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Class Information
Number: 257/716
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > Liquid coolant > Cryogenic liquid coolant
Description: Subject matter wherein the cooling means uses a liquid to maintain device temperatures at or below 100 degrees Kelvin.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7431071 |
Fluid circuit heat transfer device for plural heat sources |
Oct. 7, 2008 |
| 7369377 |
Snubbers for low temperature power electronics |
May. 6, 2008 |
| 7232710 |
Method of making cascaded die mountings with springs-loaded contact-bond options |
Jun. 19, 2007 |
| 7224059 |
Method and apparatus for thermo-electric cooling |
May. 29, 2007 |
| 7211891 |
Electronic heat pump device, laser component, optical pickup and electronic equipment |
May. 1, 2007 |
| 7193316 |
Integrated circuit coolant microchannel with movable portion |
Mar. 20, 2007 |
| 7121333 |
Radiator sheet |
Oct. 17, 2006 |
| 7091604 |
Three dimensional integrated circuits |
Aug. 15, 2006 |
| 7084495 |
Electroosmotic pumps using porous frits for cooling integrated circuit stacks |
Aug. 1, 2006 |
| 7078803 |
Integrated circuit heat dissipation system |
Jul. 18, 2006 |
| 7071553 |
Package structure compatible with cooling system |
Jul. 4, 2006 |
| 7068510 |
Dissipating heat reliably in computer systems |
Jun. 27, 2006 |
| 6992382 |
Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon |
Jan. 31, 2006 |
| 6963131 |
Integrated circuit system with a latent heat storage module |
Nov. 8, 2005 |
| 6930385 |
Cascaded die mountings with spring-loaded contact-bond options |
Aug. 16, 2005 |
| 6883594 |
Cooling system for electronics with improved thermal interface |
Apr. 26, 2005 |
| 6850549 |
Light source device for pumping solid-state laser medium |
Feb. 1, 2005 |
| 6793009 |
CTE-matched heat pipe |
Sep. 21, 2004 |
| 6789610 |
High performance cooling device with vapor chamber |
Sep. 14, 2004 |
| 6744136 |
Sealed liquid cooled electronic device |
Jun. 1, 2004 |
| 6742574 |
Cooling apparatus |
Jun. 1, 2004 |
| 6714413 |
Compact thermosiphon with enhanced condenser for electronics cooling |
Mar. 30, 2004 |
| 6624523 |
Structure and package of a heat spreader substrate |
Sep. 23, 2003 |
| 6621071 |
Microelectronic system with integral cryocooler, and its fabrication and use |
Sep. 16, 2003 |
| 6609560 |
Flat evaporator |
Aug. 26, 2003 |
| 6588498 |
Thermosiphon for electronics cooling with high performance boiling and condensing surfaces |
Jul. 8, 2003 |
| 6550531 |
Vapor chamber active heat sink |
Apr. 22, 2003 |
| 6495913 |
Semiconductor clamped-stack assembly |
Dec. 17, 2002 |
| 6408937 |
Active cold plate/heat sink |
Jun. 25, 2002 |
| 6137169 |
Heat reduction system for transistor assemblies |
Oct. 24, 2000 |
| 6121995 |
Cooling arrangement for electro-optical character generator |
Sep. 19, 2000 |
| 6091746 |
Assembly of cooled laser diode arrays |
Jul. 18, 2000 |
| 6031286 |
Semiconductor structures containing a micro pipe system therein |
Feb. 29, 2000 |
| 6018192 |
Electronic device with a thermal control capability |
Jan. 25, 2000 |
| 5965937 |
Thermal interface attach mechanism for electrical packages |
Oct. 12, 1999 |
| 5818097 |
Temperature controlling cryogenic package system |
Oct. 6, 1998 |
| 5815370 |
Fluidic feedback-controlled liquid cooling module |
Sep. 29, 1998 |
| 5773875 |
High performance, low thermal loss, bi-temperature superconductive device |
Jun. 30, 1998 |
| 5740018 |
Environmentally controlled circuit pack and cabinet |
Apr. 14, 1998 |
| 5697434 |
Device having a reduced parasitic thermal load for terminating thermal conduit |
Dec. 16, 1997 |
| 5596228 |
Apparatus for cooling charge coupled device imaging systems |
Jan. 21, 1997 |
| 5543662 |
Low heat loss and secure chip carrier for cryogenic cooling |
Aug. 6, 1996 |
| 5455458 |
Phase change cooling of semiconductor power modules |
Oct. 3, 1995 |
| 5449952 |
Superconducting apparatus having dew-preventable Peltier-effect element integrated therewith |
Sep. 12, 1995 |
| 5390077 |
Integrated circuit cooling device having internal baffle |
Feb. 14, 1995 |
| 5323293 |
Arrangement for placing central processors and memory in a cryo cooled chamber |
Jun. 21, 1994 |
| 5310440 |
Convection transfer system |
May. 10, 1994 |
| 5212626 |
Electronic packaging and cooling system using superconductors for power distribution |
May. 18, 1993 |
| 5166777 |
Cooling apparatus for superconducting devices using Peltier effect cooling element |
Nov. 24, 1992 |
| 5166776 |
Hybrid vapor cooled power lead for cryostat |
Nov. 24, 1992 |
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