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Class Information
Number: 257/712
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents
Description: Subject matter wherein means for cooling the housing or its contents are provided in addition to natural cooling processes.

Sub-classes under this class:

Class Number Class Name Patents
257/713 For integrated circuit 1,649
257/720 Heat dissipating element has high thermal conductivity insert (e.g., copper slug in aluminum heat sink) 746
257/718 Heat dissipating element held in place by clamping or spring means 1,032
257/717 Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer) 802
257/714 Liquid coolant 1,045
257/721 With gas coolant 202

Patents under this class:

Patent Number Title Of Patent Date Issued
8710526 Thermal conductivity and phase transition heat transfer mechanism including optical element to be cooled by heat transfer of the mechanism Apr. 29, 2014
8704362 Resin-diamagnetic material composite structure Apr. 22, 2014
8686558 Thermally and electrically enhanced ball grid array package Apr. 1, 2014
8686557 Illumination device comprising a light-emitting diode Apr. 1, 2014
8686277 Microelectronic assembly including built-in thermoelectric cooler and method of fabricating same Apr. 1, 2014
8681493 Heat shield module for substrate-like metrology device Mar. 25, 2014
8680672 Semiconductor package with sleeve member and fan wheel for heat dissipation Mar. 25, 2014
8680666 Bond wireless power module with double-sided single device cooling and immersion bath cooling Mar. 25, 2014
8675365 System and method for managing cooling airflow for a multiprocessor information handling system Mar. 18, 2014
8674499 Heat radiation component and semiconductor package including same Mar. 18, 2014
8673691 Method for manufacturing a semiconductor device Mar. 18, 2014
8672517 Light-emitting module Mar. 18, 2014
8664764 Semiconductor device including a core substrate and a semiconductor element Mar. 4, 2014
8664758 Semiconductor package having reliable electrical connection and assembling method Mar. 4, 2014
8659160 Die structure, manufacturing method and substrate thereof Feb. 25, 2014
8659147 Power semiconductor circuit device and method for manufacturing the same Feb. 25, 2014
8659146 Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing Feb. 25, 2014
8648460 Thermal interface material with epoxidized nutshell oil Feb. 11, 2014
8641243 LED retrofit luminaire Feb. 4, 2014
8637979 Semiconductor device Jan. 28, 2014
8634195 Heatsink with substance embedded to suppress electromagnetic interference Jan. 21, 2014
8633060 Semiconductor device production method and semiconductor device Jan. 21, 2014
8629554 Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly Jan. 14, 2014
8624389 Light emitting diode module Jan. 7, 2014
8624388 Package carrier and manufacturing method thereof Jan. 7, 2014
8622582 Power surface mount light emitting die package Jan. 7, 2014
8619428 Electronic package structure Dec. 31, 2013
8614505 Semiconductor device with heat spreader Dec. 24, 2013
8610262 Ball grid array package with improved thermal characteristics Dec. 17, 2013
8610255 Light emitting device package Dec. 17, 2013
8604606 Heat sink package Dec. 10, 2013
8598702 Semiconductor package Dec. 3, 2013
8592972 Thermally conductive device with a thermal interface material Nov. 26, 2013
8592971 Direct semiconductor contact ebullient cooling package Nov. 26, 2013
8587115 Heat dissipation substrate and manufacturing method thereof Nov. 19, 2013
8587110 Semiconductor module having a semiconductor chip stack and method Nov. 19, 2013
8586857 Combined diode, lead assembly incorporating an expansion joint Nov. 19, 2013
8581392 Silicon based microchannel cooling and electrical package Nov. 12, 2013
8575769 Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation Nov. 5, 2013
8575756 Power package module with low and high power chips and method for fabricating the same Nov. 5, 2013
8575746 Chip on flexible printed circuit type semiconductor package Nov. 5, 2013
8575625 Semiconductor element mounting member, method of producing the same, and semiconductor device Nov. 5, 2013
8570745 Electrical connector assembly Oct. 29, 2013
8564955 Coupling heat sink to integrated circuit chip with thermal interface material Oct. 22, 2013
8564124 Semiconductor package Oct. 22, 2013
8564114 Semiconductor package thermal tape window frame for heat sink attachment Oct. 22, 2013
8564112 Semiconductor device Oct. 22, 2013
8558946 PCB and camera module having the same Oct. 15, 2013
8558394 Chip stack structure and manufacturing method thereof Oct. 15, 2013
8558374 Electronic package with thermal interposer and method of making same Oct. 15, 2013

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