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Class Information
Number: 257/717
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer)
Description: Subject matter wherein an insulating element is used to physically separate a cooling means from an active solid-state electronic device or a housing therefor.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7417299 |
Direct connection multi-chip semiconductor element structure |
Aug. 26, 2008 |
| 7417312 |
Use of solder paste for heat dissipation |
Aug. 26, 2008 |
| 7400035 |
Semiconductor device having multilayer printed wiring board |
Jul. 15, 2008 |
| 7400506 |
Method and apparatus for cooling a memory device |
Jul. 15, 2008 |
| 7397664 |
Heatspreader for single-device and multi-device modules |
Jul. 8, 2008 |
| 7382618 |
Heat dissipating apparatus for computer add-on cards |
Jun. 3, 2008 |
| 7365422 |
Package of leadframe with heatsinks |
Apr. 29, 2008 |
| 7365418 |
Multi-chip structure |
Apr. 29, 2008 |
| 7358605 |
Heat dissipation structure for electronic device |
Apr. 15, 2008 |
| 7359201 |
Heat-generating electronic part cover and cover mounting method |
Apr. 15, 2008 |
| 7355276 |
Thermally-enhanced circuit assembly |
Apr. 8, 2008 |
| 7348664 |
Semiconductor apparatus having a cooling apparatus that compressively engages a semiconductor device |
Mar. 25, 2008 |
| 7342306 |
High performance reworkable heatsink and packaging structure with solder release layer |
Mar. 11, 2008 |
| 7332807 |
Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same |
Feb. 19, 2008 |
| 7330355 |
Fixed pillar with heat loss |
Feb. 12, 2008 |
| 7327027 |
Thermal interface structure with integrated liquid cooling and methods |
Feb. 5, 2008 |
| 7323255 |
Method of producing base plate circuit board, base plate for circuit board, and circuit board using the base plate |
Jan. 29, 2008 |
| 7323776 |
Elevated heat dissipating device |
Jan. 29, 2008 |
| 7315080 |
Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreader |
Jan. 1, 2008 |
| 7312525 |
Thermally enhanced package for an integrated circuit |
Dec. 25, 2007 |
| RE39957 |
Method of making semiconductor package with heat spreader |
Dec. 25, 2007 |
| 7304372 |
Semiconductor package |
Dec. 4, 2007 |
| 7304381 |
Package and method for attaching an integrated heat spreader |
Dec. 4, 2007 |
| 7301232 |
Integrated circuit package with carbon nanotube array heat conductor |
Nov. 27, 2007 |
| 7288839 |
Apparatus and methods for cooling semiconductor integrated circuit package structures |
Oct. 30, 2007 |
| 7285851 |
Liquid immersion cooled multichip module |
Oct. 23, 2007 |
| 7274105 |
Thermal conductive electronics substrate and assembly |
Sep. 25, 2007 |
| 7268428 |
Thermal paste containment for semiconductor modules |
Sep. 11, 2007 |
| 7268429 |
Technique for manufacturing an overmolded electronic assembly |
Sep. 11, 2007 |
| 7256491 |
Thermal interconnect systems methods of production and uses thereof |
Aug. 14, 2007 |
| 7256492 |
Heat sink and display panel including heat sink |
Aug. 14, 2007 |
| 7245022 |
Semiconductor module with improved interposer structure and method for forming the same |
Jul. 17, 2007 |
| 7236367 |
Power electronics component |
Jun. 26, 2007 |
| 7235880 |
IC package with power and signal lines on opposing sides |
Jun. 26, 2007 |
| 7235876 |
Semiconductor device having metallic plate with groove |
Jun. 26, 2007 |
| 7221570 |
Heat dissipating device for an integrated circuit chip |
May. 22, 2007 |
| 7211890 |
Integrating thermoelectric elements into wafer for heat extraction |
May. 1, 2007 |
| 7211891 |
Electronic heat pump device, laser component, optical pickup and electronic equipment |
May. 1, 2007 |
| 7205654 |
Programmed material consolidation methods for fabricating heat sinks |
Apr. 17, 2007 |
| 7202559 |
Method of assembling a ball grid array package with patterned stiffener layer |
Apr. 10, 2007 |
| 7200006 |
Compliant thermal interface for electronic equipment |
Apr. 3, 2007 |
| 7196426 |
Multilayered substrate for semiconductor device |
Mar. 27, 2007 |
| 7193316 |
Integrated circuit coolant microchannel with movable portion |
Mar. 20, 2007 |
| 7193328 |
Semiconductor device |
Mar. 20, 2007 |
| 7183642 |
Electronic package with thermally-enhanced lid |
Feb. 27, 2007 |
| 7166912 |
Isolated thermal interface |
Jan. 23, 2007 |
| 7166914 |
Semiconductor package with heat sink |
Jan. 23, 2007 |
| 7151671 |
Power supply |
Dec. 19, 2006 |
| 7145225 |
Interposer configured to reduce the profiles of semiconductor device assemblies and packages including the same and methods |
Dec. 5, 2006 |
| 7142426 |
Heat dissipating device and method for manufacturing it |
Nov. 28, 2006 |
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