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Class Information
Number: 257/713
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents > For integrated circuit
Description: Subject matter wherein the solid-state electronic device for which cooling means is provided is an integrated circuit, which is a semiconductor substrate which contains a plurality of active solid-state electronic devices.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619893 |
Heat spreader for electronic modules |
Nov. 17, 2009 |
| 7615842 |
Inductor integrated chip |
Nov. 10, 2009 |
| 7612448 |
Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner |
Nov. 3, 2009 |
| 7608924 |
Liquid cooled power electronic circuit comprising stacked direct die cooled packages |
Oct. 27, 2009 |
| 7608923 |
Electronic device with flexible heat spreader |
Oct. 27, 2009 |
| 7608917 |
Power semiconductor module |
Oct. 27, 2009 |
| 7605465 |
Semiconductor device for high frequency power amplification |
Oct. 20, 2009 |
| 7602060 |
Heat spreader in a flip chip package |
Oct. 13, 2009 |
| 7595540 |
Semiconductor device and method of manufacturing the same |
Sep. 29, 2009 |
| 7593228 |
Technique for forming a thermally conductive interface with patterned metal foil |
Sep. 22, 2009 |
| 7592697 |
Microelectronic package and method of cooling same |
Sep. 22, 2009 |
| 7592696 |
Power module having at least two substrates |
Sep. 22, 2009 |
| 7592695 |
Compound heat sink |
Sep. 22, 2009 |
| 7589971 |
Reconfigurable heat sink assembly |
Sep. 15, 2009 |
| 7589417 |
Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same |
Sep. 15, 2009 |
| 7586180 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET |
Sep. 8, 2009 |
| 7586126 |
Light emitting diode lighting module with improved heat dissipation structure |
Sep. 8, 2009 |
| 7582964 |
Semiconductor package having non-ceramic based window frame |
Sep. 1, 2009 |
| 7582959 |
Driver module structure with flexible circuit board |
Sep. 1, 2009 |
| 7579687 |
Circuit module turbulence enhancement systems and methods |
Aug. 25, 2009 |
| 7579682 |
Power semiconductor module |
Aug. 25, 2009 |
| 7573131 |
Die-up integrated circuit package with grounded stiffener |
Aug. 11, 2009 |
| 7569931 |
Cooling semiconductor device and manufacturing method thereof |
Aug. 4, 2009 |
| 7569928 |
Assembly structure of electronic element and heat sink |
Aug. 4, 2009 |
| 7569920 |
Electronic component having at least one vertical semiconductor power transistor |
Aug. 4, 2009 |
| 7564129 |
Power semiconductor module, and power semiconductor device having the module mounted therein |
Jul. 21, 2009 |
| 7564128 |
Fully testable surface mount die package configured for two-sided cooling |
Jul. 21, 2009 |
| 7564124 |
Semiconductor die package including stacked dice and heat sink structures |
Jul. 21, 2009 |
| 7560812 |
Cooling module against ESD and electronic package, assembly and system using the same |
Jul. 14, 2009 |
| 7554194 |
Thermally enhanced semiconductor package |
Jun. 30, 2009 |
| 7554193 |
Semiconductor device |
Jun. 30, 2009 |
| 7554192 |
Semiconductor device having filler with thermal conductive particles |
Jun. 30, 2009 |
| 7554179 |
Multi-leadframe semiconductor package and method of manufacture |
Jun. 30, 2009 |
| 7551437 |
Cooling mechanism for circuit board |
Jun. 23, 2009 |
| 7550847 |
Packaged microelectronic devices and methods for packaging microelectronic devices |
Jun. 23, 2009 |
| 7549790 |
Measuring apparatus for thermal resistance of heat dissipating device |
Jun. 23, 2009 |
| 7546943 |
Apparatus, system, and method for positioning a printed circuit board component |
Jun. 16, 2009 |
| 7545647 |
Compliant thermal interface structure utilizing spring elements |
Jun. 9, 2009 |
| 7545032 |
Integrated circuit package system with stiffener |
Jun. 9, 2009 |
| 7541670 |
Semiconductor device having terminals |
Jun. 2, 2009 |
| 7541669 |
Semiconductor device package with base features to reduce leakage |
Jun. 2, 2009 |
| 7538427 |
Microchannel structure and manufacturing method therefor, light source device, and projector |
May. 26, 2009 |
| 7538423 |
Heat sink, electronic device, method of manufacturing heat sink, and method of manufacturing electronic device |
May. 26, 2009 |
| 7538422 |
Integrated circuit micro-cooler having multi-layers of tubes of a CNT array |
May. 26, 2009 |
| 7535727 |
Light source module |
May. 19, 2009 |
| 7535714 |
Apparatus and method providing metallic thermal interface between metal capped module and heat sink |
May. 19, 2009 |
| 7535099 |
Sintered metallic thermal interface materials for microelectronic cooling assemblies |
May. 19, 2009 |
| 7535098 |
Structure of substrate |
May. 19, 2009 |
| 7535085 |
Semiconductor package having improved adhesiveness and ground bonding |
May. 19, 2009 |
| 7532480 |
Power delivery for electronic assemblies |
May. 12, 2009 |
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