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Class Information
Number: 257/714
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > Liquid coolant
Description: Subject matter wherein the means provided for cooling the housing or its contents is a liquid.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7616443 |
Cooling device for electrical power units of electrically operated vehicles |
Nov. 10, 2009 |
| 7614247 |
Cooling arrangement |
Nov. 10, 2009 |
| 7612447 |
Semiconductor devices with layers having extended perimeters for improved cooling and methods for cooling semiconductor devices |
Nov. 3, 2009 |
| 7612448 |
Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner |
Nov. 3, 2009 |
| 7608924 |
Liquid cooled power electronic circuit comprising stacked direct die cooled packages |
Oct. 27, 2009 |
| 7599414 |
Laser device |
Oct. 6, 2009 |
| 7595987 |
Heat dissipation assembly for computing devices |
Sep. 29, 2009 |
| 7592697 |
Microelectronic package and method of cooling same |
Sep. 22, 2009 |
| 7593232 |
Electronic apparatus and circuit board unit |
Sep. 22, 2009 |
| 7592695 |
Compound heat sink |
Sep. 22, 2009 |
| 7586126 |
Light emitting diode lighting module with improved heat dissipation structure |
Sep. 8, 2009 |
| 7586747 |
Scalable subsystem architecture having integrated cooling channels |
Sep. 8, 2009 |
| 7582962 |
Heat dissipation device |
Sep. 1, 2009 |
| 7580261 |
Semiconductor cooling system for use in electric or hybrid vehicle |
Aug. 25, 2009 |
| 7560813 |
Chip-based thermo-stack |
Jul. 14, 2009 |
| 7561425 |
Encapsulated multi-phase electronics heat-sink |
Jul. 14, 2009 |
| 7561429 |
Power converter unit |
Jul. 14, 2009 |
| 7551441 |
Heat dissipation assembly for computing devices |
Jun. 23, 2009 |
| 7551439 |
Fluid cooled electronic assembly |
Jun. 23, 2009 |
| 7551435 |
Heat-absorbing member, cooling device, and electronic apparatus |
Jun. 23, 2009 |
| 7548424 |
Distributed transmit/receive integrated microwave module chip level cooling system |
Jun. 16, 2009 |
| 7548425 |
Heat-Receiving apparatus and electronic equipment |
Jun. 16, 2009 |
| 7545644 |
Nano-patch thermal management devices, methods, & systems |
Jun. 9, 2009 |
| 7545648 |
Cooling structure using rigid movable elements |
Jun. 9, 2009 |
| 7542291 |
Electronic circuit configuration having a printed circuit board thermally coupled to a heat sink |
Jun. 2, 2009 |
| 7537047 |
Liquid-cooling heat sink |
May. 26, 2009 |
| 7537048 |
Integrated liquid cooling system for electronic components |
May. 26, 2009 |
| 7538425 |
Power semiconductor package having integral fluid cooling |
May. 26, 2009 |
| 7538426 |
Cooling system of power semiconductor module |
May. 26, 2009 |
| 7538427 |
Microchannel structure and manufacturing method therefor, light source device, and projector |
May. 26, 2009 |
| 7539016 |
Electromagnetically-actuated micropump for liquid metal alloy enclosed in cavity with flexible sidewalls |
May. 26, 2009 |
| 7528483 |
Cooling system for a semiconductor device and method of fabricating same |
May. 5, 2009 |
| 7518867 |
Electronic device cooling device and electronic device cooling method |
Apr. 14, 2009 |
| 7515415 |
Embedded microchannel cooling package for a central processor unit |
Apr. 7, 2009 |
| 7515416 |
Structures for holding cards incorporating electronic and/or micromachined components |
Apr. 7, 2009 |
| 7511957 |
Methods for fabricating a cooled electronic module employing a thermally conductive return manifold structure sealed to the periphery of a surface to be cooled |
Mar. 31, 2009 |
| 7508676 |
Cold plate structure and method for cooling planar arrays of processors during assembly and test allowing for single module site reworkability |
Mar. 24, 2009 |
| 7505268 |
Electronic device package with an integrated evaporator |
Mar. 17, 2009 |
| 7505267 |
Cooling system for an electronic box |
Mar. 17, 2009 |
| 7504720 |
Semiconductor unit, and power conversion system and on-vehicle electrical system using the same |
Mar. 17, 2009 |
| 7504670 |
Sealing structure for mounting a semiconductor device to a substrate |
Mar. 17, 2009 |
| 7501699 |
Method and apparatus for electrical isolation of semiconductor device |
Mar. 10, 2009 |
| 7502228 |
Heat transfer mechanism, heat dissipation system, and communication apparatus |
Mar. 10, 2009 |
| 7499279 |
Cold plate stability |
Mar. 3, 2009 |
| 7499278 |
Method and apparatus for dissipating heat from an electronic device |
Mar. 3, 2009 |
| 7498672 |
Micropin heat exchanger |
Mar. 3, 2009 |
| 7495916 |
Low cost cold plate with film adhesive |
Feb. 24, 2009 |
| 7492595 |
Semiconductor cooling device and stack of semiconductor cooling devices |
Feb. 17, 2009 |
| 7486515 |
Fluid circulator for fluid cooled electronic device |
Feb. 3, 2009 |
| 7485957 |
Fluid cooled encapsulated microelectronic package |
Feb. 3, 2009 |
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