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Class Information
Number: 257/715
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > Liquid coolant > Boiling (evaporative) liquid
Description: Subject matter wherein the cooling means involves boiling a liquid to provide evaporative cooling.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7626261 |
Wafer stacked package having vertical heat emission path and method of fabricating the same |
Dec. 1, 2009 |
| 7609520 |
Heat spreader with vapor chamber defined therein |
Oct. 27, 2009 |
| 7599414 |
Laser device |
Oct. 6, 2009 |
| 7593232 |
Electronic apparatus and circuit board unit |
Sep. 22, 2009 |
| 7592697 |
Microelectronic package and method of cooling same |
Sep. 22, 2009 |
| 7580262 |
Heat dissipation assembly for graphics card and blade server using the same |
Aug. 25, 2009 |
| 7576986 |
Thermal dissipating device |
Aug. 18, 2009 |
| 7573714 |
Method and apparatus for dissipating heat in a computer system |
Aug. 11, 2009 |
| 7565925 |
Heat dissipation device |
Jul. 28, 2009 |
| 7556086 |
Orientation-independent thermosyphon heat spreader |
Jul. 7, 2009 |
| 7558065 |
Air guide with heat pipe and heat sink and electronic apparatus equipped with the same |
Jul. 7, 2009 |
| 7551444 |
Method and computer system with anti-tamper capability and thermal packaging structure for implementing enhanced heat removal from processor circuitry |
Jun. 23, 2009 |
| 7551443 |
Heat-dissipating module connecting to a plurality of heat-generating components and related device thereof |
Jun. 23, 2009 |
| 7548428 |
Computer device heat dissipation system |
Jun. 16, 2009 |
| 7548426 |
Heat dissipation device with heat pipes |
Jun. 16, 2009 |
| 7545644 |
Nano-patch thermal management devices, methods, & systems |
Jun. 9, 2009 |
| 7540318 |
Heat sink |
Jun. 2, 2009 |
| 7538426 |
Cooling system of power semiconductor module |
May. 26, 2009 |
| 7535712 |
Electronic apparatus |
May. 19, 2009 |
| 7515417 |
Apparatus for cooling computer parts and method of manufacturing the same |
Apr. 7, 2009 |
| 7515423 |
Heat dissipation device |
Apr. 7, 2009 |
| 7511947 |
Circuit board with a perforated structure for disposing a heat pipe |
Mar. 31, 2009 |
| 7504670 |
Sealing structure for mounting a semiconductor device to a substrate |
Mar. 17, 2009 |
| 7502228 |
Heat transfer mechanism, heat dissipation system, and communication apparatus |
Mar. 10, 2009 |
| 7480143 |
Variable-gap thermal-interface device |
Jan. 20, 2009 |
| 7450386 |
Phase-separated evaporator, blade-thru condenser and heat dissipation system thereof |
Nov. 11, 2008 |
| 7431071 |
Fluid circuit heat transfer device for plural heat sources |
Oct. 7, 2008 |
| 7429791 |
Semiconductor device in a resin sealed package with a radiating plate and manufacturing method thereof |
Sep. 30, 2008 |
| 7426112 |
Heat dissipating module |
Sep. 16, 2008 |
| 7420810 |
Base heat spreader with fins |
Sep. 2, 2008 |
| 7411790 |
Heat sink with built-in heat pipes for semiconductor packages |
Aug. 12, 2008 |
| 7391613 |
Memory module assembly including a clamp for mounting heat sinks thereon |
Jun. 24, 2008 |
| 7388747 |
Heat plate fixing structure |
Jun. 17, 2008 |
| 7385821 |
Cooling method for ICS |
Jun. 10, 2008 |
| 7369410 |
Apparatuses for dissipating heat from semiconductor devices |
May. 6, 2008 |
| 7353861 |
Transpiration cooled heat sink and a self contained coolant supply for same |
Apr. 8, 2008 |
| 7353860 |
Heat dissipating device with enhanced boiling/condensation structure |
Apr. 8, 2008 |
| 7342785 |
Cooling device incorporating boiling chamber |
Mar. 11, 2008 |
| 7339787 |
Heat sink module for dissipating heat from a heat source on a motherboard |
Mar. 4, 2008 |
| 7336487 |
Cold plate and mating manifold plate for IC device cooling system enabling the shipment of cooling system pre-charged with liquid coolant |
Feb. 26, 2008 |
| 7331377 |
Diamond foam spray cooling system |
Feb. 19, 2008 |
| 7333333 |
Locking device for heat sink |
Feb. 19, 2008 |
| 7327572 |
Heat dissipating device with enhanced boiling/condensation structure |
Feb. 5, 2008 |
| 7327576 |
Heat dissipation device |
Feb. 5, 2008 |
| 7324341 |
Electronics assembly and heat pipe device |
Jan. 29, 2008 |
| 7319588 |
Heat dissipation device |
Jan. 15, 2008 |
| 7312987 |
Adaptable thin plate modular heat exchanger blade for cooling electronic equipment |
Dec. 25, 2007 |
| 7304846 |
Heatsink device of video graphics array and chipset |
Dec. 4, 2007 |
| 7304380 |
Integrated circuit cooling and insulating device and method |
Dec. 4, 2007 |
| 7295441 |
Heat dissipating type printed circuit board and structure thereof for conducting heat with heap pipe |
Nov. 13, 2007 |
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