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Class Information
Number: 257/717
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer)
Description: Subject matter wherein an insulating element is used to physically separate a cooling means from an active solid-state electronic device or a housing therefor.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8710650 Semiconductor devices having through electrodes and methods of fabricating the same Apr. 29, 2014
8704362 Resin-diamagnetic material composite structure Apr. 22, 2014
8680673 Integrated heat pillar for hot region cooling in an integrated circuit Mar. 25, 2014
8681493 Heat shield module for substrate-like metrology device Mar. 25, 2014
8681500 Integrated circuit nanotube-based subsrate Mar. 25, 2014
8674509 Integrated circuit die assembly with heat spreader Mar. 18, 2014
8670239 Heat-release configuration, bracket for supporting heat-release plate and method of assembling heat-release configuration Mar. 11, 2014
8664759 Integrated circuit with heat conducting structures for localized thermal control Mar. 4, 2014
8659146 Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing Feb. 25, 2014
8659130 Power module and power module manufacturing method Feb. 25, 2014
8648462 Semiconductor power module Feb. 11, 2014
8648478 Flexible heat sink having ventilation ports and semiconductor package including the same Feb. 11, 2014
8643174 Calibration of temperature sensitive circuits with heater elements Feb. 4, 2014
8624388 Package carrier and manufacturing method thereof Jan. 7, 2014
8623707 Method of fabricating a semiconductor package with integrated substrate thermal slug Jan. 7, 2014
8618585 Semiconductor apparatus including cooling base with projections Dec. 31, 2013
8604606 Heat sink package Dec. 10, 2013
8592947 Thermally controlled refractory metal resistor Nov. 26, 2013
8592844 Light-emitting diode device Nov. 26, 2013
8592241 Method for packaging an electronic device assembly having a capped device interconnect Nov. 26, 2013
8587115 Heat dissipation substrate and manufacturing method thereof Nov. 19, 2013
8587116 Semiconductor module comprising an insert Nov. 19, 2013
8575756 Power package module with low and high power chips and method for fabricating the same Nov. 5, 2013
8563869 Circuit board and semiconductor module using this, production method for circuit board Oct. 22, 2013
8564120 Heat dissipation in temperature critical device areas of semiconductor devices by heat pipes connecting to the substrate backside Oct. 22, 2013
8551860 Semiconductor devices having through electrodes and methods of fabricating the same Oct. 8, 2013
8553417 Heat-radiating substrate and method of manufacturing the same Oct. 8, 2013
8546937 Semiconductor device Oct. 1, 2013
8531025 Thermal paste containment for semiconductor modules Sep. 10, 2013
8531024 Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace Sep. 10, 2013
8525317 Integrated chip package having intermediate substrate with capacitor Sep. 3, 2013
8519409 Light emitting diode components integrated with thermoelectric devices Aug. 27, 2013
8519506 Thermally conductive substrate for galvanic isolation Aug. 27, 2013
8519530 Method for treating nanofiber material and composition of nanofiber material Aug. 27, 2013
8507940 Heat dissipation by through silicon plugs Aug. 13, 2013
8508041 Bonding method for three-dimensional integrated circuit and three-dimensional integrated circuit thereof Aug. 13, 2013
8502385 Power semiconductor device Aug. 6, 2013
8503181 Semiconductor device with a zigzag radiator Aug. 6, 2013
8466486 Thermal management system for multiple heat source devices Jun. 18, 2013
8455998 Method and package for circuit chip packaging Jun. 4, 2013
8450837 Circuit device having an improved heat dissipitation, and the method of manufacturing the same May. 28, 2013
8441122 Semiconductor device having semiconductor chip and metal plate May. 14, 2013
8426962 Semiconductor device Apr. 23, 2013
8421219 Semiconductor component having adhesive squeeze-out prevention configuration and method of manufacturing the same Apr. 16, 2013
8421235 Semiconductor device with heat spreaders Apr. 16, 2013
8409930 Semiconductor device manufacturing method Apr. 2, 2013
8405214 Semiconductor package structure with common gold plated metal conductor on die and substrate Mar. 26, 2013
8384117 Light emitting device package and lighting system including the same Feb. 26, 2013
8368208 Semiconductor cooling apparatus Feb. 5, 2013
8351210 Electronic apparatus Jan. 8, 2013

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