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Class Information
Number: 257/714
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > Liquid coolant
Description: Subject matter wherein the means provided for cooling the housing or its contents is a liquid.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7460369 |
Counterflow microchannel cooler for integrated circuits |
Dec. 2, 2008 |
| 7449776 |
Cooling devices that use nanowires |
Nov. 11, 2008 |
| 7439617 |
Capillary underflow integral heat spreader |
Oct. 21, 2008 |
| 7440278 |
Water-cooling heat dissipator |
Oct. 21, 2008 |
| 7431071 |
Fluid circuit heat transfer device for plural heat sources |
Oct. 7, 2008 |
| 7432592 |
Integrated micro-channels for 3D through silicon architectures |
Oct. 7, 2008 |
| 7430119 |
Impeller and aligned cold plate |
Sep. 30, 2008 |
| 7423874 |
Magneto-hydrodynamic heat sink |
Sep. 9, 2008 |
| 7420810 |
Base heat spreader with fins |
Sep. 2, 2008 |
| 7414843 |
Method and apparatus for a layered thermal management arrangement |
Aug. 19, 2008 |
| 7414844 |
Liquid cooled heat sink with cold plate retention mechanism |
Aug. 19, 2008 |
| 7411290 |
Integrated circuit chip and method for cooling an integrated circuit chip |
Aug. 12, 2008 |
| 7400502 |
Connector heat transfer unit |
Jul. 15, 2008 |
| 7388746 |
Heatsink assembly |
Jun. 17, 2008 |
| 7385821 |
Cooling method for ICS |
Jun. 10, 2008 |
| 7375962 |
Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus |
May. 20, 2008 |
| 7372148 |
Semiconductor chip having coolant path, semiconductor package and package cooling system using the same |
May. 13, 2008 |
| 7369377 |
Snubbers for low temperature power electronics |
May. 6, 2008 |
| 7369410 |
Apparatuses for dissipating heat from semiconductor devices |
May. 6, 2008 |
| 7365980 |
Micropin heat exchanger |
Apr. 29, 2008 |
| 7360583 |
Integrated liquid cooling system for electronic components |
Apr. 22, 2008 |
| 7362574 |
Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus |
Apr. 22, 2008 |
| 7359198 |
System and method for inducing turbulence in fluid for dissipating thermal energy of electronic circuitry |
Apr. 15, 2008 |
| 7355277 |
Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package |
Apr. 8, 2008 |
| 7353859 |
Heat sink with microchannel cooling for power devices |
Apr. 8, 2008 |
| 7348665 |
Liquid metal thermal interface for an integrated circuit device |
Mar. 25, 2008 |
| 7342785 |
Cooling device incorporating boiling chamber |
Mar. 11, 2008 |
| 7339787 |
Heat sink module for dissipating heat from a heat source on a motherboard |
Mar. 4, 2008 |
| 7335984 |
Microfluidics chips and methods of using same |
Feb. 26, 2008 |
| 7336487 |
Cold plate and mating manifold plate for IC device cooling system enabling the shipment of cooling system pre-charged with liquid coolant |
Feb. 26, 2008 |
| 7333333 |
Locking device for heat sink |
Feb. 19, 2008 |
| 7333331 |
Power unit device and power converter device |
Feb. 19, 2008 |
| 7331378 |
Microchannel heat sink |
Feb. 19, 2008 |
| 7331377 |
Diamond foam spray cooling system |
Feb. 19, 2008 |
| 7329030 |
Assembling structure for LED road lamp and heat dissipating module |
Feb. 12, 2008 |
| 7327027 |
Thermal interface structure with integrated liquid cooling and methods |
Feb. 5, 2008 |
| 7324341 |
Electronics assembly and heat pipe device |
Jan. 29, 2008 |
| 7316263 |
Cold plate |
Jan. 8, 2008 |
| 7317615 |
Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachment |
Jan. 8, 2008 |
| 7309453 |
Coolant capable of enhancing corrosion inhibition, system containing same, and method of manufacturing same |
Dec. 18, 2007 |
| 7309145 |
Light source apparatus and projection display apparatus |
Dec. 18, 2007 |
| 7307841 |
Electronic package and method of cooling electronics |
Dec. 11, 2007 |
| 7304379 |
Semiconductor device with pipe for passing refrigerant liquid |
Dec. 4, 2007 |
| 7301770 |
Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins |
Nov. 27, 2007 |
| 7301771 |
Heat-receiving apparatus and electronic equipment |
Nov. 27, 2007 |
| 7301772 |
Three dimensional packaging and cooling of mixed signal, mixed power density electronic modules |
Nov. 27, 2007 |
| 7294926 |
Chip cooling system |
Nov. 13, 2007 |
| 7295436 |
Cooling system for computer components |
Nov. 13, 2007 |
| 7295441 |
Heat dissipating type printed circuit board and structure thereof for conducting heat with heap pipe |
Nov. 13, 2007 |
| 7292437 |
Heat dissipation assembly for computing devices |
Nov. 6, 2007 |
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