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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Physics
Class Information
Number: 257/715
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > Liquid coolant > Boiling (evaporative) liquid
Description: Subject matter wherein the cooling means involves boiling a liquid to provide evaporative cooling.


Patents under this class:
1 2 3 4 5 6 7 8 9 10

Patent Number Title Of Patent Date Issued
7450386 Phase-separated evaporator, blade-thru condenser and heat dissipation system thereof Nov. 11, 2008
7431071 Fluid circuit heat transfer device for plural heat sources Oct. 7, 2008
7429791 Semiconductor device in a resin sealed package with a radiating plate and manufacturing method thereof Sep. 30, 2008
7426112 Heat dissipating module Sep. 16, 2008
7420810 Base heat spreader with fins Sep. 2, 2008
7411790 Heat sink with built-in heat pipes for semiconductor packages Aug. 12, 2008
7391613 Memory module assembly including a clamp for mounting heat sinks thereon Jun. 24, 2008
7388747 Heat plate fixing structure Jun. 17, 2008
7385821 Cooling method for ICS Jun. 10, 2008
7369410 Apparatuses for dissipating heat from semiconductor devices May. 6, 2008
7353860 Heat dissipating device with enhanced boiling/condensation structure Apr. 8, 2008
7353861 Transpiration cooled heat sink and a self contained coolant supply for same Apr. 8, 2008
7342785 Cooling device incorporating boiling chamber Mar. 11, 2008
7339787 Heat sink module for dissipating heat from a heat source on a motherboard Mar. 4, 2008
7336487 Cold plate and mating manifold plate for IC device cooling system enabling the shipment of cooling system pre-charged with liquid coolant Feb. 26, 2008
7333333 Locking device for heat sink Feb. 19, 2008
7331377 Diamond foam spray cooling system Feb. 19, 2008
7327572 Heat dissipating device with enhanced boiling/condensation structure Feb. 5, 2008
7327576 Heat dissipation device Feb. 5, 2008
7324341 Electronics assembly and heat pipe device Jan. 29, 2008
7319588 Heat dissipation device Jan. 15, 2008
7312987 Adaptable thin plate modular heat exchanger blade for cooling electronic equipment Dec. 25, 2007
7304380 Integrated circuit cooling and insulating device and method Dec. 4, 2007
7304846 Heatsink device of video graphics array and chipset Dec. 4, 2007
7295441 Heat dissipating type printed circuit board and structure thereof for conducting heat with heap pipe Nov. 13, 2007
7284874 LED backlight unit including cooling structure Oct. 23, 2007
7278470 Heat dissipation device Oct. 9, 2007
7272002 Auxiliary cooling methods and systems for electrical device housings Sep. 18, 2007
7269013 Heat dissipation device having phase-changeable medium therein Sep. 11, 2007
7257000 Thermally enhanced pressure regulation of electronics cooling system Aug. 14, 2007
7245010 System and device including a barrier layer Jul. 17, 2007
7245494 Thermal structure for electric devices Jul. 17, 2007
7232710 Method of making cascaded die mountings with springs-loaded contact-bond options Jun. 19, 2007
7227752 Heat dissipation device Jun. 5, 2007
7227753 Method and apparatus for cooling heat-generating structure Jun. 5, 2007
7218519 Thermal management arrangement with a low heat flux channel flow coupled to high heat flux channels May. 15, 2007
7213338 Cooler, electronic apparatus, and method for fabricating cooler May. 8, 2007
7211891 Electronic heat pump device, laser component, optical pickup and electronic equipment May. 1, 2007
7205654 Programmed material consolidation methods for fabricating heat sinks Apr. 17, 2007
7198096 Stacked low profile cooling system and method for making same Apr. 3, 2007
7190582 Cooling device, electronic equipment device, and method of manufacturing cooling device Mar. 13, 2007
7156158 Heat pipe type cooler Jan. 2, 2007
7150312 Stacked low profile cooling system and method for making same Dec. 19, 2006
7151668 Memory heat sink Dec. 19, 2006
7145775 Chassis conducted cooling thermal dissipation apparatus for servers Dec. 5, 2006
7142422 Heat dissipation device Nov. 28, 2006
7139172 Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages Nov. 21, 2006
7131486 Electroosmotic microchannel cooling system Nov. 7, 2006
7131487 Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers Nov. 7, 2006
7128131 Heat sink for electronic devices and heat dissipating method Oct. 31, 2006

1 2 3 4 5 6 7 8 9 10


 
 
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