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Class Information
Number: 257/713
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > For integrated circuit
Description: Subject matter wherein the solid-state electronic device for which cooling means is provided is an integrated circuit, which is a semiconductor substrate which contains a plurality of active solid-state electronic devices.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459784 |
High capacity thin module system |
Dec. 2, 2008 |
| 7456052 |
Thermal intermediate apparatus, systems, and methods |
Nov. 25, 2008 |
| 7453145 |
Electronics unit |
Nov. 18, 2008 |
| 7446412 |
Heat sink design using clad metal |
Nov. 4, 2008 |
| 7446410 |
Circuit module with thermal casing systems |
Nov. 4, 2008 |
| 7443025 |
Thermally improved placement of power-dissipating components onto a circuit board |
Oct. 28, 2008 |
| 7443023 |
High capacity thin module system |
Oct. 28, 2008 |
| 7439618 |
Integrated circuit thermal management method and apparatus |
Oct. 21, 2008 |
| 7439614 |
Circuit device with dummy elements |
Oct. 21, 2008 |
| 7436669 |
3D multi-layer heat conduction diffusion plate |
Oct. 14, 2008 |
| 7436059 |
Thermoelectric cooling device arrays |
Oct. 14, 2008 |
| 7432532 |
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat |
Oct. 7, 2008 |
| 7429791 |
Semiconductor device in a resin sealed package with a radiating plate and manufacturing method thereof |
Sep. 30, 2008 |
| 7423881 |
Arrangement and method for cooling a power semiconductor |
Sep. 9, 2008 |
| 7423341 |
Plastic overmolded packages with mechanically decoupled lid attach attachment |
Sep. 9, 2008 |
| 7420810 |
Base heat spreader with fins |
Sep. 2, 2008 |
| 7420273 |
Thinned die integrated circuit package |
Sep. 2, 2008 |
| 7417299 |
Direct connection multi-chip semiconductor element structure |
Aug. 26, 2008 |
| 7417198 |
Radiofrequency power semiconductor module with cavity housing, and method for producing it |
Aug. 26, 2008 |
| 7414311 |
Ball grid array housing having a cooling foil |
Aug. 19, 2008 |
| 7405933 |
Cooling device, substrate, and electronic equipment |
Jul. 29, 2008 |
| 7403395 |
Power module structure and solid state relay using same |
Jul. 22, 2008 |
| 7402911 |
Multi-chip device and method for producing a multi-chip device |
Jul. 22, 2008 |
| 7402906 |
Enhanced die-down ball grid array and method for making the same |
Jul. 22, 2008 |
| 7394659 |
Apparatus and methods for cooling semiconductor integrated circuit package structures |
Jul. 1, 2008 |
| 7394657 |
Method of obtaining enhanced localized thermal interface regions by particle stacking |
Jul. 1, 2008 |
| 7391067 |
Hybrid microwave integrated circuit |
Jun. 24, 2008 |
| 7388746 |
Heatsink assembly |
Jun. 17, 2008 |
| 7388286 |
Semiconductor package having enhanced heat dissipation and method of fabricating the same |
Jun. 17, 2008 |
| 7385821 |
Cooling method for ICS |
Jun. 10, 2008 |
| 7382047 |
Heat dissipation device |
Jun. 3, 2008 |
| 7378732 |
Semiconductor package |
May. 27, 2008 |
| 7378730 |
Thermal interconnect systems methods of production and uses thereof |
May. 27, 2008 |
| 7372148 |
Semiconductor chip having coolant path, semiconductor package and package cooling system using the same |
May. 13, 2008 |
| 7369411 |
Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink |
May. 6, 2008 |
| 7369377 |
Snubbers for low temperature power electronics |
May. 6, 2008 |
| 7365425 |
Heat radiation structure of semiconductor element and heat sink |
Apr. 29, 2008 |
| 7365422 |
Package of leadframe with heatsinks |
Apr. 29, 2008 |
| 7362583 |
Thermal management device for multiple heat producing devices |
Apr. 22, 2008 |
| 7361986 |
Heat stud for stacked chip package |
Apr. 22, 2008 |
| 7361985 |
Thermally enhanced molded package for semiconductors |
Apr. 22, 2008 |
| 7358606 |
Apparatus to compensate for stress between heat spreader and thermal interface material |
Apr. 15, 2008 |
| 7355854 |
Apparatus for improved grounding of flange mount field effect transistors to printed wiring boards |
Apr. 8, 2008 |
| 7352063 |
Semiconductor structure that includes a cooling structure formed on a semiconductor surface and method of manufacturing the same |
Apr. 1, 2008 |
| 7352062 |
Integrated circuit package design |
Apr. 1, 2008 |
| 7345885 |
Heat spreader with multiple stacked printed circuit boards |
Mar. 18, 2008 |
| 7345364 |
Structure and method for improved heat conduction for semiconductor devices |
Mar. 18, 2008 |
| 7342307 |
Semiconductor device |
Mar. 11, 2008 |
| 7342306 |
High performance reworkable heatsink and packaging structure with solder release layer |
Mar. 11, 2008 |
| 7335983 |
Carbon nanotube micro-chimney and thermo siphon die-level cooling |
Feb. 26, 2008 |
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