sink |
Aug. 27, 1985 |
| 4510519 |
Electrically isolated semiconductor power device |
Apr. 9, 1985 |
| 4495515 |
Electrically isolating two piece mounting washer arrangement |
Jan. 22, 1985 |
| 4482915 |
Lead frame for plastic encapsulated semiconductor device |
Nov. 13, 1984 |
| 4460917 |
Molded-in isolation bushing for semiconductor devices |
Jul. 17, 1984 |
| 4450471 |
Semi-conductor power device assembly and method of manufacture thereof |
May. 22, 1984 |
| 4449292 |
Method of clamping a circuit package to enhance heat transfer |
May. 22, 1984 |
| 4404739 |
Method for mounting, electrically isolating and maintaining constant pressure on a semiconductor element |
Sep. 20, 1983 |
| 4396936 |
Integrated circuit chip package with improved cooling means |
Aug. 2, 1983 |
| 4390891 |
Semiconductor component with a plurality of semiconductor elements |
Jun. 28, 1983 |
| 4352120 |
Semiconductor device using SiC as supporter of a semiconductor element |
Sep. 28, 1982 |
| 4342068 |
Mounting assembly for semiconductor devices and particularly power transistors |
Jul. 27, 1982 |
| 4338577 |
Semiconductor laser apparatus |
Jul. 6, 1982 |
| 4333101 |
Semiconductor heat sink mounting assembly |
Jun. 1, 1982 |
| 4303935 |
Semiconductor apparatus with electrically insulated heat sink |
Dec. 1, 1981 |
| 4288839 |
Solid state device mounting and heat dissipating assembly |
Sep. 8, 1981 |
| 4278990 |
Low thermal resistance, low stress semiconductor package |
Jul. 14, 1981 |
| 4270138 |
Enhanced thermal transfer package for a semiconductor device |
May. 26, 1981 |
| 4266267 |
Mounting arrangement for transistors and the like |
May. 5, 1981 |
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