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Class Information
Number: 257/712
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With provision for cooling the housing or its contents
Description: Subject matter wherein means for cooling the housing or its contents are provided in addition to natural cooling processes.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619308 |
Multi-lid semiconductor package |
Nov. 17, 2009 |
| 7615862 |
Heat dissipating package structure and method for fabricating the same |
Nov. 10, 2009 |
| 7612448 |
Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner |
Nov. 3, 2009 |
| 7612447 |
Semiconductor devices with layers having extended perimeters for improved cooling and methods for cooling semiconductor devices |
Nov. 3, 2009 |
| 7612437 |
Thermally enhanced single inline package (SIP) |
Nov. 3, 2009 |
| 7612370 |
Thermal interface |
Nov. 3, 2009 |
| 7609732 |
Method for controlling a temperature of a thermo-electric cooler and a temperature controller using the same |
Oct. 27, 2009 |
| 7608924 |
Liquid cooled power electronic circuit comprising stacked direct die cooled packages |
Oct. 27, 2009 |
| 7608923 |
Electronic device with flexible heat spreader |
Oct. 27, 2009 |
| 7608918 |
Semiconductor device |
Oct. 27, 2009 |
| 7608917 |
Power semiconductor module |
Oct. 27, 2009 |
| 7606038 |
Method for producing a printed circuit board with a heat radiating structure and a printed circuit board with a heat radiating structure |
Oct. 20, 2009 |
| 7606034 |
Thermally enhanced memory module |
Oct. 20, 2009 |
| 7602060 |
Heat spreader in a flip chip package |
Oct. 13, 2009 |
| 7599414 |
Laser device |
Oct. 6, 2009 |
| 7599187 |
Semiconductor module and heat radiating plate |
Oct. 6, 2009 |
| 7598603 |
Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink |
Oct. 6, 2009 |
| 7598535 |
Light-emitting diode assembly and method of fabrication |
Oct. 6, 2009 |
| 7592697 |
Microelectronic package and method of cooling same |
Sep. 22, 2009 |
| 7592695 |
Compound heat sink |
Sep. 22, 2009 |
| 7589971 |
Reconfigurable heat sink assembly |
Sep. 15, 2009 |
| 7589407 |
Semiconductor multipackage module including tape substrate land grid array package stacked over ball grid array package |
Sep. 15, 2009 |
| 7589379 |
Power semiconductor and method of fabrication |
Sep. 15, 2009 |
| 7589356 |
LED and attachment structure of LED |
Sep. 15, 2009 |
| 7586191 |
Integrated circuit apparatus with heat spreader |
Sep. 8, 2009 |
| 7586125 |
Light emitting diode package structure and fabricating method thereof |
Sep. 8, 2009 |
| 7582964 |
Semiconductor package having non-ceramic based window frame |
Sep. 1, 2009 |
| 7582959 |
Driver module structure with flexible circuit board |
Sep. 1, 2009 |
| 7579688 |
Heat radiation structure of semiconductor device, and manufacturing method thereof |
Aug. 25, 2009 |
| 7579626 |
Silicon carbide layer on diamond substrate for supporting group III nitride heterostructure device |
Aug. 25, 2009 |
| 7576432 |
Using external radiators with electroosmotic pumps for cooling integrated circuits |
Aug. 18, 2009 |
| 7576428 |
Melting temperature adjustable metal thermal interface materials and application thereof |
Aug. 18, 2009 |
| 7573717 |
Cycling LED heat spreader |
Aug. 11, 2009 |
| 7569930 |
Semiconductor module and radiator plate |
Aug. 4, 2009 |
| 7567599 |
Semiconductor laser diode device with thermal conductive encapsulating resin and method for manufacturing the same |
Jul. 28, 2009 |
| 7566590 |
Low voltage drop and high thermal performance ball grid array package |
Jul. 28, 2009 |
| 7564129 |
Power semiconductor module, and power semiconductor device having the module mounted therein |
Jul. 21, 2009 |
| 7561436 |
Circuit assembly with surface-mount IC package and heat sink |
Jul. 14, 2009 |
| 7561429 |
Power converter unit |
Jul. 14, 2009 |
| 7557442 |
Power semiconductor arrangement |
Jul. 7, 2009 |
| 7554192 |
Semiconductor device having filler with thermal conductive particles |
Jun. 30, 2009 |
| 7554179 |
Multi-leadframe semiconductor package and method of manufacture |
Jun. 30, 2009 |
| 7550840 |
Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof |
Jun. 23, 2009 |
| 7550777 |
Light emitting device including adhesion layer |
Jun. 23, 2009 |
| 7549773 |
LED housing |
Jun. 23, 2009 |
| 7547582 |
Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies |
Jun. 16, 2009 |
| 7546943 |
Apparatus, system, and method for positioning a printed circuit board component |
Jun. 16, 2009 |
| 7541669 |
Semiconductor device package with base features to reduce leakage |
Jun. 2, 2009 |
| 7541644 |
Semiconductor device with effective heat-radiation |
Jun. 2, 2009 |
| 7538426 |
Cooling system of power semiconductor module |
May. 26, 2009 |
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