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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Physics
Class Information
Number: 257/713
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > For integrated circuit
Description: Subject matter wherein the solid-state electronic device for which cooling means is provided is an integrated circuit, which is a semiconductor substrate which contains a plurality of active solid-state electronic devices.


Patents under this class:

Patent Number Title Of Patent Date Issued
7619893 Heat spreader for electronic modules Nov. 17, 2009
7615842 Inductor integrated chip Nov. 10, 2009
7612448 Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner Nov. 3, 2009
7608924 Liquid cooled power electronic circuit comprising stacked direct die cooled packages Oct. 27, 2009
7608923 Electronic device with flexible heat spreader Oct. 27, 2009
7608917 Power semiconductor module Oct. 27, 2009
7605465 Semiconductor device for high frequency power amplification Oct. 20, 2009
7602060 Heat spreader in a flip chip package Oct. 13, 2009
7595540 Semiconductor device and method of manufacturing the same Sep. 29, 2009
7593228 Technique for forming a thermally conductive interface with patterned metal foil Sep. 22, 2009
7592697 Microelectronic package and method of cooling same Sep. 22, 2009
7592696 Power module having at least two substrates Sep. 22, 2009
7592695 Compound heat sink Sep. 22, 2009
7589971 Reconfigurable heat sink assembly Sep. 15, 2009
7589417 Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same Sep. 15, 2009
7586180 Semiconductor packaging device comprising a semiconductor chip including a MOSFET Sep. 8, 2009
7586126 Light emitting diode lighting module with improved heat dissipation structure Sep. 8, 2009
7582964 Semiconductor package having non-ceramic based window frame Sep. 1, 2009
7582959 Driver module structure with flexible circuit board Sep. 1, 2009
7579687 Circuit module turbulence enhancement systems and methods Aug. 25, 2009
7579682 Power semiconductor module Aug. 25, 2009
7573131 Die-up integrated circuit package with grounded stiffener Aug. 11, 2009
7569931 Cooling semiconductor device and manufacturing method thereof Aug. 4, 2009
7569928 Assembly structure of electronic element and heat sink Aug. 4, 2009
7569920 Electronic component having at least one vertical semiconductor power transistor Aug. 4, 2009
7564129 Power semiconductor module, and power semiconductor device having the module mounted therein Jul. 21, 2009
7564128 Fully testable surface mount die package configured for two-sided cooling Jul. 21, 2009
7564124 Semiconductor die package including stacked dice and heat sink structures Jul. 21, 2009
7560812 Cooling module against ESD and electronic package, assembly and system using the same Jul. 14, 2009
7554194 Thermally enhanced semiconductor package Jun. 30, 2009
7554193 Semiconductor device Jun. 30, 2009
7554192 Semiconductor device having filler with thermal conductive particles Jun. 30, 2009
7554179 Multi-leadframe semiconductor package and method of manufacture Jun. 30, 2009
7551437 Cooling mechanism for circuit board Jun. 23, 2009
7550847 Packaged microelectronic devices and methods for packaging microelectronic devices Jun. 23, 2009
7549790 Measuring apparatus for thermal resistance of heat dissipating device Jun. 23, 2009
7546943 Apparatus, system, and method for positioning a printed circuit board component Jun. 16, 2009
7545647 Compliant thermal interface structure utilizing spring elements Jun. 9, 2009
7545032 Integrated circuit package system with stiffener Jun. 9, 2009
7541670 Semiconductor device having terminals Jun. 2, 2009
7541669 Semiconductor device package with base features to reduce leakage Jun. 2, 2009
7538427 Microchannel structure and manufacturing method therefor, light source device, and projector May. 26, 2009
7538423 Heat sink, electronic device, method of manufacturing heat sink, and method of manufacturing electronic device May. 26, 2009
7538422 Integrated circuit micro-cooler having multi-layers of tubes of a CNT array May. 26, 2009
7535727 Light source module May. 19, 2009
7535714 Apparatus and method providing metallic thermal interface between metal capped module and heat sink May. 19, 2009
7535099 Sintered metallic thermal interface materials for microelectronic cooling assemblies May. 19, 2009
7535098 Structure of substrate May. 19, 2009
7535085 Semiconductor package having improved adhesiveness and ground bonding May. 19, 2009
7532480 Power delivery for electronic assemblies May. 12, 2009



 
 
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