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Class Information
Number: 257/717
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer)
Description: Subject matter wherein an insulating element is used to physically separate a cooling means from an active solid-state electronic device or a housing therefor.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5315156 |
Transistor device layout |
May. 24, 1994 |
| 5313099 |
Heat sink assembly for solid state devices |
May. 17, 1994 |
| 5300810 |
Electronic circuit and method with thermal management |
Apr. 5, 1994 |
| 5296735 |
Power semiconductor module with multiple shielding layers |
Mar. 22, 1994 |
| 5297001 |
High power semiconductor assembly |
Mar. 22, 1994 |
| 5296739 |
Circuit arrangement with a cooling member |
Mar. 22, 1994 |
| 5293070 |
Integrated heat sink having a sinuous fluid channel for the thermal dissipation of semiconductor modules |
Mar. 8, 1994 |
| 5291064 |
Package structure for semiconductor device having a flexible wiring circuit member spaced from the package casing |
Mar. 1, 1994 |
| 5287001 |
Cooling structures and package modules for semiconductors |
Feb. 15, 1994 |
| 5285108 |
Cooling system for integrated circuits |
Feb. 8, 1994 |
| 5283464 |
Electrically insulated heat pipe type cooling apparatus for semiconductor |
Feb. 1, 1994 |
| 5272375 |
Electronic assembly with optimum heat dissipation |
Dec. 21, 1993 |
| 5247203 |
Semiconductor device mounted on a heat sink with an intervening amorphous semiconductor material |
Sep. 21, 1993 |
| 5216283 |
Semiconductor device having an insertable heat sink and method for mounting the same |
Jun. 1, 1993 |
| 5198889 |
Cooling apparatus |
Mar. 30, 1993 |
| 5184211 |
Apparatus for packaging and cooling integrated circuit chips |
Feb. 2, 1993 |
| 5175613 |
Package for EMI, ESD, thermal, and mechanical shock protection of circuit chips |
Dec. 29, 1992 |
| 5157587 |
Sealing arrangement |
Oct. 20, 1992 |
| 5156999 |
Packaging method for semiconductor laser/detector devices |
Oct. 20, 1992 |
| 5148264 |
High current hermetic package |
Sep. 15, 1992 |
| 5113232 |
LED array chips with thermal conductor |
May. 12, 1992 |
| 5109268 |
RF transistor package and mounting pad |
Apr. 28, 1992 |
| 5105260 |
RF transistor package with nickel oxide barrier |
Apr. 14, 1992 |
| 5060112 |
Electrical component assembly with heat sink |
Oct. 22, 1991 |
| 5055909 |
System for achieving desired bondlength of adhesive between a semiconductor chip package and a heatsink |
Oct. 8, 1991 |
| 5049976 |
Stress reduction package and process |
Sep. 17, 1991 |
| 5043797 |
Cooling header connection for a thyristor stack |
Aug. 27, 1991 |
| 5043796 |
Isolating multiple device mount with stress relief |
Aug. 27, 1991 |
| 5021925 |
Electrical isolator device |
Jun. 4, 1991 |
| 5008492 |
High current feedthrough package |
Apr. 16, 1991 |
| 5006921 |
Power semiconductor switching apparatus with heat sinks |
Apr. 9, 1991 |
| 5006925 |
Three dimensional microelectric packaging |
Apr. 9, 1991 |
| 4983840 |
Measuring system constituted by a radiation detection circuit, a reading circuit and a support such as a cryostat cold finger |
Jan. 8, 1991 |
| 4982274 |
Heat pipe type cooling apparatus for semiconductor |
Jan. 1, 1991 |
| 4971633 |
Photovoltaic cell assembly |
Nov. 20, 1990 |
| 4965660 |
Integrated circuit package having heat sink bonded with resinous adhesive |
Oct. 23, 1990 |
| 4945396 |
Semiconductor device having Darlington transistors |
Jul. 31, 1990 |
| 4943842 |
Semiconductor device with fuse function |
Jul. 24, 1990 |
| 4916518 |
Plastic encapsulated semiconductor device and method for manufacturing the same |
Apr. 10, 1990 |
| 4914551 |
Electronic package with heat spreader member |
Apr. 3, 1990 |
| 4910581 |
Internally molded isolated package |
Mar. 20, 1990 |
| 4901137 |
Electronic apparatus having semiconductor device |
Feb. 13, 1990 |
| 4876588 |
Semiconductor device having ceramic package incorporated with a heat-radiator |
Oct. 24, 1989 |
| 4858073 |
Metal substrated printed circuit |
Aug. 15, 1989 |
| 4853763 |
Mounting base pad means for semiconductor devices and method of preparing same |
Aug. 1, 1989 |
| 4849803 |
Molded resin semiconductor device |
Jul. 18, 1989 |
| 4849856 |
Electronic package with improved heat sink |
Jul. 18, 1989 |
| 4830678 |
Liquid-cooled sealed enclosure for concentrator solar cell and secondary lens |
May. 16, 1989 |
| 4827329 |
Semiconductor array |
May. 2, 1989 |
| 4825284 |
Semiconductor resin package structure |
Apr. 25, 1989 |
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