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Class Information
Number: 257/712
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents
Description: Subject matter wherein means for cooling the housing or its contents are provided in addition to natural cooling processes.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7456052 |
Thermal intermediate apparatus, systems, and methods |
Nov. 25, 2008 |
| 7453093 |
LED package and fabricating method thereof |
Nov. 18, 2008 |
| 7450389 |
Sub-assembly |
Nov. 11, 2008 |
| 7449775 |
Integrated thermal solution for electronic packages with materials having mismatched coefficient of thermal expansion |
Nov. 11, 2008 |
| 7449774 |
Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same |
Nov. 11, 2008 |
| 7449726 |
Power semiconductor apparatus |
Nov. 11, 2008 |
| 7447033 |
Embedded thermal-electric cooling modules for surface spreading of heat |
Nov. 4, 2008 |
| 7447032 |
Heat spreader module and method of manufacturing same |
Nov. 4, 2008 |
| 7446417 |
Semiconductor integrated circuit device and fabrication method thereof |
Nov. 4, 2008 |
| 7446412 |
Heat sink design using clad metal |
Nov. 4, 2008 |
| 7445966 |
Method and structure for charge dissipation during fabrication of integrated circuits and isolation thereof |
Nov. 4, 2008 |
| 7443025 |
Thermally improved placement of power-dissipating components onto a circuit board |
Oct. 28, 2008 |
| 7439614 |
Circuit device with dummy elements |
Oct. 21, 2008 |
| 7436077 |
Semiconductor device and method of manufacturing the same |
Oct. 14, 2008 |
| 7436059 |
Thermoelectric cooling device arrays |
Oct. 14, 2008 |
| 7433191 |
Thermal contact arrangement |
Oct. 7, 2008 |
| 7429792 |
Stack package with vertically formed heat sink |
Sep. 30, 2008 |
| 7429791 |
Semiconductor device in a resin sealed package with a radiating plate and manufacturing method thereof |
Sep. 30, 2008 |
| 7427148 |
Light modules |
Sep. 23, 2008 |
| 7425762 |
Electronic apparatus |
Sep. 16, 2008 |
| 7423879 |
Sleeve-tightening heat dissipating module |
Sep. 9, 2008 |
| 7421780 |
Methods for fabricating thermal management systems for micro-components |
Sep. 9, 2008 |
| 7420273 |
Thinned die integrated circuit package |
Sep. 2, 2008 |
| 7417313 |
Method for manufacturing an adhesive substrate with a die-cavity sidewall |
Aug. 26, 2008 |
| 7414305 |
Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices |
Aug. 19, 2008 |
| 7411290 |
Integrated circuit chip and method for cooling an integrated circuit chip |
Aug. 12, 2008 |
| 7405448 |
Semiconductor device having a resistance for equalizing the current distribution |
Jul. 29, 2008 |
| 7403395 |
Power module structure and solid state relay using same |
Jul. 22, 2008 |
| 7402906 |
Enhanced die-down ball grid array and method for making the same |
Jul. 22, 2008 |
| 7400035 |
Semiconductor device having multilayer printed wiring board |
Jul. 15, 2008 |
| 7400029 |
LED illumination system |
Jul. 15, 2008 |
| 7391616 |
Plasma display device |
Jun. 24, 2008 |
| 7391612 |
Dual impeller push-pull axial fan sink |
Jun. 24, 2008 |
| 7391067 |
Hybrid microwave integrated circuit |
Jun. 24, 2008 |
| 7388746 |
Heatsink assembly |
Jun. 17, 2008 |
| 7388286 |
Semiconductor package having enhanced heat dissipation and method of fabricating the same |
Jun. 17, 2008 |
| 7385816 |
Dual impeller push-pull axial fan heat sink |
Jun. 10, 2008 |
| 7385815 |
Dual impeller push-pull axial fan |
Jun. 10, 2008 |
| 7385285 |
Light assembly |
Jun. 10, 2008 |
| 7382047 |
Heat dissipation device |
Jun. 3, 2008 |
| 7382000 |
Semiconductor device |
Jun. 3, 2008 |
| 7378732 |
Semiconductor package |
May. 27, 2008 |
| 7378730 |
Thermal interconnect systems methods of production and uses thereof |
May. 27, 2008 |
| 7375970 |
High density memory module using stacked printed circuit boards |
May. 20, 2008 |
| 7372132 |
Resin encapsulated semiconductor device and the production method |
May. 13, 2008 |
| 7369411 |
Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink |
May. 6, 2008 |
| 7365990 |
Circuit board arrangement including heat dissipater |
Apr. 29, 2008 |
| 7365425 |
Heat radiation structure of semiconductor element and heat sink |
Apr. 29, 2008 |
| 7365422 |
Package of leadframe with heatsinks |
Apr. 29, 2008 |
| 7361986 |
Heat stud for stacked chip package |
Apr. 22, 2008 |
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