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Class Information
Number: 257/714
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > Liquid coolant
Description: Subject matter wherein the means provided for cooling the housing or its contents is a liquid.










Sub-classes under this class:

Class Number Class Name Patents
257/715 Boiling (evaporative) liquid 607
257/716 Cryogenic liquid coolant 93


Patents under this class:

Patent Number Title Of Patent Date Issued
8704352 Semiconductor device having a liquid cooling module Apr. 22, 2014
8684564 Light-emitting diode illumination apparatuses Apr. 1, 2014
8681497 Board coolant jacket jig system and method of separating board coolant jacket Mar. 25, 2014
8665592 Heat management using power management information Mar. 4, 2014
8659903 Heat switch array for thermal hot spot cooling Feb. 25, 2014
8659898 Integrated circuit stack Feb. 25, 2014
8659130 Power module and power module manufacturing method Feb. 25, 2014
8655501 Cooling assist module Feb. 18, 2014
8654527 Thyristor valve module Feb. 18, 2014
8643173 Cooling apparatuses and power electronics modules with single-phase and two-phase surface enhancement features Feb. 4, 2014
8629554 Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly Jan. 14, 2014
8604608 Semiconductor module Dec. 10, 2013
8598702 Semiconductor package Dec. 3, 2013
8593812 Heat exchanger, semiconductor device, method for manufacturing the heat exchanger, and method for manufacturing the semiconductor device Nov. 26, 2013
8592971 Direct semiconductor contact ebullient cooling package Nov. 26, 2013
8582291 Power conversion apparatus Nov. 12, 2013
8581392 Silicon based microchannel cooling and electrical package Nov. 12, 2013
8564953 Semiconductor power module, inverter/converter including the same, and method of manufacturing a cooling jacket for semiconductor power module Oct. 22, 2013
8564120 Heat dissipation in temperature critical device areas of semiconductor devices by heat pipes connecting to the substrate backside Oct. 22, 2013
8563365 Air-gap C4 fluidic I/O interconnects and methods of fabricating same Oct. 22, 2013
8558375 Semiconductor package cooled by grounded cooler Oct. 15, 2013
8558374 Electronic package with thermal interposer and method of making same Oct. 15, 2013
8546930 3-D ICs equipped with double sided power, coolant, and data features Oct. 1, 2013
8537550 Wiring board and power conversion device Sep. 17, 2013
8536698 Semiconductor device Sep. 17, 2013
8531839 Liquid cooled data center with alternating coolant supply lines Sep. 10, 2013
8508030 LED module Aug. 13, 2013
8498841 Mapped thermal electric cooling Jul. 30, 2013
8493736 Device for cooling integrated circuits Jul. 23, 2013
8490679 Condenser fin structures facilitating vapor condensation cooling of coolant Jul. 23, 2013
8487427 Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly Jul. 16, 2013
8487416 Coaxial power module Jul. 16, 2013
8486765 Structure and process for electrical interconnect and thermal management Jul. 16, 2013
8471380 Fluid cooled encapsulated microelectronic package Jun. 25, 2013
8427833 Thermal power plane for integrated circuits Apr. 23, 2013
8427091 Drive with heat dissipation and energy-saving function Apr. 23, 2013
8421220 Silicon based microchannel cooling and electrical package Apr. 16, 2013
8416572 System and method for cooling information handling resources Apr. 9, 2013
8415207 Module including a sintered joint bonding a semiconductor chip to a copper surface Apr. 9, 2013
8411440 Cooled universal hardware platform Apr. 2, 2013
8410602 Cooling system for semiconductor devices Apr. 2, 2013
8405204 Semiconductor package with package main body cooling structure using coolant, and semiconductor package assembly with the semiconductor package and coolant circulating structure Mar. 26, 2013
8399984 Semiconductor package Mar. 19, 2013
8395897 Electrical power component attached to chassis of an electrical power apparatus Mar. 12, 2013
8391011 Cooling device Mar. 5, 2013
8391008 Power electronics modules and power electronics module assemblies Mar. 5, 2013
8391006 Water jacket for cooling an electronic device on a board Mar. 5, 2013
8384212 Semiconductor equipment and method of manufacturing the same Feb. 26, 2013
8369091 Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack Feb. 5, 2013
8369090 Cooled electronic system Feb. 5, 2013











 
 
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