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Class Information
Number: 257/713
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > For integrated circuit
Description: Subject matter wherein the solid-state electronic device for which cooling means is provided is an integrated circuit, which is a semiconductor substrate which contains a plurality of active solid-state electronic devices.










Patents under this class:

Patent Number Title Of Patent Date Issued
8710640 Integrated circuit packaging system with heat slug and method of manufacture thereof Apr. 29, 2014
8704362 Resin-diamagnetic material composite structure Apr. 22, 2014
8703540 Chip-scale semiconductor die packaging method Apr. 22, 2014
8692365 Integrated circuit packaging system with thermal dispersal structures and method of manufacture thereof Apr. 8, 2014
8686557 Illumination device comprising a light-emitting diode Apr. 1, 2014
8686428 Semiconductor device and structure Apr. 1, 2014
8681500 Integrated circuit nanotube-based subsrate Mar. 25, 2014
8674510 Three-dimensional integrated circuit structure having improved power and thermal management Mar. 18, 2014
8664759 Integrated circuit with heat conducting structures for localized thermal control Mar. 4, 2014
8664540 Interposer testing using dummy connections Mar. 4, 2014
8659900 Circuit board including a heat radiating plate Feb. 25, 2014
8659147 Power semiconductor circuit device and method for manufacturing the same Feb. 25, 2014
8659130 Power module and power module manufacturing method Feb. 25, 2014
8653626 Package structures including a capacitor and methods of forming the same Feb. 18, 2014
8648478 Flexible heat sink having ventilation ports and semiconductor package including the same Feb. 11, 2014
8648462 Semiconductor power module Feb. 11, 2014
8648461 Semiconductor device Feb. 11, 2014
8643174 Calibration of temperature sensitive circuits with heater elements Feb. 4, 2014
8643172 Heat spreader for center gate molding Feb. 4, 2014
8643088 Semiconductor device and method for forming the same Feb. 4, 2014
8642444 Method of manufacturing bonded substrate, bonded substrate, method of manufacturing solid-state imaging apparatus, solid-state imaging apparatus, and camera Feb. 4, 2014
8637980 Adhesive applications using alkali silicate glass for electronics Jan. 28, 2014
8634195 Heatsink with substance embedded to suppress electromagnetic interference Jan. 21, 2014
8629554 Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly Jan. 14, 2014
8629553 3D integrated circuit device fabrication with precisely controllable substrate removal Jan. 14, 2014
8624389 Light emitting diode module Jan. 7, 2014
8624388 Package carrier and manufacturing method thereof Jan. 7, 2014
8624323 BEOL structures incorporating active devices and mechanical strength Jan. 7, 2014
8623707 Method of fabricating a semiconductor package with integrated substrate thermal slug Jan. 7, 2014
8618653 Integrated circuit package system with wafer scale heat slug Dec. 31, 2013
8617927 Method of mounting electronic chips Dec. 31, 2013
8614505 Semiconductor device with heat spreader Dec. 24, 2013
8611090 Electronic module with laterally-conducting heat distributor layer Dec. 17, 2013
8610263 Semiconductor device module Dec. 17, 2013
8604608 Semiconductor module Dec. 10, 2013
8604607 Semiconductor module and semiconductor device Dec. 10, 2013
8604603 Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers Dec. 10, 2013
8598702 Semiconductor package Dec. 3, 2013
8592974 Package configurations for low EMI circuits Nov. 26, 2013
8592972 Thermally conductive device with a thermal interface material Nov. 26, 2013
8592971 Direct semiconductor contact ebullient cooling package Nov. 26, 2013
8592851 Optical semiconductor device and circuit Nov. 26, 2013
8587115 Heat dissipation substrate and manufacturing method thereof Nov. 19, 2013
8587069 Modified electrostatic discharge arrangement within a single multiple-integrated circuit package Nov. 19, 2013
8587016 Light emitting device package having light emitting device on inclined side surface and lighting system including the same Nov. 19, 2013
8586418 Method for the production of an electronic component and electronic component produced according to this method Nov. 19, 2013
8581392 Silicon based microchannel cooling and electrical package Nov. 12, 2013
8576567 Semiconductor device and display apparatus Nov. 5, 2013
8575756 Power package module with low and high power chips and method for fabricating the same Nov. 5, 2013
8575746 Chip on flexible printed circuit type semiconductor package Nov. 5, 2013











 
 
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