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Class Information
Number: 257/717
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer)
Description: Subject matter wherein an insulating element is used to physically separate a cooling means from an active solid-state electronic device or a housing therefor.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615832 |
Physical quantity sensor, method for manufacturing the same, and resin film for bonding semiconductor chip and circuit chip |
Nov. 10, 2009 |
| 7612446 |
Structures to enhance cooling of computer memory modules |
Nov. 3, 2009 |
| 7612448 |
Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner |
Nov. 3, 2009 |
| 7608915 |
Heat dissipation semiconductor package |
Oct. 27, 2009 |
| 7608924 |
Liquid cooled power electronic circuit comprising stacked direct die cooled packages |
Oct. 27, 2009 |
| 7602060 |
Heat spreader in a flip chip package |
Oct. 13, 2009 |
| 7586190 |
Optoelectronic component and a module based thereon |
Sep. 8, 2009 |
| 7586964 |
Laser package and laser module |
Sep. 8, 2009 |
| 7579687 |
Circuit module turbulence enhancement systems and methods |
Aug. 25, 2009 |
| 7576428 |
Melting temperature adjustable metal thermal interface materials and application thereof |
Aug. 18, 2009 |
| 7569928 |
Assembly structure of electronic element and heat sink |
Aug. 4, 2009 |
| 7569930 |
Semiconductor module and radiator plate |
Aug. 4, 2009 |
| 7557442 |
Power semiconductor arrangement |
Jul. 7, 2009 |
| 7554168 |
Semiconductor acceleration sensor device |
Jun. 30, 2009 |
| 7554179 |
Multi-leadframe semiconductor package and method of manufacture |
Jun. 30, 2009 |
| 7550845 |
Ball grid array package with separated stiffener layer |
Jun. 23, 2009 |
| 7547582 |
Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies |
Jun. 16, 2009 |
| 7545034 |
Thermal energy removal structure and method |
Jun. 9, 2009 |
| 7538422 |
Integrated circuit micro-cooler having multi-layers of tubes of a CNT array |
May. 26, 2009 |
| 7538426 |
Cooling system of power semiconductor module |
May. 26, 2009 |
| 7535085 |
Semiconductor package having improved adhesiveness and ground bonding |
May. 19, 2009 |
| 7521789 |
Electrical assembly having heat sink protrusions |
Apr. 21, 2009 |
| 7521794 |
Intrinsic thermal enhancement for FBGA package |
Apr. 21, 2009 |
| 7518233 |
Sealing structure for multi-chip module |
Apr. 14, 2009 |
| 7518235 |
Method and structure to provide balanced mechanical loading of devices in compressively loaded environments |
Apr. 14, 2009 |
| 7515426 |
Heat dissipating device for an integrated circuit chip |
Apr. 7, 2009 |
| 7514785 |
Semiconductor device and manufacturing method thereof |
Apr. 7, 2009 |
| 7514784 |
Electronic circuit device and production method of the same |
Apr. 7, 2009 |
| 7511320 |
Semiconductor device and manufacturing method of the same |
Mar. 31, 2009 |
| 7504670 |
Sealing structure for mounting a semiconductor device to a substrate |
Mar. 17, 2009 |
| 7501699 |
Method and apparatus for electrical isolation of semiconductor device |
Mar. 10, 2009 |
| 7492041 |
Diamond-silicon hybrid integrated heat spreader |
Feb. 17, 2009 |
| 7476967 |
Composite carbon nanotube thermal interface device |
Jan. 13, 2009 |
| 7470983 |
Semiconductor device reducing warping due to heat production |
Dec. 30, 2008 |
| 7466016 |
Bent lead transistor |
Dec. 16, 2008 |
| 7459784 |
High capacity thin module system |
Dec. 2, 2008 |
| 7456052 |
Thermal intermediate apparatus, systems, and methods |
Nov. 25, 2008 |
| 7453145 |
Electronics unit |
Nov. 18, 2008 |
| 7449775 |
Integrated thermal solution for electronic packages with materials having mismatched coefficient of thermal expansion |
Nov. 11, 2008 |
| 7450174 |
Two-dimensional image detector with disturbance-blocking buffer |
Nov. 11, 2008 |
| 7446410 |
Circuit module with thermal casing systems |
Nov. 4, 2008 |
| 7443023 |
High capacity thin module system |
Oct. 28, 2008 |
| 7439614 |
Circuit device with dummy elements |
Oct. 21, 2008 |
| 7436060 |
Semiconductor package and process utilizing pre-formed mold cap and heatspreader assembly |
Oct. 14, 2008 |
| 7431071 |
Fluid circuit heat transfer device for plural heat sources |
Oct. 7, 2008 |
| 7427566 |
Method of making an electronic device cooling system |
Sep. 23, 2008 |
| 7417299 |
Direct connection multi-chip semiconductor element structure |
Aug. 26, 2008 |
| 7417312 |
Use of solder paste for heat dissipation |
Aug. 26, 2008 |
| 7400035 |
Semiconductor device having multilayer printed wiring board |
Jul. 15, 2008 |
| 7400506 |
Method and apparatus for cooling a memory device |
Jul. 15, 2008 |
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